专利检索 ap:("Nutool, Inc.") AND inv:"BOGART, Jeffrey, A." 第 1 页

1.

发明公开
LOW-FORCE ELECTROCHEMICAL MECHANICAL PROCESSING METHOD AND APPARATUS 审中-公开
标题翻译：电化学机械的方法和设备，低功耗

公开(公告)号：EP1520281A2

公开(公告)日：2005-04-06

申请号：EP02780399.8

申请日：2002-09-27

申请人： Nutool, Inc.

发明人： BASOL, Bulent, M. , UZOH, Cyprian, E. , BOGART, Jeffrey, A.

IPC分类号： H01G2/00

CPC分类号： B24B37/26 , B23H5/08 , B24B37/046 , B24B37/22 , B24B49/16 , C25D5/22 , C25D7/123

摘要： The present invention relates to semiconductor integrated circuit technology and discloses an electrochemical mechanical processing system for uniformly distributing an applied force to a workpiece surface. The system includes a workpiece carrier for positioning or holding the workpiece surface and a workpiece-surface-influencing-device (WSID). The WSID is used to uniformly distribute the applied force to the workpiece surface and includes various layers that are used to process and apply a uniform and global force to the workpiece surface.

2.

发明公开
METHOD AND SYSTEM TO PROVIDE ELECTRICAL CONTACTS FOR ELECTROTREATING PROCESSES 审中-公开
标题翻译：方法和系统，用于提供电处理进程的电气联系

公开(公告)号：EP1444722A2

公开(公告)日：2004-08-11

申请号：EP02786571.6

申请日：2002-10-28

申请人： Nutool, Inc.

发明人： BASOL, Bulent, M. , TALIEH, Homayoun , NAGORSKI, Boguslaw, A. , UZOH, Cyprian, E. , BOGART, Jeffrey, A.

IPC分类号： H01L21/00 , C25D7/12

CPC分类号： H01L21/67086 , C25D17/001

摘要： Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented.