公开(公告)号：EP2149622A4

公开(公告)日：2010-07-28

申请号：EP08752904

申请日：2008-05-16

申请人： OKUNO CHEM IND CO

发明人： NAGAO TOSHIMITSU ,  YOSHIKANE YUSUKE ,  YOSHIKAWA JUNJI ,  MORIMOTO TORU ,  MURATA TOSHIYA ,  SATOU KAZUYA

IPC分类号： C23C18/24 ,  C23C18/16 ,  C23C18/20 ,  C23C18/22 ,  C23C18/28 ,  C23C18/30 ,  C25D5/56

CPC分类号： C23C18/22 ,  C23C18/1653 ,  C23C18/2086 ,  C23C18/24 ,  C23C18/28

摘要： The present invention provides a pretreatment process for electroless plating of a resin molded article, comprising etching the resin molded article using a manganate salt-containing etching solution, and then bringing the resin molded article into contact with an aqueous solution containing a reducing compound and an inorganic acid; and a plating process of a resin molded article comprising the pretreatment process. Further, the present invention provides various treatment agents for use in the plating process. According to the present invention, a plating layer with sufficient adhesion can be formed when an etching treatment is performed using a manganate salt-containing etching solution in an electroless plating treatment of a resin molded article.