ADHESIVE TREATMENT LIQUID, AND METHOD FOR TREATING ADHESIVE

    公开(公告)号:EP4174123A1

    公开(公告)日:2023-05-03

    申请号:EP21832393.9

    申请日:2021-06-25

    Abstract: Provided are a pressure-sensitive adhesive treatment liquid, which can easily remove various kinds of pressure-sensitive adhesives, and a pressure-sensitive adhesive treatment method by which the various kinds of pressure-sensitive adhesives are easily removed. For example, when a pressure-sensitive adhesive tape including a base material and a pressure-sensitive adhesive is used as a treatment object, there are provided a pressure-sensitive adhesive treatment liquid, which can easily separate the base material and various kinds of pressure-sensitive adhesives from each other, and a pressure-sensitive adhesive treatment method by which the base material and the various kinds of pressure-sensitive adhesives are easily separated from each other. A pressure-sensitive adhesive treatment liquid according to an embodiment of the present invention is a treatment liquid for a pressure-sensitive adhesive, and includes a liquid having a Hansen solubility parameter value of 31 or less, and an alkaline compound. The concentration of the alkaline compound is from 0.001 wt% to 20 wt%.

    ADHESIVE TAPE PROCESSING METHOD AND ADHESIVE TAPE PROCESSING DEVICE

    公开(公告)号:EP4316732A1

    公开(公告)日:2024-02-07

    申请号:EP22780430.9

    申请日:2022-03-23

    Abstract: Provided is a pressure-sensitive adhesive tape processing method capable of easily separating a base material and a pressure-sensitive adhesive for forming a pressure-sensitive adhesive tape from each other at low cost. Furthermore, a pressure-sensitive adhesive tape processing device used for such a pressure-sensitive adhesive tape processing method is provided. The pressure-sensitive adhesive tape processing method according to an embodiment of the present invention is a method for processing a pressure-sensitive adhesive tape including a base material layer and a pressure-sensitive adhesive layer, a storage modulus of the base material layer at 25°C is 2 MPa or more, and the pressure-sensitive adhesive tape processing method includes a step (I) of separating a pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer, from the base material layer, by grinding a surface of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape.

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