CURABLE FILM-FORMING COMPOSITION EXHIBITING IMPROVED SCRATCH RESISTANCE
    1.
    发明公开
    CURABLE FILM-FORMING COMPOSITION EXHIBITING IMPROVED SCRATCH RESISTANCE 有权
    具有提高抗刮擦性可固化膜的组合物

    公开(公告)号:EP1478704A1

    公开(公告)日:2004-11-24

    申请号:EP03711090.5

    申请日:2003-02-19

    IPC分类号: C09D7/12

    摘要: A curable film-forming composition is provided that on curing produces a coating, comprising in a medium (i) 10 to 90 percent by weight based on the total weight of resin solids in the film-forming composition of a crosslinking agent; (ii) 10 to 90 percent by weight based on the total weight of resin solids in the film-forming composition of a polymer containing a plurality of functional groups reactive with the crosslinking agent; and (iii) 20 to 85 percent by volume based on the total volume of the film-forming composition of particles having a mean particle size less than 100 nm. The particles further have an index of refraction sufficiently similar to that of the polymer of (ii) to minimize haze, and have an affinity for the medium sufficient to keep the particles suspended therein. The affinity of the particles for the medium is greater than the affinity of the particles for each other, thereby preventing agglomeration of the particles within the medium. The film-forming compositions exhibit improved scratch (mar) resistance compared to compositions of the prior art, as well as improved sag resistance when compared to similar coating compositions prepared without the particles. A multi-component composite coating composition is also provided. The coating composition comprises a pigmented film-forming composition serving as a base coat and a clear film-forming composition serving as a transparent topcoat over the base coat. The transparent topcoat, or clear coat, is derived from the curable film-forming composition described above.

    CURABLE FILM-FORMING COMPOSITION EXHIBITING IMPROVED SCRATCH RESISTANCE
    3.
    发明授权
    CURABLE FILM-FORMING COMPOSITION EXHIBITING IMPROVED SCRATCH RESISTANCE 有权
    具有提高抗刮擦性可固化膜的组合物

    公开(公告)号:EP1478704B1

    公开(公告)日:2007-09-05

    申请号:EP03711090.5

    申请日:2003-02-19

    IPC分类号: C09D7/12

    摘要: A curable film-forming composition is provided that on curing produces a coating, comprising in a medium (i) 10 to 90 percent by weight based on the total weight of resin solids in the film-forming composition of a crosslinking agent; (ii) 10 to 90 percent by weight based on the total weight of resin solids in the film-forming composition of a polymer containing a plurality of functional groups reactive with the crosslinking agent; and (iii) 20 to 85 percent by volume based on the total volume of the film-forming composition of particles having a mean particle size less than 100 nm. The particles further have an index of refraction sufficiently similar to that of the polymer of (ii) to minimize haze, and have an affinity for the medium sufficient to keep the particles suspended therein. The affinity of the particles for the medium is greater than the affinity of the particles for each other, thereby preventing agglomeration of the particles within the medium. The film-forming compositions exhibit improved scratch (mar) resistance compared to compositions of the prior art, as well as improved sag resistance when compared to similar coating compositions prepared without the particles. A multi-component composite coating composition is also provided. The coating composition comprises a pigmented film-forming composition serving as a base coat and a clear film-forming composition serving as a transparent topcoat over the base coat. The transparent topcoat, or clear coat, is derived from the curable film-forming composition described above.

    CURABLE FILM-FORMING COMPOSITION EXHIBITING IMPROVED IMPACT STRENGTH AND CHIP RESISTANCE
    6.
    发明公开
    CURABLE FILM-FORMING COMPOSITION EXHIBITING IMPROVED IMPACT STRENGTH AND CHIP RESISTANCE 有权
    具有改进的抗冲击性和片式电阻可固化膜的组合物

    公开(公告)号:EP1476512A1

    公开(公告)日:2004-11-17

    申请号:EP03711129.1

    申请日:2003-02-19

    IPC分类号: C09D7/12

    摘要: A curable film-forming composition is provided comprising in a medium (i) 10 to 90 percent by weight based on the total weight of solids in the film-forming composition of a crosslinking agent; (ii) 10 to 90 percent by weight based on the total weight of solids in the film-forming composition of a polymer containing a plurality of functional groups reactive with the crosslinking agent; and (iii) at least 20 percent by volume based on the total volume of the film-forming composition of particles having a mean particle size less than 100 nm. A cured composition comprising the crosslinking agent of (i) and the polymer of (ii) has a cured softening point of less than 30° C. The particles of component (iii) further have a hardness value greater than 5 on the Moh hardness scale, and have an affinity for the medium sufficient to keep the particles suspended therein. The affinity of the particles for the medium is greater than the affinity of the particles for each other, thereby preventing agglomeration of the particles within the medium.Cured compositions having a film thickness of at least 5 microns demonstrate excellent chip resistance, superior sandability and resistance to scratching, water spotting and acid etch.

    CURABLE FILM-FORMING COMPOSITION EXHIBITING IMPROVED IMPACT STRENGTH AND CHIP RESISTANCE
    10.
    发明授权
    CURABLE FILM-FORMING COMPOSITION EXHIBITING IMPROVED IMPACT STRENGTH AND CHIP RESISTANCE 有权
    具有改进的抗冲击性和片式电阻可固化膜的组合物

    公开(公告)号:EP1476512B1

    公开(公告)日:2006-08-09

    申请号:EP03711129.1

    申请日:2003-02-19

    IPC分类号: C09D7/12

    摘要: A curable film-forming composition is provided comprising in a medium (i) 10 to 90 percent by weight based on the total weight of solids in the film-forming composition of a crosslinking agent; (ii) 10 to 90 percent by weight based on the total weight of solids in the film-forming composition of a polymer containing a plurality of functional groups reactive with the crosslinking agent; and (iii) at least 20 percent by volume based on the total volume of the film-forming composition of particles having a mean particle size less than 100 nm. A cured composition comprising the crosslinking agent of (i) and the polymer of (ii) has a cured softening point of less than 30° C. The particles of component (iii) further have a hardness value greater than 5 on the Moh hardness scale, and have an affinity for the medium sufficient to keep the particles suspended therein. The affinity of the particles for the medium is greater than the affinity of the particles for each other, thereby preventing agglomeration of the particles within the medium.Cured compositions having a film thickness of at least 5 microns demonstrate excellent chip resistance, superior sandability and resistance to scratching, water spotting and acid etch.