公开(公告)号：EP4431017A1

公开(公告)日：2024-09-18

申请号：EP24159193.2

申请日：2024-02-22

Applicant: Lohmann GmbH & Co. KG

Inventor： Lutz, Volker ,  Weisenstein, Christian

IPC: A61B5/259 ,  A61B5/268 ,  A61N1/04 ,  C09J9/02

CPC classification number: A61B5/259 ,  A61B5/268 ,  C09J9/02 ,  A61N1/0496 ,  A61N1/0492 ,  A61N1/0456 ,  A61N1/0452 ,  A61N1/046

Abstract: Die Erfindung geht aus von einer Trockenelektrodenvorrichtung mit zumindest einer elektrisch leitenden Anschlusseinheit und mit einer, insbesondere elektrisch leitenden, Klebstoffschichteinheit, welche eine Kontaktfläche zur Kontaktierung einer Haut aufweist und welche in einem Anwendungszustand eine elektrische Energieübertragung zwischen der Anschlusseinheit und der Haut bereitstellt.
Um eine Konstruktion zu verbessern, wird vorgeschlagen, dass bei einer Draufsicht eine Konturfläche der Anschlusseinheit eine Konturfläche der Kontaktfläche zumindest zu 80 % überlappt.

公开(公告)号：EP4421124A1

公开(公告)日：2024-08-28

申请号：EP22883222.6

申请日：2022-09-01

Applicant: Toyobo Co., Ltd.

Inventor： TAKIMOTO, Naomi ,  IRIE, Michihiko ,  KONDO, Takashi

IPC: C08L75/04 ,  C08G18/65 ,  C08G18/80 ,  C08K3/08 ,  C09J7/30 ,  C09J9/02 ,  C09J175/02 ,  C09J175/04 ,  H01B1/22 ,  H05K3/32

CPC classification number: C08G18/65 ,  C08G18/80 ,  C08K3/08 ,  C08L75/04 ,  C09J7/30 ,  C09J9/02 ,  C09J175/02 ,  C09J175/04 ,  H01B1/22 ,  H05K3/32

Abstract: An object of the present invention is to provide an electroconductive composition capable of preparing a flexible cured product having excellent electroconductivity and adhesiveness at a lower temperature, and an electronic device prepared therefrom.
The present invention relates to an electroconductive composition comprising a polyol, a polyamine, a blocked isocyanate, and electroconductive particles, wherein the polyamine has an active hydrogen equivalent ratio of 80 g/eq to 200 g/eq, the polyamine has an amine value of 150 KOHmg/g to 350 KOHmg/g, and the polyamine has a viscosity of 50 mPa·s to 500 mPa·s at 25 °C.

公开(公告)号：EP4381008A1

公开(公告)日：2024-06-12

申请号：EP22757360.7

申请日：2022-08-02

Applicant: 3M Innovative Properties Company

Inventor： CHOI, Jeongwan ,  MCCUTCHEON, Jeffrey W. ,  KAPLUN, Marina M. ,  YU, Steven Y. ,  KIM, Jinbae

IPC: C08K3/08 ,  C09J7/22 ,  C09J7/28 ,  C09J7/38 ,  C09J9/02 ,  C09J7/29 ,  B32B7/025 ,  B32B15/00

CPC classification number: C09J9/02 ,  C09J2301/12220200801 ,  C09J2301/31420200801 ,  C09J2301/40820200801 ,  C09J7/29 ,  C08K2003/086220130101 ,  C08K2201/00120130101 ,  C08K9/12 ,  C09J2301/4120200801 ,  C09J2203/32620130101 ,  B32B5/022 ,  B32B15/092 ,  B32B27/12 ,  B32B27/18 ,  B32B15/20 ,  B32B2264/105520200801 ,  B32B2307/20220130101 ,  B32B2405/0020130101

公开(公告)号：EP3378914A1

公开(公告)日：2018-09-26

申请号：EP16866452.2

申请日：2016-11-18

Applicant: Sekisui Chemical Co., Ltd.

Inventor： YAMAGAMI, Mai ,  HANEDA, Satoshi ,  WAKIYA, Takeshi ,  YAMADA, Yasuyuki ,  UEDA, Saori ,  SASADAIRA, Masao

IPC: C09J201/00 ,  B22F7/08 ,  B23K35/24 ,  C08F12/36 ,  C08F16/32 ,  C08F30/08 ,  C08F36/08 ,  C09J9/02 ,  C09J11/00 ,  C09J11/08 ,  H01B1/00 ,  H01B1/22 ,  H01B5/00 ,  H01R11/01

CPC classification number: H01B1/22 ,  B22F7/08 ,  B22F2301/10 ,  B22F2301/15 ,  B22F2301/255 ,  B22F2301/30 ,  B22F2304/10 ,  B23K35/025 ,  B23K35/24 ,  B23K35/3613 ,  C08F12/36 ,  C08F16/20 ,  C08F16/32 ,  C08F30/08 ,  C08F36/08 ,  C08G61/02 ,  C08G2261/3142 ,  C08G2261/3321 ,  C09J9/02 ,  C09J11/00 ,  C09J11/08 ,  C09J201/00 ,  H01B1/00 ,  H01B5/00 ,  H01L24/29 ,  H01L2224/29391 ,  H01L2224/29411 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29447 ,  H01L2224/29455 ,  H01L2224/29499 ,  H01L2924/0635 ,  H01L2924/35121 ,  H01R11/01

Abstract: Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part, and can increase the connection strength are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 µm or more and 300 µm or less, the particles have a 10% K value of 30 N/mm 2 or more and 3000 N/mm 2 or less, and the particles have a particle diameter CV value of 10% or less.

公开(公告)号：EP3350118A1

公开(公告)日：2018-07-25

申请号：EP16847234.8

申请日：2016-09-14

Applicant: Lintec Of America, Inc.

Inventor： LIMA, Marcio, D. ,  BYKOVA, Julia

IPC: B82Y30/00 ,  B32B5/22 ,  B32B5/24 ,  B32B5/28 ,  B29C70/02 ,  B29C70/18 ,  B29C70/34

CPC classification number: C08K3/041 ,  B32B5/02 ,  B32B5/12 ,  B32B7/06 ,  B32B7/12 ,  B32B9/007 ,  B32B9/043 ,  B32B15/14 ,  B32B17/10788 ,  B32B17/10889 ,  B32B27/30 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/202 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2311/18 ,  B82Y40/00 ,  C08J5/042 ,  C08J5/18 ,  C08J7/047 ,  C08J2383/04 ,  C08J2483/04 ,  C08K3/04 ,  C08K3/042 ,  C08K3/045 ,  C08K3/08 ,  C08K7/06 ,  C08K2003/0831 ,  C08K2003/0881 ,  C08K2201/011 ,  C08L23/0853 ,  C08L29/14 ,  C09J7/22 ,  C09J7/38 ,  C09J9/02 ,  C09J201/02 ,  C09J2201/16 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2205/10 ,  C09J2205/102

Abstract: A flexible sheet comprising a composite sheet, the composite sheet comprising a binder and an aggregate containing a plurality of carbon nanotubes that is disposed in the binder, wherein the aggregate is formed as a waveform structure travelling along a single direction in a plane of the composite sheet, is provided. The disclosed flexible sheets may be used as thermally conductive components, electrically conductive components, antistatic components, electromagnetic wave shields, and/or heating elements, in addition to other possible uses.

公开(公告)号：EP3333856A1

公开(公告)日：2018-06-13

申请号：EP16832802.9

申请日：2016-07-22

Applicant: Furukawa Electric Co., Ltd.

Inventor： MIHARA, Naoaki ,  KIRIKAE, Noriyuki ,  SUGIYAMA, Jirou

IPC: H01B1/22 ,  C09J7/02 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J179/04 ,  C09J201/00 ,  H01L21/52

CPC classification number: C09J9/02 ,  C08G73/1082 ,  C08G73/128 ,  C08K3/08 ,  C08K3/10 ,  C08K5/372 ,  C08K5/375 ,  C08K5/45 ,  C08K2003/085 ,  C08K2003/0862 ,  C08K2201/001 ,  C09J7/10 ,  C09J7/35 ,  C09J11/02 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J179/08 ,  C09J179/085 ,  C09J201/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/08 ,  H01B1/22 ,  H01L21/52 ,  H01L21/6836 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/6839 ,  H01L2224/04026 ,  H01L2224/05644 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/29209 ,  H01L2224/29211 ,  H01L2224/29218 ,  H01L2224/29224 ,  H01L2224/29239 ,  H01L2224/29244 ,  H01L2224/29247 ,  H01L2224/29255 ,  H01L2224/29266 ,  H01L2224/2929 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/29318 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29366 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2224/83906 ,  H01L2224/92247 ,  H01L2924/0665 ,  H01L2924/0705 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The purpose of the present invention is to provide a means that exhibits excellent heat resistance and mounting reliability when bonding a semiconductor power element to a metal lead frame, which is also free of lead and thereby places little burden on the environment. Namely, it is an electrically conductive composition, which contains at least a sulfide compound represented by R-S-R' (wherein R is an organic group containing at least carbon; R' is an organic group that is the same as or different from R; and R and R' may be bonded to each other to form a so-called cyclic sulfide) and metal particles containing at least Cu, Sn or Ni as its essential component. Further, a conductive paste and a conductive bonding film, each of which are produced using the electrically conductive composition, as well as a dicing die bonding film, which is obtained by bonding the conductive bonding film with an adhesive tape, are provided.

公开(公告)号：EP3143078A4

公开(公告)日：2018-04-25

申请号：EP15793098

申请日：2015-05-12

Applicant: STORA ENSO OYJ

Inventor： GAROFF NIKLAS ,  WALTER STEPHAN

IPC: C08K3/04 ,  C09J9/02 ,  C09J11/04 ,  D01F9/17 ,  H05K9/00

CPC classification number: C08K3/04 ,  C08K2201/001 ,  C09J9/02 ,  C09J11/04 ,  D01F9/17 ,  H05K9/0083

Abstract: The present invention relates to abase polymer material composition comprising a conductive carbon powder, a method for the manufacturing thereof and use thereof.

公开(公告)号：EP3279262A1

公开(公告)日：2018-02-07

申请号：EP16772710.6

申请日：2016-03-28

Applicant: Namics Corporation

Inventor： YAMAGUCHI, Takashi ,  ABE, Shinichi

IPC: C08L61/34 ,  C08G14/073 ,  C08G59/56 ,  C08G73/00 ,  C08G73/12 ,  C08L63/00 ,  C09J9/02 ,  C09J11/00 ,  C09J161/34 ,  C09J179/04 ,  H01L21/288

CPC classification number: C08G59/4057 ,  C08G59/56 ,  C08G73/00 ,  C08G73/12 ,  C08K5/3155 ,  C08K5/3415 ,  C08L61/34 ,  C08L63/00 ,  C08L79/02 ,  C09J9/02 ,  C09J11/00 ,  C09J161/34 ,  C09J179/04 ,  H01L21/288 ,  C08L79/085

Abstract: There is provided a resin composition having long-term heat resistance and a low change ratio of adhesive strength. The resin composition includes (A) a compound having in its molecule an OH group and any one of primary to tertiary amines, (B) dicyandiamide, and (C) bismaleimides.

Abstract translation: 提供具有长期耐热性和低粘合强度变化率的树脂组合物。 该树脂组合物含有（A）分子内具有OH基和伯〜叔胺中的任一种，（B）双氰胺和（C）双马来酰亚胺的化合物。

公开(公告)号：EP2197782A4

公开(公告)日：2017-11-15

申请号：EP08794128

申请日：2008-09-10

Applicant: SMOLTEK AB

Inventor： KABIR MOHAMMAD SHAFIQUL ,  BRUD ANDRZEJ

IPC: B82B1/00 ,  B82B3/00 ,  C23C16/22 ,  H01L21/285 ,  H01L21/768 ,  H01L23/52 ,  H01L23/538

CPC classification number: B32B37/12 ,  B32B37/06 ,  B32B37/10 ,  B32B37/16 ,  B32B38/0008 ,  B32B2037/1253 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2307/706 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2310/0831 ,  B32B2313/04 ,  B32B2457/00 ,  B82Y10/00 ,  C09J9/02 ,  H01L23/49811 ,  H01L23/49877 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04026 ,  H01L2224/05016 ,  H01L2224/05026 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05184 ,  H01L2224/29006 ,  H01L2224/2929 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/1433 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T428/24174 ,  H01L2224/29101 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An apparatus, comprising two conductive surfaces or layers and a nanostructure assembly bonded to the two conductive surfaces or layers to create electrical or thermal connections between the two conductive surfaces or layers, and a method of making same.

公开(公告)号：EP3236479A1

公开(公告)日：2017-10-25

申请号：EP16166403.2

申请日：2016-04-21

Applicant: Henkel AG & Co. KGaA ,  Henkel IP & Holding GmbH

Inventor： CAI, Jianfen ,  BRIERS, David ,  POOLE, Callum ,  DREEZEN, Gunther ,  CHAPMAN, Anthony ,  STARKEY, Dale R.

IPC: H01B1/22 ,  H05K9/00 ,  C09J9/02

CPC classification number: H01B1/22 ,  C08K9/02 ,  C08K2201/001 ,  C08K2201/003 ,  C09J9/02 ,  C09J177/00

Abstract: The present invention is related to an electrically conductive, hot-melt adhesive or moulding composition, said composition comprising: a) a binding agent which comprises at least one (co)polymer selected from the group consisting of polyamide, thermoplastic polyamide, copolyamide, polyolefins, poly(meth)acrylates, polystyrene, polyurethanes, polyesters, ethylene copolymers, ethylene vinyl copolymers, styrenic block copolymers, polylactic acid, silicones, epoxies and polyols; and, b) a conductive filler comprising particles (p1) which have a mass median diameter (D50) of ≤100 microns and which are selected from the group consisting of flakes, platelets, leaf-like particles, dendritic particles, rods, tubes, fibres, needles and mixtures thereof, wherein said composition has a melt viscosity of from 2500 to 25000 mPa·s as measured at 210°C and is further characterized in that said particles (p1) constitute from 15 to 70 wt.%, by weight of the composition. Preferably, the binding agent comprises at least one (co)polymer selected from the group consisting of polyamide, thermoplastic polyamide and copolyamide.

Abstract translation: 本发明涉及导电的热熔粘合剂或模塑组合物，所述组合物包含：a）粘合剂，其包含至少一种选自聚酰胺，热塑性聚酰胺，共聚酰胺，聚烯烃 ，聚（甲基）丙烯酸酯，聚苯乙烯，聚氨酯，聚酯，乙烯共聚物，乙烯乙烯共聚物，苯乙烯嵌段共聚物，聚乳酸，硅氧烷，环氧树脂和多元醇; 和b）包含颗粒（p1）的导电填料，所述颗粒具有≤100微米的质量中值直径（D50）并且选自薄片，薄片，叶状颗粒，树枝状颗粒，棒，管， 纤维，针和它们的混合物，其中所述组合物具有在210℃下测量的2500至25000mPa·s的熔体粘度，并且其特征还在于所述颗粒（p1）构成15至70重量％ 的组成。 优选地，粘合剂包含至少一种选自聚酰胺，热塑性聚酰胺和共聚酰胺的（共）聚合物。