METHOD OF MOLDING A PIEZOELECTRIC PILLAR DEVICE

    公开(公告)号:EP4216294A1

    公开(公告)日:2023-07-26

    申请号:EP22153169.2

    申请日:2022-01-25

    IPC分类号: H01L41/193 H01L41/333

    摘要: A piezoelectric device (100) is manufactured using a substrate (20) with a piezoelectric moldable layer (10). A stamp (30) comprises a repeating pattern of unit cells (30u) formed by a grid of interconnected sidewalls (32) separating respective apertures (31). A molding process comprises pushing (F) the stamp (30) into the moldable layer (10). This causes the piezoelectric material (M) to be pushed into the respective apertures (31) and form an array of pillars (11). In the stamp, the fraction of open area (A31), formed by a respective aperture (31), is more than the fraction of solid area (A32), formed by the surrounding sidewalls (32). In the resulting pillar structure the fraction of active area (A11), formed by the pillars (11) is more than the fraction of inactive area (A12) between the pillars (11). The stamp (30) can be adapted to improve structural integrity while using relatively thin sidewalls (32).