公开(公告)号：EP4391029A1

公开(公告)日：2024-06-26

申请号：EP23216781.7

申请日：2023-12-14

申请人： NXP USA, Inc.

发明人： Roberts, Jeffrey Spencer ,  Wang, Lu ,  Santos, Fernando A.

IPC分类号： H01L21/48 ,  H01L23/13 ,  H01L23/36 ,  H01L23/367 ,  H01L23/433 ,  H01L23/538 ,  H01L23/66 ,  H03F1/02 ,  H03F1/22 ,  H03F1/52 ,  H03F3/195 ,  H05K1/02

CPC分类号： H01L23/66 ,  H01L2223/665520130101 ,  H01L23/3677 ,  H01L23/36 ,  H01L23/13 ,  H01L23/4334 ,  H01L23/5383 ,  H01L23/5385 ,  H03F1/0288 ,  H03F3/195 ,  H05K1/0204 ,  H01L21/4871 ,  H03F3/245 ,  H03F3/211 ,  H01L2223/66520130101

摘要： An amplifier module includes a module substrate with a mounting surface, and a thermal dissipation structure that extends through the module substrate. A ground contact of a power transistor die is coupled to a surface of the thermal dissipation structure. Encapsulant material covers the mounting surface of the module substrate and the power transistor die, and a surface of the encapsulant material defines a contact surface of the amplifier module. A ground terminal is embedded within the encapsulant material. The ground terminal has a proximal end coupled to the thermal dissipation structure, and a distal end exposed at the contact surface. The ground terminal is electrically coupled to the ground contact of the power transistor die through the thermal dissipation structure.

公开(公告)号：EP4383562A1

公开(公告)日：2024-06-12

申请号：EP23212530.2

申请日：2023-11-28

申请人： NXP USA, Inc.

发明人： Hiemstra, Stephen Reza ,  Wang, Lu ,  English, Joshua Bennet

IPC分类号： H03F1/02 ,  H03F3/195 ,  H01L23/66 ,  H01L23/367 ,  H01L23/36 ,  H01L23/433 ,  H05K1/02 ,  H01L23/13 ,  H01L23/538

CPC分类号： H03F1/0288 ,  H03F3/195 ,  H01L23/66 ,  H01L2223/664420130101 ,  H01L23/3677 ,  H01L23/36 ,  H01L23/4334 ,  H05K1/0204 ,  H01L23/13 ,  H01L23/5385 ,  H03F2200/41120130101 ,  H01L2223/665520130101 ,  H01L2223/666120130101 ,  H01L28/00

摘要： A power amplifier module includes a module substrate. First and second heat dissipation structures extend through the module substrate, and each has a first surface exposed at a mounting surface of the module substrate, and a second surface exposed at a bottom surface of the module substrate. The first surfaces of the first and second heat dissipation structures are physically separated by a portion of the mounting surface. First and second amplifier dies are coupled to the first surface of the first heat dissipation structure. The first amplifier die includes a first power transistor that functions as a driver amplifier. The second amplifier die includes a second power transistor that functions as a first final amplifier. The third amplifier die is coupled to the first surface of the second heat dissipation structure, and the third amplifier die includes a third power transistor that functions as a second final amplifier.

公开(公告)号：EP2822369B1

公开(公告)日：2018-09-26

申请号：EP14179125.1

申请日：2009-04-24

申请人： Huawei Technologies Co., Ltd.

发明人： Huang, Mingli ,  Zhang, Shun ,  Yang, Xichen ,  Zhao, Junying ,  Luo, Bing ,  Li, Zhihai ,  Wang, Guoliang

IPC分类号： H05K3/46 ,  H05K1/02

CPC分类号： H05K1/0206 ,  H05K1/0204 ,  H05K3/4611 ,  H05K2201/09309 ,  H05K2201/10416 ,  H05K2203/063 ,  Y10T29/49124

摘要： A multi-layer circuit board, a method of manufacturing the same, and a communication device are provided. As for the multi-layer circuit board, a slot segment is opened on at least one daughter board to form a first daughter board. At least one daughter board and medium layers are stacked together. The daughter boards include first daughter boards. The first daughter boards are placed in such a way that the slot segments of the first daughter boards are communicated. The slot segments are communicated to form a receiving slot. A heat conducting block is placed within the receiving slot. Each medium layer is sandwiched between the daughter boards. The stacked daughter boards, medium layers, and heat conducting block are pressed together, and the pressed daughter boards and heat conducting block are made into a multi-layer circuit board. The heat conducting block is embedded when the circuit board is pressed, thereby simplifying the assembling process of the heat conducting block.

公开(公告)号：EP3345464A1

公开(公告)日：2018-07-11

申请号：EP16757039.9

申请日：2016-08-26

申请人： Lumileds Holding B.V.

发明人： DERIX, Robert

IPC分类号： H05K1/02 ,  H05K1/18

CPC分类号： H01L33/64 ,  G02B6/0023 ,  H05B33/0806 ,  H05K1/0204 ,  H05K1/184 ,  H05K2201/10106 ,  H05K2203/06 ,  H05K2203/063

摘要： An LED device comprises an LED module and a circuit board. The LED module comprises an LED substrate and an LED chip mounted on a mounting surface of the LED substrate. The circuit board comprises a circuit board substrate and a plurality of conductive tracks on a first surface of the circuit board substrate. The LED substrate is embedded in the circuit board substrate. This arrangement provides a thermally efficient, cost efficient and compact LED device.

公开(公告)号：EP3341654A1

公开(公告)日：2018-07-04

申请号：EP16838113.5

申请日：2016-08-26

申请人： Thin Thermal Exchange Pte Ltd ,  Contarino, Aldo

发明人： CONTARINO, Aldo ,  FREIBERG, Michael

IPC分类号： F21V29/00 ,  F21V29/70 ,  F21V29/74 ,  F21V7/00 ,  F21V13/00

CPC分类号： F21V29/70 ,  F21V29/74 ,  F21V29/85 ,  F21V29/89 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/05 ,  H05K1/181 ,  H05K3/06 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/037 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2201/10522 ,  H05K2203/0323 ,  H05K2203/082

摘要： An evacuated core circuit board (10) for dissipating heat from a heat generating electronic component, the evacuated core circuit board comprising: at least one circuit layer (12) to which the heat generating electronic component (14) is electronically coupled; a base layer (16) a comprising a body structure (19) having a substantially hollow interior (20); and a dielectric layer (18) provided between at least a portion of the circuit layer (12) and the base layer (16), wherein the hollow interior (20) is at least partially evacuated.

公开(公告)号：EP3334258A1

公开(公告)日：2018-06-13

申请号：EP17190322.2

申请日：2017-09-11

申请人： KABUSHIKI KAISHA TOSHIBA ,  Toshiba Infrastructure Systems & Solutions Corporation

发明人： Satake, Yoshiaki ,  Tamai, Shinji

IPC分类号： H05K1/02 ,  H05K3/28 ,  H05K7/20 ,  H01L23/552 ,  H05K3/34

CPC分类号： H05K1/0209 ,  H01L23/552 ,  H01L2924/3025 ,  H05K1/0204 ,  H05K1/0233 ,  H05K3/0061 ,  H05K3/281 ,  H05K3/284 ,  H05K3/3415 ,  H05K3/3426 ,  H05K3/429 ,  H05K7/205 ,  H05K2201/0215 ,  H05K2201/066 ,  H05K2201/095 ,  H05K2201/09581 ,  H05K2201/09872 ,  H05K2201/10689 ,  H05K2203/1311 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1438

摘要： A circuit board device of the embodiment includes: a mount board (10) having an electronic component (12) and a printed circuit board (11) having at least one surface where the electronic component is mounted; a heat path (40) arranged to a position facing the mount surface of the mount board, a sheet (30) arranged on the mount surface, and a resin portion (20) arranged between the sheet and the heat path. A cavity (D) surrounded by the sheet and the mount surface is formed in a step portion between the electronic component and the printed circuit board.

公开(公告)号：EP3331330A1

公开(公告)日：2018-06-06

申请号：EP16382586.2

申请日：2016-12-02

申请人： VALEO ILUMINACION

发明人： ROLDAN, Jose-David ,  LARA-CABEZA, Juan ,  SANTAELLA, Juan-Jose ,  PENA, Miguel-Angel ,  ILLAN, Antonio Domingo

IPC分类号： H05K1/02 ,  H05K1/05 ,  H05K3/44 ,  H05K3/40 ,  H05K3/42 ,  H05K1/11

CPC分类号： H05K3/44 ,  H05K1/0204 ,  H05K1/0215 ,  H05K1/05 ,  H05K1/115 ,  H05K3/4053 ,  H05K3/4076 ,  H05K3/42 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2203/081

摘要： Electrical device for a lighting device and method for producing thereof. The electrical device comprises: a printed circuit board comprising at least one electrically insulating layer, a metallic substrate, and an electrically conductive layer defining electrically conductive tracks, the at least one electrically insulating layer being sandwiched between the metallic substrate and the electrically conductive layer; the printed circuit board further comprises a hole at least traversing the at least one electrically insulating layer; and the printed circuit board further comprises an electrically conductive material having at least one part within the hole, the electrically conductive material being adhered to the electrically conductive layer so as to electrically connect at least one of the electrically conductive tracks to the metallic substrate.

公开(公告)号：EP3255667A1

公开(公告)日：2017-12-13

申请号：EP17165110.2

申请日：2017-04-05

申请人： Nexperia B.V.

发明人： Tik Yeung, Shun ,  v Umali, Pompeo ,  Leung, Chi Ho ,  Lam, Kan Wae ,  Funke, Hans-Juergen ,  Yip, Shu-Ming

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/367 ,  H01L23/373 ,  H01L23/49562 ,  H01L24/00 ,  H05K1/0204 ,  H05K1/0207 ,  H05K1/0209 ,  H05K7/10 ,  H05K7/209

摘要： A semiconductor device includes a semiconductor die having a first side having a first terminal and an opposite second side having at least two second terminals. A lead frame has a first part and a second part. The second part of the lead frame is both electrically and mechanically spaced from the first part. The second side of the die is attached to the lead frame such that the first and second lead frame parts are respectively connected to the at least two second terminals. The first and second lead frame parts include respective first and second extensions that project past a side of the die and provide first and second terminal surfaces that are co-planar with the first terminal on the first side of the die. The device makes use of the terminals on the both sides of the die. The device second side is exposed for thermal performance.

摘要翻译： 一种半导体器件包括具有第一侧和第二侧的半导体管芯，所述第一侧具有第一端子，所述第二侧具有至少两个第二端子。 引线框架具有第一部分和第二部分。 引线框架的第二部分与第一部分电气和机械间隔开。 管芯的第二侧连接到引线框架，使得第一和第二引线框架部分分别连接到至少两个第二端子。 第一引线框架部分和第二引线框架部分包括相应的第一延伸部分和第二延伸部分，该第一延伸部分和第二延伸部分突出经过管芯的一侧并且提供与管芯的第一侧上的第一端子共面的第一端子表面和第二端子表面 该设备利用芯片两侧的端子。 器件的第二面暴露于热性能。

公开(公告)号：EP2685797B1

公开(公告)日：2017-12-13

申请号：EP11777176.6

申请日：2011-05-06

申请人： Huawei Device Co., Ltd.

发明人： YANG, Jun ,  ZHOU, Liechun ,  LI, Hualin ,  WU, Xijie

IPC分类号： H05K7/20 ,  H05K9/00 ,  H01L23/552 ,  H01L23/00 ,  H05K1/02

CPC分类号： H05K1/0204 ,  H01L23/552 ,  H01L24/18 ,  H05K1/0216 ,  H05K7/20472 ,  H05K9/003 ,  H05K2201/0715 ,  H05K2201/2018 ,  Y02D70/122 ,  Y10T428/264 ,  Y10T428/30 ,  Y10T428/31504 ,  Y10T428/31678

摘要： A composite material and an electronic device are disclosed in embodiments of the present invention, relating to the field of electronic assembly technologies. The technical problem of the existing electronic device with an excessively complicated internal structure is solved. The composite material includes an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the electrically and thermally conductive layer and the insulating layer are pasted at two sides of the viscose glue layer; and the viscose glue layer is electrically conductive. The electronic device includes a circuit board and the composite material. Gaps are formed at the insulating layer in positions corresponding to electronic components and/or shielding frames, with the viscose glue layer exposed, and the composite material is pasted onto the electronic components and/or the shielding frames via the viscose glue layer. The present invention is applied to simplify the structure of an electronic device.

公开(公告)号：EP2506320A4

公开(公告)日：2017-12-06

申请号：EP10832865

申请日：2010-11-26

申请人： NITTO DENKO CORP

发明人： KITAGAWA DAISUKE ,  TAKAYAMA YOSHINARI ,  SUEHIRO ICHIRO ,  USUI HIDEYUKI ,  ODA TAKASHI

IPC分类号： H05K1/03 ,  H01L23/373 ,  H01L33/60 ,  H01L33/64

CPC分类号： H05K1/0373 ,  C08L27/18 ,  H01L23/3735 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： The LED mounting substrate of the present invention includes a thermally conductive layer (thermally conductive sheet (10)) made of a composition containing boron nitride powder and a fluororesins, and the fluororesin contains polytetrafluoroethylene. The thermally conductive layer has a thermal conductivity of 2 W/(m€¢K) or more. The thermally conductive layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm.