摘要:
[Problem] To provide an apparatus for bonding separators in electrical devices wherein even if a unit that performs bonding using ultrasound is used in assembly-line equipment, the amount of space taken up by said equipment can be kept small. [Solution] The present invention is an apparatus 100 for bonding separators in electrical devices, which is used to bond a pair of separators 40 to each other so as to sandwich an electrode 20, provided with an oscillator 153 that generates ultrasonic oscillations; a booster 152 that amplifies the generated oscillations; a horn 151 that applies the amplified oscillations to the pair of separators so as to bond said separators to each other; and separator conveyance units 120, 130 that convey the pair of separators to a bonding position where the horn bonds said separators to each other, wherein the oscillator, the booster, and the horn are laid out in a plane that is parallel to the direction X in which the separators are conveyed and perpendicular to the surfaces of the separators, or the oscillator and the booster are laid out closer to the widthwise centers of the separators than the horn is when seen from a direction that is parallel to the direction in which the separators are conveyed.
摘要:
A device 100 for producing a packaged electrode 20 includes: a conveyance unit 200 configured to sequentially overlay the electrode 40 and the pair of separators 30 from a front end 51 side in a conveying direction while conveying the electrode 40 and the pair of separators 30; a first joining chip 302 configured to join lateral edges 31 of the pair of separators together; at least one second joining chip 303 positioned downstream of the first joining chip in the conveying direction and configured to join the lateral edges of the pair of separators together. Front ends of the lateral edges of the pair of separators being sequentially overlaid while being conveyed by the conveyance unit are joined together by the first joining chip positioned upstream before the front ends are conveyed to the second joining chip positioned downstream.
摘要:
The stacking apparatus of the present invention includes a separator conveyance unit to convey a separator of predetermined shape in a held state, an electrode conveyance unit to convey a positive electrode of predetermined shape, and a control unit to synchronize the conveying position and conveyance speed of the separator conveyance unit with those of the electrode conveyance unit so that the separator and positive electrode overlap each other at a predetermined position. The stacking apparatus conveys the separator and positive electrode and transfers the separator onto the electrode from a downstream side of the conveying direction while gradually removing the separator from the separator conveyance unit, thereby stacking the separator on the electrode.
摘要:
A stacking apparatus having a cylindrical conveyance drum holding and rotating to covey a separator and an electrode conveyance unit conveying a positive electrode in a tangential direction of the conveyance drum so that the positive electrode overlaps the separator. To the outer circumferential surface of the conveyance drum, there are defined a suction area for drawing the separator that is non-rotatably positioned on an upstream side of a rotation direction of the conveyance drum with respect to a location to which the positive electrode is conveyed and a non-suction area for removing the separator that is non-rotatably positioned on a downstream side of the rotation direction of the same. The separator in the suction area is conveyed to the non-suction area, is removed from the outer circumferential surface, and is transferred onto the positive electrode, thereby gradually stacking the separator on the positive electrode.
摘要:
[Problem] To provide an apparatus for bonding separators in electrical devices wherein even if a unit that performs bonding using ultrasound is used in assembly-line equipment, the amount of space taken up by said equipment can be kept small. [Solution] The present invention is an apparatus 100 for bonding separators in electrical devices, which is used to bond a pair of separators 40 to each other so as to sandwich an electrode 20, provided with an oscillator 153 that generates ultrasonic oscillations; a booster 152 that amplifies the generated oscillations; a horn 151 that applies the amplified oscillations to the pair of separators so as to bond said separators to each other; and separator conveyance units 120, 130 that convey the pair of separators to a bonding position where the horn bonds said separators to each other, wherein the oscillator, the booster, and the horn are laid out in a plane that is parallel to the direction X in which the separators are conveyed and perpendicular to the surfaces of the separators, or the oscillator and the booster are laid out closer to the widthwise centers of the separators than the horn is when seen from a direction that is parallel to the direction in which the separators are conveyed.