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公开(公告)号：EP1488972B8
公开(公告)日：2008-10-29
申请号：EP03744044.3
申请日：2003-03-11
发明人： OKAJIMA, Ichiro , WATANABE, Hideki , YAMADA, Kazuo
CPC分类号： H05B3/84 , B23K1/0008 , B23K1/20 , B23K35/262 , B23K2203/12 , B23K2203/16 , B23K2203/18 , B23K2203/54 , H01R4/02 , H01R4/04 , H01R4/62 , H01R4/625 , H01R4/64 , H01R2201/02 , H01R2201/26 , H05B2203/016
摘要： A metal fixture-joined glass article which has on at least part of the surface of the glass article a conductive film formed by baking silver paste containing Ag particles and glass frit, wherein metal-fixture joined surfaces are fixed to the conductive film by an unleaded solder alloy mainly containing Sn, and the unleaded solder alloy contains at least 1.5 mass% of Ag, whereby lowering in the appearance and the joint strength of the conductive film is restricted. When a metal fixture having at least two joined surfaces is used, a total area of joined surfaces is at least 37 mm2 and up to 50 mm2 to provide a high joining strength between the glass article and the metal fixture even if unleaded solder alloy is used. A volume of unleaded solder alloy at each joined surface set to 1.0-2.0 times the product of the applicable joined surface area and a unleaded solder alloy thickness can restrict cracks from occurring in a glass article.
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公开(公告)号：EP1488972B2
公开(公告)日：2015-06-24
申请号：EP03744044.3
申请日：2003-03-11
发明人： OKAJIMA, Ichiro , WATANABE, Hideki , YAMADA, Kazuo
CPC分类号： H05B3/84 , B23K1/0008 , B23K1/20 , B23K35/262 , B23K2203/12 , B23K2203/16 , B23K2203/18 , B23K2203/54 , H01R4/02 , H01R4/04 , H01R4/62 , H01R4/625 , H01R4/64 , H01R2201/02 , H01R2201/26 , H05B2203/016
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