摘要:
The invention relates to a light-emitting diode (1) comprising a lens body (3) that is made of an inorganic solid substance. Semiconductor chips (2), which emit light beams (18), are fastened to the lens body (3). The light-emitting diode (1) is also provided with an enclosure (20) that can be screwed by means of a screw thread (21) into a traditional lamp socket.
摘要:
The invention relates to a light-emitting diode (1) comprising a lens body (3) that is made of an inorganic solid substance. Semiconductor chips (2), which emit light beams (18), are fastened to the lens body (3). The light-emitting diode (1) is also provided with an enclosure (20) that can be screwed by means of a screw thread (21) into a traditional lamp socket.
摘要:
The invention relates to a light-emitting diode (1) comprising a lens body (3) that is made of an inorganic solid substance. Semiconductor chips (2), which emit light beams (18), are fastened to the lens body (3). The light-emitting diode (1) is also provided with an enclosure (20) that can be screwed by means of a screw thread (21) into a traditional lamp socket.
摘要:
A light-emitting chip (3) comprises a lens-shaped output window (4), the base surface (5) of which is provided with a mirror surface (6). A sequence of layers (9) is arranged on an output surface (7) of the output window (4) with a photon-emitting p-n junction (10). The photons emitted by the p-n junction are reflected at the mirror surface (6) and can leave the output window (4) through the output surface (7).
摘要:
According to the invention, the longitudinal sides of semiconductor chips (1) for high-performance luminescent diodes are considerably longer than the transverse sides. This improves the coupling out of light considerably.
摘要:
The invention relates to a light-emitting-diode chip (1) comprising a sequence of GaN-based epitaxial layers (3) which emit radiation, said layers having an active zone (19), an n-doped layer (4) and a p-doped layer (5). The p-doped layer (5) is provided with a reflective contact metallization (6) on its principal surface (9) which faces away from the active zone (19), said metallization comprising a contact layer (15) that is transparent to radiation and a reflective layer (16). The invention also relates to methods for producing light emitting diodes of this type using a thin-film technique and to light-emitting-diode components comprising light-emitting-diode chips of this type.
摘要:
A radiation-emitting semiconductor component has a multiple layer structure (4) containing a radiation-emitting active layer (5), and a radiation-permeable window (1) having main surfaces (2, 3) and a recess (8) for forming radiation coupling surfaces running diagonally to the first main surface (2). At least one side surface of the window and/or recess limiting the second main surface (3) is provided with a first contact surface (11). An independent claim is also included for the production of a radiation-emitting semiconductor component comprising preparing a window layer with main surfaces; applying a semiconductor layer structure on the first main surface; structuring the window layer to form a recess in the second main surface; forming a contact surface on the side of the second main surface of the window layer; and finishing the semiconductor component. Preferred Features: The window is made from sapphire, quartz glass, diamond, ITO, tin oxide, zinc oxide, indium oxide, silicon carbide or gallium phosphide. The multiple layer structure is based on gallium nitrides.