公开(公告)号：EP2743365B1

公开(公告)日：2020-09-16

申请号：EP13779056.4

申请日：2013-04-18

申请人： Nippon Steel Corporation ,  NIPPON STEEL Chemical & Material Co., Ltd.

发明人： ISHIZUKA, Kiyokazu ,  KUBO, Yuji ,  NAKATSUKA, Jun ,  NAGASAKI, Shuji

IPC分类号： C22C38/00 ,  B21B1/40 ,  C21D9/46 ,  C22C38/06 ,  C22C38/14 ,  C25D5/26 ,  C25D5/48 ,  H01M4/66 ,  B32B15/01 ,  C25D5/36 ,  C25D7/06 ,  C22C19/03 ,  C22C38/02 ,  C22C38/04 ,  C22C38/12 ,  C21D8/04

公开(公告)号：EP4342604A1

公开(公告)日：2024-03-27

申请号：EP22804655.3

申请日：2022-05-16

申请人： NIPPON STEEL Chemical & Material Co., Ltd.

发明人： KAWAI, Shouhei ,  UNNO, Hiroto ,  NAKATSUKA, Jun

IPC分类号： B22F9/08 ,  C22C33/02 ,  C22C38/00 ,  C22C38/34 ,  C22C38/58 ,  C23C26/00 ,  B22F3/15 ,  B22F3/17 ,  B22F3/18 ,  B22F3/24

摘要： Stainless steel foil with a flattening film reducing the number of pits present on the stainless steel foil surface and free of cracks occurring at the flattening film, that is, stainless steel foil with a flattening film, comprising the stainless steel foil having a composition comprising stainless steel constituents and having a balance comprised of Fe and impurities, inclusions having particle diameter 2.00 µm or more comprising Al 2 O 3 : 30 mass% or less and MgO: 10 mass% or less with respect to a total mass of the particle diameter 2.00 µm or more inclusions, among the particle diameter 2.00 µm or more inclusions, the number of inclusions having particle diameter more than 5.00 µm present on the surface being 20/cm 2 or less, and having a sheet thickness of 5.0 µm or more and 100.0 µm or less and the flattening film having a film thickness of 0.3 µm or more and 5.0 µm or less on at least one surface of the stainless steel foil.

公开(公告)号：EP4029690A1

公开(公告)日：2022-07-20

申请号：EP20862910.5

申请日：2020-09-10

申请人： NIPPON STEEL Chemical & Material Co., Ltd.

发明人： WANG, Hongyuan ,  NAKATSUKA, Jun ,  IWASAKI, Toshio ,  KAWAI, Shouhei ,  HIRAISHI, Katsufumi

IPC分类号： B32B15/08 ,  B32B15/088 ,  B32B7/025 ,  H05K1/03 ,  H05B33/02 ,  H01L51/50

摘要： A metal-clad laminate for flexible electronic devices, said metal-clad laminate comprising a metal layer and a polyimide insulating layer that is superposed on one surface of the metal layer and contains one or more polyimide layers, wherein the polyimide insulating layer satisfies the following requirements: (a) the thickness thereof is within the range of from 3 µm to 25 µm; (b) the thickness ratio thereof to the metal layer is within the range of from 0.1 to 0.5; (c) the thermal expansion coefficient thereof is 25 ppm/K or less; (d) the coefficient of humidity expansion thereof is 30 ppm/% RH or less; (e) the arithmetic mean roughness (Ra) of the exposed surface, which is not in contact with the metal layer, is 1.0 nm or less; and (f) the polyimide that constitutes the polyimide layer having the exposed surface, which is not in contact with the metal layer, is not thermoplastic.