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    Semicondcuctor apparatus with thin semiconductor film
    6.
    发明公开
    Semicondcuctor apparatus with thin semiconductor film 有权
    Anodenung von lichtemittierenden Dioden und Druckkopf

    公开(公告)号：EP2610910A1

    公开(公告)日：2013-07-03

    申请号：EP13161092.5

    申请日：2003-11-11

    申请人： Oki Data Corporation

    发明人： Ogihara, Mitsuhiko ,  Fujiwara, Hiroyuki ,  Sakuta, Masaaki ,  Abiko, Ichimatsu

    IPC分类号： H01L27/15 ,  B41J2/45

    CPC分类号： G03G15/043 ,  B41J2/45 ,  H01L27/153 ,  H01L33/62 ,  H01L2224/48137

    摘要： Provided is a semiconductor apparatus (190, 210, 240) comprising: a substrate (101) having at least one terminal (107a); a plurality of thin semiconductor films (191, 211, 241) including light emitting semiconductor devices (105) respectively, the thin semiconductor films (191, 211, 241) being disposed and bonded on the substrate (101); and a plurality of individual interconnecting lines (106), each of which is formed as a thin conductive film extending from each of the light emitting semiconductor devices (105) to the terminal (107a) in the substrate (101), electrically connecting each of the light emitting semiconductor devices (105) to the terminal (107a). Each of the thin semiconductor films includes a single light emitting semiconductor device which is one of the light emitting semiconductor devices (105) so that the light emitting semiconductor devices are arranged at regular intervals on the substrate.

    摘要翻译： 提供一种半导体装置（190,210,240），包括：具有至少一个端子（107a）的基板（101）; 分别包括发光半导体器件（105）的多个薄半导体膜（191,211,241），所述薄半导体膜（191,211,241）设置并接合在所述基板（101）上; 以及多个单独的互连线（106），其各自形成为从每个发光半导体器件（105）延伸到基板（101）中的端子（107a）的薄导电膜，电连接 将发光半导体器件（105）连接到终端（107a）。 每个薄半导体膜包括作为发光半导体器件（105）之一的单个发光半导体器件，使得发光半导体器件以规则的间隔布置在衬底上。

    Light emitting diode array and print head
    9.
    发明公开
    Light emitting diode array and print head 有权
    Anodenung von lichtemittierenden Dioden und Druckkopf

    公开(公告)号：EP1418624A2

    公开(公告)日：2004-05-12

    申请号：EP03025789.3

    申请日：2003-11-11

    申请人： Oki Data Corporation

    发明人： Ogihara, Mitsuhiko, Oki Digital Imaging Corp. ,  Fujiwara, Hiroyuki, Oki Digital Imaging Corp. ,  Sakuta, Masaaki ,  Abiko, Ichimatsu

    IPC分类号： H01L27/15

    CPC分类号： G03G15/043 ,  B41J2/45 ,  H01L27/153 ,  H01L33/62 ,  H01L2224/48137

    摘要： A semiconductor apparatus includes a substrate having at least one terminal, a thin semiconductor film including at least one semiconductor device, the thin semiconductor film being disposed and bonded on the substrate; and an individual interconnecting line formed as a thin conductive film extending from the semiconductor device in the thin semiconductor film to the terminal in the substrate, electrically connecting the semiconductor device to the terminal. Compared with conventional semiconductor apparatus, the invented apparatus is smaller and has a reduced material cost.

    摘要翻译： 半导体装置包括具有至少一个端子的基板，包括至少一个半导体器件的薄半导体膜，所述薄半导体膜设置并接合在所述基板上; 以及形成为从薄半导体膜中的半导体器件延伸到衬底中的端子的薄导电膜的单独互连线，将半导体器件电连接到端子。 与传统的半导体装置相比，本发明的装置更小，材料成本降低。