公开(公告)号：EP0905285A4

公开(公告)日：1999-05-19

申请号：EP97901820

申请日：1997-02-03

申请人： OKUNO CHEM IND CO

发明人： MATSUNAMI TAKASHI ,  IKEDA MASAHIKO ,  OKA HIROYUKI

IPC分类号： C25D5/56

CPC分类号： C25D5/56

摘要： A method for electroplating nonconductive material, comprising the steps of bringing a nonconductive material into contact with an acidic hydrosol solution containing a palladium compound, a stannous compound, and a copper compound; and bringing the material into contact with an aqueous alkaline solution before electroplating. When this method is used, a good electroplated film having an excellent decorative appearance can be formed on the surface of such a nonconductive material as molded plastic parts, etc., having a large area without requiring any electroless plating process.

摘要翻译： 一种电镀非导电材料的方法，包括以下步骤：使非导电材料与含有钯化合物，亚锡化合物和铜化合物的酸性水溶胶溶液接触; 并在电镀之前使材料与碱性水溶液接触。 当使用这种方法时，可以在诸如具有大面积的模制塑料部件等的非导电材料的表面上形成具有优良装饰外观的良好电镀膜，而不需要任何无电镀工艺。