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公开(公告)号：EP2414888A2
公开(公告)日：2012-02-08
申请号：EP10737662.6
申请日：2010-03-29
IPC分类号： G02F1/025
CPC分类号： G02F1/025 , G02F1/0147 , G02F1/3133 , H01L2224/48091 , H01L2224/48472 , Y10T29/49124 , H01L2924/00014
摘要： Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented on a substrate (such as silicon), and includes a thermally tunable optical waveguide that has good thermal isolation from its surroundings. In particular, a portion of a semiconductor in the optical device, which includes the optical waveguide, is free standing above a gap between the semiconductor layer and the substrate. By reducing the thermal coupling between the optical waveguide and the external environment, the optical device can be thermally tuned with significantly less power consumption.
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公开(公告)号：EP2414877B1
公开(公告)日：2020-03-04
申请号：EP10737663.4
申请日：2010-03-29
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公开(公告)号：EP2414878A2
公开(公告)日：2012-02-08
申请号：EP10737664.2
申请日：2010-03-29
申请人： Oracle America, Inc.
CPC分类号： G02B6/12007 , G02F1/0147 , G02F1/025 , G02F2203/15
摘要： Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented using two semiconductor layers (such as silicon), one of which includes a heater and the other includes a thermally tunable optical waveguide. Spatially separating these two functions in the optical device results in more efficient heat transfer between the heater and the optical waveguide, reduced heat transfer to the surroundings, and reduced optical losses in the optical waveguide relative to existing silicon-based optical devices.
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公开(公告)号：EP2414877A2
公开(公告)日：2012-02-08
申请号：EP10737663.4
申请日：2010-03-29
摘要： Embodiments of an optical device, an array of optical devices, and a technique for fabricating the optical device or the array are described. This optical device is implemented on a substrate (such as silicon), and includes a thermally tunable optical waveguide with a high thermal resistance to the surrounding external environment and a low thermal resistance to a localized heater. In particular, the thermal resistances associated with thermal dissipation paths from a heater in the optical device to an external environment via electrodes and via the substrate are increased, while the thermal resistance between the optical waveguide and the heater is decreased. The heater element consists of a doped semiconductor layer with a rib waveguide (424) on top embedded in a surrounding cladding layer (416) having regions of high doping for improving electrical and termal contact between the electrode (418-1, 418-3) and via material (418-2, 418-4, 420-2, 420-1) and the heater part, (426-2, 422, 426-1).
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