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公开(公告)号：EP3178969A4
公开(公告)日：2017-12-27
申请号：EP15829133
申请日：2015-07-28
申请人： OKUNO CHEM IND CO
摘要： An object of this invention is to provide a copper-tin alloy plating bath that allows for film thickening without using cyanide ions, and that can also be applied to barrel plating. This invention relates to a copper-tin alloy plating bath comprising an aqueous solution containing a water-soluble copper compound, a water-soluble divalent tin compound, a sulfur-containing compound represented by formula (1): €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒR-(CH 2 ) 1 -S-(CH 2 ) m -S-(CH 2 ) n -R€ƒ€ƒ€ƒ€ƒ€ƒ(1), wherein R is H, OH, or SO 3 Na, and 1, m, and n are each independently an integer of 0 to 3, and a hydroxyl group-containing aromatic compound.
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公开(公告)号：EP1767672A4
公开(公告)日：2007-10-03
申请号：EP05743664
申请日：2005-05-27
CPC分类号： C23C18/1653 , C23C18/1651 , C23C18/1841 , C23C18/48 , C23C18/52 , C25D5/10 , H05K3/3463 , H05K3/3473 , Y10T428/12639 , Y10T428/12708
摘要： A tin-based plating film with suppressed whisker growth is provided. The tin-based plating film has a two-layer structure comprising a lower layer formed of a tin plating film or tin alloy plating film comprising not more than 5% by weight of at least one metal selected from the group consisting of cobalt, copper, bismuth, silver, and indium, and not less than 95% by weight of tin, and an upper layer formed of a tin plating film or tin alloy plating film comprising not more than 5% by weight of at least one metal selected from the group consisting of cobalt, copper, bismuth, silver, and indium, and not less than 95% by weight of tin. The tin-based plating film is a lead-free tin plating film or tin alloy plating film and suppress the occurrence of whiskers for a long period of time, and, at the same time, can be relatively easily formed without a complicated process.
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公开(公告)号：EP3168332A4
公开(公告)日：2017-12-27
申请号：EP16764540
申请日：2016-01-29
申请人： OKUNO CHEM IND CO
发明人： YOSHIKANE YUSUKE , KITA KOJI
CPC分类号： C25F5/00 , C01B7/096 , C01B21/38 , C01C1/00 , C01G55/001 , C23C18/1621 , C25D5/56 , C25D17/06 , C25D21/00 , C25D21/08
摘要： An object of the invention is to provide a jig electrolytic stripper that can sufficiently remove palladium adhered to the current-conducting portion of a plating jig, that can remove palladium adhered to the insulating-material-coated portion of the jig, and that exhibits reduced erosion of the metal of the current-conducting portion of the jig. The jig electrolytic stripper comprises the following components (A) to (C): (A) at least one member selected from the group consisting of nitric acid and salts thereof, (B) at least one member selected from the group consisting of ammonia, ammonium salts, ethylene amine compounds, alkyl diamine compounds, and amino acids, and (C) a bromide.
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公开(公告)号：EP2937447A4
公开(公告)日：2016-12-07
申请号：EP13866055
申请日：2013-12-17
申请人： OKUNO CHEM IND CO
发明人： YOSHIKAWA JUNJI , TAKEUCHI YUKIYA , KITA KOJI
CPC分类号： C25D5/54 , B05D1/18 , C09D5/24 , C23C18/1653 , C23C18/2086 , C23C18/24 , C23C18/285 , C23C18/30 , C23C18/40 , C25D3/38 , C25D5/34
摘要： This invention relates to a conductive-coating bath comprising an aqueous solution containing (A) a copper compound, (B) a complexing agent, (C) an alkali metal hydroxide, (D) a C 2-5 aliphatic polyalcohol compound, and (E) at least one compound selected from the group consisting of reducing compounds having a -COOM group, wherein M is hydrogen, an alkali metal, or a -NH 4 group, and reducing saccharides having six or more carbon atoms. The present invention provides a composition for forming a conductive coating having excellent properties as a base layer for electroplating, which is effectively used to form a uniform decorative coating having excellent appearance by electroplating on a non-conductive plastic molding.
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公开(公告)号：EP2937446A4
公开(公告)日：2016-08-31
申请号：EP14855525
申请日：2014-10-16
申请人： OKUNO CHEM IND CO
发明人： NAGAMINE SHINGO , KITA KOJI , OTSUKA KUNIAKI
CPC分类号： C09K13/00 , C08J7/14 , C09K13/04 , C23C18/1641 , C23C18/1653 , C23C18/2086 , C23C18/24 , C23C18/285 , C23C18/30 , C23C18/32 , C23C18/38 , C23F1/14 , C23F3/02 , C25B1/28 , C25D5/14 , H01L21/02052 , H01L21/30604
摘要： The present invention relates to a composition for etching treatment of a resin material, the composition comprising an aqueous solution having a permanganate ion concentration of 0.2 mmol/L or more and a total acid concentration of 10 mol/L or more with an upper limit of 15 mol/L, and the aqueous solution satisfying the following condition (2): (2) setting the divalent manganese ion molar concentration to 15 or more times higher than the permanganate ion molar concentration, and wherein the aqueous solution optionally further satisfies at least one of the following conditions (1) and (3): (1) containing an organic sulfonic acid in an amount of 1.5 mol/L or more, and (3) setting the addition amount of an anhydrous magnesium salt to 0.1 to 1 mol/L.
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公开(公告)号：EP1298099A4
公开(公告)日：2008-07-30
申请号：EP00981717
申请日：2000-12-14
申请人： OKUNO CHEM IND CO
发明人： SANICHI SHIGEHIRO , NOKAMI YOSHITO
IPC分类号： C03C3/064 , C03C3/089 , C03C3/115 , C03C4/02 , C03C8/14 , C03C8/16 , C03C8/22 , C03C17/00 , C03C17/04
摘要： A ceramic coloring composition which comprises 50 to 90 wt % of a mixture of 5 to 95 parts by weight of a first lead-free glass powder comprising SiO2, ZnO and B2O3 components as glass components with 5 to 95 parts by weight of a second lead-free glass powder comprising SiO2, Bi2O3 and B2O3 components as glass components, 10 to 40 wt % of an inorganic pigment, and 0 to 10 wt % of an inorganic filler, as solid component powders thereof. The composition is free of lead, is excellent with respect to mold release characteristics in the operation of molding with heating of a flat glass having said composition printed thereon, and also with respect to the resistance to an acid and to a metal plating solution and color development characteristics of bus bar portions of a product after firing.
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公开(公告)号：EP3159436A4
公开(公告)日：2018-02-07
申请号：EP15812104
申请日：2015-06-16
申请人： OKUNO CHEM IND CO
摘要： An object of the present invention is to provide a multilayer plating film with excellent corrosion resistance. The present invention provides a multilayer plating film containing at least a chrome plating film and a tin-nickel plating film, the chrome plating film being the outermost layer, and the tin-nickel plating film being formed below the chrome plating film by using an acidic tin-nickel alloy plating solution containing a divalent tin compound, a nickel compound, a triamine compound, and a fluoride.
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8.发明公开PRETREATMENT PROCESS FOR ELECTROLESS PLATING OF RESIN MOLDED BODY, METHOD FOR PLATING RESIN MOLDED BODY, AND PRETREATMENT AGENT 审中-公开用于电镀树脂体的预处理方法，用于镀制受限形状体和预处理剂的方法
公开(公告)号：EP2149622A4
公开(公告)日：2010-07-28
申请号：EP08752904
申请日：2008-05-16
申请人： OKUNO CHEM IND CO
发明人： NAGAO TOSHIMITSU , YOSHIKANE YUSUKE , YOSHIKAWA JUNJI , MORIMOTO TORU , MURATA TOSHIYA , SATOU KAZUYA
CPC分类号： C23C18/22 , C23C18/1653 , C23C18/2086 , C23C18/24 , C23C18/28
摘要： The present invention provides a pretreatment process for electroless plating of a resin molded article, comprising etching the resin molded article using a manganate salt-containing etching solution, and then bringing the resin molded article into contact with an aqueous solution containing a reducing compound and an inorganic acid; and a plating process of a resin molded article comprising the pretreatment process. Further, the present invention provides various treatment agents for use in the plating process. According to the present invention, a plating layer with sufficient adhesion can be formed when an etching treatment is performed using a manganate salt-containing etching solution in an electroless plating treatment of a resin molded article.
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9.发明公开METHOD FOR ELECTROPLATING NONCONDUCTIVE MATERIAL 失效VERFAHREN ZUM ELEKTROBESCHICHTEN NICHTLEITENDER MATERIALIEN
公开(公告)号：EP0905285A4
公开(公告)日：1999-05-19
申请号：EP97901820
申请日：1997-02-03
申请人： OKUNO CHEM IND CO
发明人： MATSUNAMI TAKASHI , IKEDA MASAHIKO , OKA HIROYUKI
IPC分类号： C25D5/56
CPC分类号： C25D5/56
摘要： A method for electroplating nonconductive material, comprising the steps of bringing a nonconductive material into contact with an acidic hydrosol solution containing a palladium compound, a stannous compound, and a copper compound; and bringing the material into contact with an aqueous alkaline solution before electroplating. When this method is used, a good electroplated film having an excellent decorative appearance can be formed on the surface of such a nonconductive material as molded plastic parts, etc., having a large area without requiring any electroless plating process.
摘要翻译： 一种电镀非导电材料的方法，包括以下步骤：使非导电材料与含有钯化合物，亚锡化合物和铜化合物的酸性水溶胶溶液接触; 并在电镀之前使材料与碱性水溶液接触。 当使用这种方法时，可以在诸如具有大面积的模制塑料部件等的非导电材料的表面上形成具有优良装饰外观的良好电镀膜，而不需要任何无电镀工艺。
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公开(公告)号：EP3070185A4
公开(公告)日：2017-06-28
申请号：EP14879928
申请日：2014-11-18
申请人： OKUNO CHEM IND CO
发明人： TAKEUCHI YUKIYA , YOSHIKAWA JUNJI , KITA KOJI
CPC分类号： C25D3/38 , C23C18/16 , C23C18/1653 , C23C18/2086 , C23C18/285 , C23C18/30 , C23C18/40 , C25D3/04 , C25D3/12 , C25D5/14
摘要： An object of the present invention is to provide a novel conductive film-forming bath comprising an alkaline aqueous solution that can be used to form a film by electroplating on a non-conductive plastic material, the conductive film-forming bath being capable of forming a film by electroplating that has an excellent appearance and that does not suffer from reduced adhesiveness with respect to a non-conductive plastic material. The present invention relates to a conductive film-forming bath comprising an aqueous solution containing a copper compound, a complexing agent, an alkali metal hydroxide, and a water-soluble polymer having a polyoxyalkylene structure.
摘要翻译： 本发明的一个目的是提供一种新型导电膜形成槽，其包含碱性水溶液，该溶液可用于通过电镀在非导电塑料材料上形成膜，该导电膜形成槽能够形成 通过具有优异外观并且不会降低对不导电塑料材料的粘合性的电镀法成膜。 本发明涉及包含含有铜化合物，络合剂，碱金属氢氧化物和具有聚氧化烯结构的水溶性聚合物的水溶液的导电膜形成浴。
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