专利检索 ap:("Omg Electronic Chemicals LLC") AND inv:"PENIK, Stephen, E., JR." 第 1 页

1.

发明公开
ELECTROLESS PLATING BATH COMPOSITION AND METHOD OF PLATING PARTICULATE MATTER 审中-公开
标题翻译：浴组成化学镀和方法用于镀覆颗粒材料

公开(公告)号：EP2663667A2

公开(公告)日：2013-11-20

申请号：EP12734708.6

申请日：2012-01-11

申请人： Omg Electronic Chemicals LLC

发明人： PENIK, Stephen, E., JR.

IPC分类号： C23C18/31 , C23C18/16

CPC分类号： C23C18/34 , C23C18/1635 , C23C18/1639 , C23C18/1651 , C23C18/1658 , C23C18/1662 , C23C18/30 , C23C18/36 , Y10T428/2991

摘要： An electroless plating bath composition for plating particulate matter is provided. The plating bath composition includes a metal-containing component and a reducing component. The particulate matter is plated with at least one metal layer including at least two metals by electroless metal deposition in order to provide cutting and grinding tools with improved wear resistance.