公开(公告)号：EP2715778A1

公开(公告)日：2014-04-09

申请号：EP12788925.1

申请日：2012-05-23

申请人： National University of Singapore

发明人： CHUA, Lay-Lay ,  HO, Peter ,  PNG, Rui-Qi ,  KAM, Fong, Yu ,  SONG, Jie ,  WONG, Loke-Yuen ,  ZHUO, Jing-Mei ,  LOH, Kian, Ping ,  LIM, Geok-Kieng

IPC分类号： H01L21/00 ,  B32B7/00 ,  B32B27/00

CPC分类号： B32B37/025 ,  H01L21/2007 ,  Y10T428/30

摘要： The present invention discloses a method for transferring a thin film from a first substrate to a second substrate comprising the steps of: providing a transfer structure and a thin film provided on a surface of a first substrate, the transfer structure comprising a support layer and a film contact layer, wherein the transfer structure contacts the thin film; removing the first substrate to obtain the transfer structure with the thin film in contact with the film contact layer; contacting the transfer structure obtained with a surface of a second substrate; and removing the film contact layer, thereby transferring the thin film onto the surface of the second substrate.