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公开(公告)号:EP3463699B1
公开(公告)日:2024-10-09
申请号:EP17726614.5
申请日:2017-05-29
IPC分类号: B08B3/04 , B08B3/08 , B08B3/10 , B08B3/12 , C11D7/50 , C11D11/00 , C23G5/02 , C23G5/024 , C23G5/04 , C23G5/06
CPC分类号: B08B3/048 , B08B3/08 , B08B3/10 , B08B3/12 , C11D7/5004 , C11D7/5013 , C23G5/02 , C23G5/024 , C23G5/04 , C23G5/06 , C23G5/032 , C11D2111/2020240101 , C11D2111/1820240101 , C11D2111/1620240101
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2.
公开(公告)号:EP4413112A1
公开(公告)日:2024-08-14
申请号:EP22800411.5
申请日:2022-10-03
发明人: FRASER, Michael R. , WU, Raymond
IPC分类号: C11D7/50
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公开(公告)号:EP3990587B1
公开(公告)日:2024-05-29
申请号:EP20742375.7
申请日:2020-07-07
IPC分类号: C10L10/06 , C10L1/14 , C10L1/16 , C10L1/182 , C10L1/185 , C10L1/19 , C11D11/00 , C11D7/50 , C11D7/26 , C11D7/24 , C10L10/18 , C10L1/02
CPC分类号: C10L1/02 , C10L2200/025420130101 , C10L2200/041520130101 , C10L2200/045320130101 , C10L2200/04320130101 , C10L2200/0420130101 , C10L10/06 , C10L10/18 , C11D7/24 , C11D7/247 , C11D7/261 , C11D7/264 , C11D7/266 , C11D7/5027 , C10L1/14 , C10L1/1608 , C10L1/1616 , C10L1/19 , C10L1/1824 , C10L1/1857 , C10L2230/08320130101 , C11D2111/2020240101
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公开(公告)号:EP4342971A1
公开(公告)日:2024-03-27
申请号:EP23195215.1
申请日:2023-09-04
发明人: FU, Cheng , GE, Shengyu , GUO, Huijun , ZHAO, Liang
摘要: The present disclosure provides a formula of a remover reagent for a cured silicone sealant and a method using the same. The remover reagent is prepared from an acid catalyst and a solvent each having a high boiling point and a high flash point. The acid catalyst is benzenesulfonic acid or alkylbenzenesulfonic acid. The solvent is mineral oil and/or silicone oil. The cured silicone sealant is first soaked with the remover reagent for 30 to 120 min, and then baked at a high temperature of 80 to 120°C for 10 min or above into debris or powder, whereby the cured silicone sealant with a thickness of 10 mm or above can be removed. Moreover, the remover reagent has the advantages of readily available raw materials, high safety, environmentally friendliness, convenient preparation and good sealant removal effect, and thus, has good application prospects.
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5.
公开(公告)号:EP4282945A3
公开(公告)日:2024-03-13
申请号:EP23175263.5
申请日:2023-05-25
发明人: KANG, Byungjoon , KIM, Jiwon , KIM, Sungmin , KIM, Hwang Suk , OH, Jungmin , LEE, Hyosan , CHOI, Byoungki , HAM, Cheol , HWANG, Kyuyoung
摘要: Provided are a cleaning composition for removing residues on surfaces, a method of cleaning a metal-containing film by using the same, and a method of manufacturing a semiconductor device by using the same. The cleaning composition comprises a solvent (water), a cleaning accelerator and does not comprise an oxidant.
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公开(公告)号:EP4247931B1
公开(公告)日:2024-03-06
申请号:EP21810341.4
申请日:2021-11-10
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公开(公告)号:EP4234673A3
公开(公告)日:2023-10-04
申请号:EP23174742.9
申请日:2018-08-06
发明人: LOW, Robert
摘要: The invention provides a composition comprising 1,1-difluoroethene (R-1132a), difluoromethane (R-32), 2,3,3,3-tetrafluoropropene (R-1234yf), optionally carbon dioxide (CO 2 , R-744), and, optionally, 1,1,2-trifluoroethene (R-1123).
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公开(公告)号:EP4223863A1
公开(公告)日:2023-08-09
申请号:EP23154561.7
申请日:2023-02-01
摘要: A method is provided for removing a residue from a surface. The method includes steps of applying a cleaning medium to the surface containing the residue. The cleaning medium comprises up to 100 wt.% of at least a solvent. Allowing the cleaning medium to be in contact with the residue for at least 5 seconds to swell / dissolve the residue for removing the residue from the surface. At least 50 wt.% of the residue and the cleaning medium are removed from the surface by wiping the surface with a shear force. The residue contains a sulfonated polymer having an ion exchange capacity (IEC) of greater than 0.5 meq/g. The sulfonated polymer can kill > 90% of microbes coming in contact with the sulfonated polymer in less than 30 min.
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10.
公开(公告)号:EP4212596A1
公开(公告)日:2023-07-19
申请号:EP23160349.9
申请日:2020-01-03
摘要: The present application provides quaternary azeotrope or azeotrope-like compositions comprising trans-dichloroethylene and three or more additional components. Methods of using the compositions provided herein in cleaning, defluxing, deposition, and carrier fluid applications are also provided.
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