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3 条记录 (耗时 0.009 秒)

    INHALER
    2.
    发明公开
    INHALER 审中-公开

    公开(公告)号：EP3733233A1

    公开(公告)日：2020-11-04

    申请号：EP20181640.2

    申请日：2017-09-14

    申请人： Norton (Waterford) Limited

    发明人： CALDERON OLIVERAS, Enrique ,  BUCK, Daniel ,  KANTOR, Erica, Jamie ,  WEIR, Ross, William ,  ROCHE, James ,  GARDNER, Steven, David ,  KIVLIN, Robert, Owen

    IPC分类号： A61M15/00 ,  A61M16/00

    摘要： The introduction of electronics into a drug deliver device may introduce certain technical challenges, such as durability, electro-mechanical integration, and drug delivery performance. The present disclosure provides solutions for inclusion of an electronics module with an inhaler. For example, heat stakes may be used to secure a printed circuit board (PCB) to an electronics module's housing. Also for example, a slider may be used to transfer vertical movement of an inhaler's yoke to an electronics module's switch. Also for example, certain seals may be used when interfacing the electronics module to other portions of the device's housing to achieve a desired performance.

    INHALER
    3.
    发明公开
    INHALER 审中-公开

    公开(公告)号：EP3506971A1

    公开(公告)日：2019-07-10

    申请号：EP17804280.0

    申请日：2017-09-14

    申请人： Norton (Waterford) Limited

    发明人： CALDERON OLIVERAS, Enrique ,  BUCK, Daniel ,  KANTOR, Erica, Jamie ,  WEIR, Ross, William ,  ROCHE, James ,  GARDNER, Steven, David ,  KIVLIN, Robert, Owen

    IPC分类号： A61M15/00 ,  A61M16/00

    摘要： The introduction of electronics into a drug delivery device may introduce certain technical challenges, such as durability, electro-mechanical integration, and drug delivery performance. The present disclosure provides solutions for inclusion of an electronics module with an inhaler. For example, heat stakes may be used to secure a printed circuit board (PCB) to an electronics module's housing. Also for example, a slider may be used to transfer vertical movement of an inhaler's yoke to an electronics module's switch. Also for example, certain seals may be used when interfacing the electronics module to other portions of the device's housing to achieve a desired performance.