公开(公告)号：EP3255667A1

公开(公告)日：2017-12-13

申请号：EP17165110.2

申请日：2017-04-05

申请人： Nexperia B.V.

发明人： Tik Yeung, Shun ,  v Umali, Pompeo ,  Leung, Chi Ho ,  Lam, Kan Wae ,  Funke, Hans-Juergen ,  Yip, Shu-Ming

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/367 ,  H01L23/373 ,  H01L23/49562 ,  H01L24/00 ,  H05K1/0204 ,  H05K1/0207 ,  H05K1/0209 ,  H05K7/10 ,  H05K7/209

摘要： A semiconductor device includes a semiconductor die having a first side having a first terminal and an opposite second side having at least two second terminals. A lead frame has a first part and a second part. The second part of the lead frame is both electrically and mechanically spaced from the first part. The second side of the die is attached to the lead frame such that the first and second lead frame parts are respectively connected to the at least two second terminals. The first and second lead frame parts include respective first and second extensions that project past a side of the die and provide first and second terminal surfaces that are co-planar with the first terminal on the first side of the die. The device makes use of the terminals on the both sides of the die. The device second side is exposed for thermal performance.

摘要翻译： 一种半导体器件包括具有第一侧和第二侧的半导体管芯，所述第一侧具有第一端子，所述第二侧具有至少两个第二端子。 引线框架具有第一部分和第二部分。 引线框架的第二部分与第一部分电气和机械间隔开。 管芯的第二侧连接到引线框架，使得第一和第二引线框架部分分别连接到至少两个第二端子。 第一引线框架部分和第二引线框架部分包括相应的第一延伸部分和第二延伸部分，该第一延伸部分和第二延伸部分突出经过管芯的一侧并且提供与管芯的第一侧上的第一端子共面的第一端子表面和第二端子表面 该设备利用芯片两侧的端子。 器件的第二面暴露于热性能。