公开(公告)号：EP2934024A4

公开(公告)日：2016-08-03

申请号：EP13861652

申请日：2013-12-03

Applicant: OLYMPUS CORP

Inventor： YAMADA JUNYA

IPC: H04R17/00 ,  A61B8/00

CPC classification number: H01L23/4985 ,  A61B8/12 ,  A61B8/445 ,  A61B8/4483 ,  A61B8/4494 ,  B06B1/0622 ,  H01L23/498 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided is a semiconductor device connection structure capable of improving adhesion strength without influencing performance of a semiconductor element by a simple method. The semiconductor device connection structure according to the invention includes a silicon substrate having a plate shape and including an external connection electrode on a surface thereof; a support member which is adhered to a rear surface of the silicon substrate and of which adhesion surface has a column shape that is substantially same as that of the silicon substrate, a thickness of the support member being larger than that of the silicon substrate; and a flexible board having an inner lead therein configured to be connected to the external connection electrode. The flexible board is arranged on a side surface of the silicon substrate and is adhered to the support member with an adhesive.

公开(公告)号：EP2557632A4

公开(公告)日：2014-05-21

申请号：EP11765403

申请日：2011-03-23

Applicant: OLYMPUS CORP

Inventor： YAMADA JUNYA ,  NAKAMURA MIKIO

IPC: H01R9/05 ,  H01R4/02

CPC classification number: H01R9/0515 ,  H01R4/02

公开(公告)号：EP2687144A4

公开(公告)日：2014-11-05

申请号：EP11860522

申请日：2011-11-24

Applicant: OLYMPUS CORP

Inventor： SATAKE NAU ,  MOTOHARA HIROYUKI ,  YAMADA JUNYA ,  SEKIDO TAKANORI ,  NAKAMURA MIKIO

IPC: A61B1/00 ,  A61B1/04 ,  A61B1/05 ,  G02B23/24

CPC classification number: H04N7/18 ,  A61B1/00096 ,  A61B1/0011 ,  A61B1/051 ,  G02B23/2423 ,  G02B23/2484

公开(公告)号：EP3010089A4

公开(公告)日：2017-03-22

申请号：EP14810848

申请日：2014-06-05

Applicant: OLYMPUS CORP

Inventor： KOBAYASHI KEIICHI ,  YAMADA JUNYA

IPC: H01R9/05 ,  H01R12/53 ,  H01R24/38

CPC classification number: H01R24/50 ,  H01R9/0515 ,  H01R12/53 ,  H01R12/57 ,  H01R24/38 ,  H01R2107/00

Abstract: A cable connection structure (1) according to the present invention connects one or a plurality of cables (20) to an electrode provided on a substrate (10). The cable (20) includes a core wire (21) formed of a line-shaped conductive material, a tubular inner insulator (22) which is formed of an insulator and covers an outer circumference of the core wire, a shield (23) which extends along the longitudinal direction of the inner insulator (22) and includes a plurality of conductors for covering an outer circumference of the inner insulator (22) and in which an exposed portion for exposing the inner insulator (22) has been formed, and an outer insulator (24) formed of an insulator for covering an outer circumference of the shield (23). The shield including a region where the exposed portion has been formed, the inner insulator (22), and the core wire (21) are exposed in a stepped manner toward the distal end. The substrate (10) includes a first electrode (11) configured to be electrically connected to the core wire (21) and a second electrode (12) configured to be electrically connected to the shield.

Abstract translation: 根据本发明的电缆连接结构（1）将一个或多个电缆（20）连接到设置在基板（10）上的电极。 电缆20包括由线状导电材料形成的芯线21，由绝缘体形成并覆盖芯线外周的管状内绝缘体22， 沿着内部绝缘体（22）的纵向方向延伸并且包括用于覆盖内部绝缘体（22）的外周的多个导体，并且其中已经形成了用于暴露内部绝缘体（22）的暴露部分;以及 由绝缘体形成的外绝缘体（24），用于覆盖屏蔽体（23）的外周。 包括已经形成有暴露部分的区域，内绝缘体（22）和芯线（21）的屏蔽体朝向远端以阶梯方式暴露。 基板（10）具有与芯线（21）电连接的第一电极（11）和与屏蔽电连接的第二电极（12）。