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公开(公告)号：EP1545872A1
公开(公告)日：2005-06-29
申请号：EP03797644.6
申请日：2003-09-18
发明人： Sakamoto, Hiroyuki , Kurosaki, Yoshinobu , Kawanami, Toshitaka , MORICHIKA, Kazuo , SAITO, Takao
CPC分类号： B32B15/08 , B32B7/12 , B32B27/38 , B32B37/1284 , B32B2307/202 , B32B2307/206 , B32B2311/04 , B32B2311/08 , B32B2311/12 , B32B2311/16 , B32B2311/18 , B32B2311/22 , B32B2311/24 , B32B2311/30 , B32B2363/00 , C08L63/00 , C09J5/00 , C09J2463/00 , H05K3/386 , H05K2201/0355 , H05K2203/135 , Y10T428/14
摘要： In view of the above discussed state of the art, it is an object of the present invention to provide a method of producing a laminate excellent in insulation and adhesion strength between a functional material and conductive material sandwiching that, without needing any organic solvent in production thereof, and laminates produced thereby. A method of producing a laminate which comprises the step (1) of forming, on each of two conductive materials, an adhesive resin layer by an electrodeposition step with a cationic electrodepositable adhesive composition comprising a cationic resin composition and the step (2) of joining the adhesive resin layer on each conductive material as obtained in the step (1) to each side of a functional material.
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公开(公告)号：EP1540045A1
公开(公告)日：2005-06-15
申请号：EP03795419.5
申请日：2003-09-12
CPC分类号： H01B13/16 , C09D5/4446 , C25D13/16
摘要： In view of the above-discussed state of the art, it is an object of the present invention to provide a method of coating an electric wire by which insulated wires excellent in dielectric breakdown voltage can be obtained by a relatively short period of dipping of articles to be coated in an electrodeposition bath. A method of coating an electric wire comprising cationic electrocoating with a cationic electrodeposition coating composition, wherein the cationic electrodeposition coating composition contains a resin composition having a hydratable functional group reducible directly by an electron and results in forming passive coat.
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3.发明授权METHOD OF ADHESION OF CONDUCTIVE MATERIALS, LAMINATE, AND ADHESIVE COMPOSITION 有权方法粘结材料LEITFÜHIGEN，层压板和胶水
公开(公告)号：EP1546275B1
公开(公告)日：2007-02-28
申请号：EP03797583.6
申请日：2003-09-12
发明人： SAKAMOTO, Hiroyuki , KUROSAKI, Yoshinobu , KAWANAMI, Toshitaka , MORICHIKA, Kazuo , SAITO, Takao
IPC分类号： C09J5/00 , C09J9/02 , C09J157/00 , C09J163/10 , B32B15/08 , B05D1/04 , B05D7/24
CPC分类号： B32B15/092 , B05D5/10 , B32B7/12 , B32B15/08 , B32B15/18 , B32B15/20 , B32B27/38 , B32B2307/202 , B32B2311/12 , B32B2311/24 , B32B2311/30 , B32B2363/00 , C08L63/00 , C09D5/4442 , C09J5/00 , C09J9/02 , C09J163/00 , C09J2463/00 , C25D13/12 , H05K3/022
摘要： In view of the above-discussed state of the art, it is an object of the present invention to provide a method of adhesion of conductive materials which uses a water-based ecofriendly adhesive and can give uniform adhesive layers capable of leading to constant and high levels of adhesion strength and excellent in insulating properties even in the case of molded articles and the like. A method of adhesion of conductive materials comprising the step (1) of forming an adhesive surface having an adhesive resin layer on a conductive material by an electrodeposition step with an adhesive composition and the step (2) of joining an adherend surface of an adhesion target to the adhesive surface having the adhesive resin layer obtained in the step (1), wherein the adhesive composition comprises a hydratable functional group- and unsaturated bond-containing cationic resin composition.
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4.发明公开METHOD OF ADHESION OF CONDUCTIVE MATERIALS, LAMINATE, AND ADHESIVE COMPOSITION 有权方法粘结材料LEITFÜHIGEN，层压板和胶水
公开(公告)号：EP1546275A1
公开(公告)日：2005-06-29
申请号：EP03797583.6
申请日：2003-09-12
发明人： SAKAMOTO, Hiroyuki , KUROSAKI, Yoshinobu , KAWANAMI, Toshitaka , MORICHIKA, Kazuo , SAITO, Takao
IPC分类号： C09J5/00 , C09J9/02 , C09J157/00 , C09J163/10 , B32B15/08 , B05D1/04 , B05D7/24
CPC分类号： B32B15/092 , B05D5/10 , B32B7/12 , B32B15/08 , B32B15/18 , B32B15/20 , B32B27/38 , B32B2307/202 , B32B2311/12 , B32B2311/24 , B32B2311/30 , B32B2363/00 , C08L63/00 , C09D5/4442 , C09J5/00 , C09J9/02 , C09J163/00 , C09J2463/00 , C25D13/12 , H05K3/022
摘要： In view of the above-discussed state of the art, it is an object of the present invention to provide a method of adhesion of conductive materials which uses a water-based ecofriendly adhesive and can give uniform adhesive layers capable of leading to constant and high levels of adhesion strength and excellent in insulating properties even in the case of molded articles and the like. A method of adhesion of conductive materials comprising the step (1) of forming an adhesive surface having an adhesive resin layer on a conductive material by an electrodeposition step with an adhesive composition and the step (2) of joining an adherend surface of an adhesion target to the adhesive surface having the adhesive resin layer obtained in the step (1), wherein the adhesive composition comprises a hydratable functional group- and unsaturated bond-containing cationic resin composition.
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