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公开(公告)号：EP2021174A2
公开(公告)日：2009-02-11
申请号：EP07761980.7
申请日：2007-05-08
IPC分类号： B32B15/00
CPC分类号： B32B17/10761 , B32B17/10036 , B32B17/10174 , B32B17/10229 , Y10T428/24802
摘要： A laminated transparency includes a first ply having a No. 1 and a No. 2 surface, a second ply having a No. 3 and a No. 4 surface, and an interlayer positioned between the first and second plies. An aesthetic coating is deposited over at least a portion of the first or second plies. The transparency has a color defined by |a*| ≥ 10 and |b*| ≥ 10 and, in one non-limiting embodiment, L* ≥ 40.
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公开(公告)号：EP1663640A2
公开(公告)日：2006-06-07
申请号：EP04781642.6
申请日：2004-08-19
IPC分类号： B32B17/10
CPC分类号： B32B17/10036 , B23K35/02 , B23K35/26 , B32B17/10183 , B32B17/10293 , B32B17/10376 , B32B17/10761 , C03C17/36 , C03C17/3673 , C03C27/046 , C03C2217/94 , H05B2203/016
摘要： The invention relates to using the heat generated during thermal treatment of one or more glass sheets to melt solder. In one nonlimiting embodiment, a lead providing external access to an electrical conductive arrangement, e.g. a conductive member between and connected to spaced bus bars between laminated sheets has an end portion of a connector, e.g. a lead soldered to each of the bus bars during thermal processing of the sheets, e.g. during the lamination of the sheets during a windshield manufacturing process. In another nonlimiting embodiment, the connector is soldered to the electrically conductive arrangement during the annealing of glass blanks following the heating and shaping of the glass blanks. Soldering the leads during the annealing or laminating process eliminated possible thermal damage to the sheet by having the sheet heated during the soldering operation instead of only a small surface portion of the sheet at and eliminates the cost of a separated soldering operation.
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