公开(公告)号：EP1418624B1

公开(公告)日：2013-05-22

申请号：EP03025789.3

申请日：2003-11-11

申请人： Oki Data Corporation

发明人： Ogihara, Mitsuhiko, Oki Digital Imaging Corp. ,  Fujiwara, Hiroyuki, Oki Digital Imaging Corp. ,  Sakuta, Masaaki ,  Abiko, Ichimatsu

IPC分类号： H01L27/15 ,  B41J2/45

CPC分类号： G03G15/043 ,  B41J2/45 ,  H01L27/153 ,  H01L33/62 ,  H01L2224/48137

公开(公告)号：EP1418624A3

公开(公告)日：2011-03-09

申请号：EP03025789.3

申请日：2003-11-11

申请人： Oki Data Corporation

发明人： Ogihara, Mitsuhiko, Oki Digital Imaging Corp. ,  Fujiwara, Hiroyuki, Oki Digital Imaging Corp. ,  Sakuta, Masaaki ,  Abiko, Ichimatsu

IPC分类号： H01L27/15 ,  B41J2/45

CPC分类号： G03G15/043 ,  B41J2/45 ,  H01L27/153 ,  H01L33/62 ,  H01L2224/48137

摘要： A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and bonded on the substrate; and an individual interconnecting line formed as a thin conductive film extending from the semiconductor device in the thin semiconductor film to the terminal in the substrate, electrically connecting the semiconductor device to the terminal. Compared with conventional semiconductor apparatus, the invented apparatus is smaller and has a reduced material cost.

公开(公告)号：EP1418624A2

公开(公告)日：2004-05-12

申请号：EP03025789.3

申请日：2003-11-11

申请人： Oki Data Corporation

发明人： Ogihara, Mitsuhiko, Oki Digital Imaging Corp. ,  Fujiwara, Hiroyuki, Oki Digital Imaging Corp. ,  Sakuta, Masaaki ,  Abiko, Ichimatsu

IPC分类号： H01L27/15

CPC分类号： G03G15/043 ,  B41J2/45 ,  H01L27/153 ,  H01L33/62 ,  H01L2224/48137

摘要： A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and bonded on the substrate; and an individual interconnecting line formed as a thin conductive film extending from the semiconductor device in the thin semiconductor film to the terminal in the substrate, electrically connecting the semiconductor device to the terminal. Compared with conventional semiconductor apparatus, the invented apparatus is smaller and has a reduced material cost.

摘要翻译： 半导体装置包括具有至少一个端子的基板，包括至少一个半导体器件的薄半导体膜，所述薄半导体膜设置并接合在所述基板上; 以及形成为从薄半导体膜中的半导体器件延伸到衬底中的端子的薄导电膜的单独互连线，将半导体器件电连接到端子。 与传统的半导体装置相比，本发明的装置更小，材料成本降低。