公开(公告)号：EP1372364A4

公开(公告)日：2011-01-12

申请号：EP02801550

申请日：2002-10-11

申请人： PANASONIC CORP

发明人： TATSUMI KIYOHIDE ,  NISHII TOSHIHIRO ,  NAKAMURA SHINJI

IPC分类号： B29C43/18 ,  B29C43/20 ,  B29C43/36 ,  B29C70/68 ,  B30B15/06 ,  H05K3/40 ,  H05K3/46 ,  B29C33/68 ,  B29C43/32 ,  H05K1/11

CPC分类号： H05K3/4611 ,  B29C43/18 ,  B29C43/203 ,  B29C43/3642 ,  B29C70/686 ,  B29C2043/3655 ,  B29C2043/3657 ,  B29K2101/10 ,  B29K2105/0872 ,  B29K2105/256 ,  B29L2031/3425 ,  B30B15/061 ,  B32B37/26 ,  B32B2037/266 ,  B32B2457/08 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： In a heat and press stage of manufacturing printed wiring boards, a functional surface layer having release property is provided on a surface of a cushion, and a blocking layer is prepared between the functional surface layer and an inner layer having cushion property so that a frequency of use of the cushion can be increased.