摘要:
A paste composition for forming a back surface electrode of a solar cell 10 provided by the present invention contains, as solid matter, an aluminum powder, a glass powder, and a composite powder composed of a granular composite material of titanium oxide and an organic or inorganic compound containing silicon. When the total amount of the composite powder, the aluminum powder, and the glass powder is 100% by mass, the composite powder is contained in a ratio of 0.45% by mass or more and 1% by mass or less.
摘要:
A solar cell including a semiconductor substrate (1) having a pn junction, a silver electrode (4) and an aluminum electrode (5) on a rear surface of the semiconductor substrate (1), and an overlap region (9) where the silver electrode (4) and the aluminum electrode (5) overlap each other, a glass softening point temperature of a glass component contained in the silver electrode (4) being equal to or higher than a glass softening point temperature of a glass component contained in the aluminum electrode (5), and a method of manufacturing the solar cell are provided.
摘要:
There are provided a solar cell (1) including a semiconductor substrate (2), and a busbar electrode (3) extending in a first direction (50) and a finger electrode (4) extending in a second direction (51) on a first surface of the semiconductor substrate (2), the finger electrode (4) and the busbar electrode (3) being electrically connected to each other, and a side portion of the busbar electrode (3) being curved such that a width of the busbar electrode (3) increases toward an end portion of the busbar electrode (3), in a region near the end portion of the busbar electrode (3) in the first direction (50), a solar cell string, and a solar cell module.
摘要:
Disclosed are an electrically conductive paste (7) containing an electrically conductive powder including electrically conductive particles (21), wherein the electrically conductive particles (21) each have a basic material (21a), and an electrically conductive layer (21b) covering at least one portion of the outer surface of the basic material (21a); an electrode (71, 72, 81, 82), for a semiconductor device, formed by use of the paste; a semiconductor device (10, 35); and a method for producing the semiconductor device (10, 35) by use of the paste.