公开(公告)号：EP0947300A3

公开(公告)日：2002-04-24

申请号：EP99106645.7

申请日：1999-03-31

申请人： Nippei Toyama Corporation

发明人： Nishi, Kenichiro c/o Nippei Toyama Corporation ,  Okuyama, Tetsuo c/o Nippei Toyama Corporation ,  Nukui, Mitsuru c/o Nippei Toyama Corporation ,  Nakajima, Kazuo c/o Nippei Toyama Corporation ,  Murai, Shirou c/o Nippei Toyama Corporation ,  Wada, Toyotaka c/o Nippei Toyama Corporation ,  Nakagawa, Tomio c/o Nippei Toyama Corporation

IPC分类号： B28D5/02 ,  B24B7/22 ,  B28D5/00 ,  B24B7/17

CPC分类号： B28D5/0082 ,  B24B1/00 ,  B24B7/17 ,  B24B7/228 ,  B24B41/067 ,  B24B53/02

摘要： A method of slicing an ingot wherein a pre-cut work 3 in which a holding member 2 extending over the entire length of a side surface of a cylindrical ingot 1 is bonded to the side surface of the ingot 1 is set on a slicing apparatus 4, and the pre-cut work 3 is split into a multiplicity of pieces over its longitudinal direction so as to obtain disk-shaped works 5 to be ground, characterized in that a retaining member 2 is used in which a retaining layer 7 which is directly bonded to the side surface of the ingot 1 by a first adhesive agent having an adhesive strength sufficient to receive a rotating force due to a grinding apparatus 6 in a subsequent grinding process, an intermediate layer 8 which is bonded to said retaining layer 7 in a superposed manner by a second adhesive agent whose adhesive strength deteriorates more than that of the first adhesive agent under a fixed condition, and a supporting layer 11 which is connected to said intermediate layer 8 and is connected to a supporting portion 10 of said slicing apparatus 4 are integrally superposed one on top another.