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公开(公告)号：EP1541719A2
公开(公告)日：2005-06-15
申请号：EP05075545.3
申请日：1998-05-20
发明人： Henington, Paul , Li, Kwok Wah , Ng, Kwok Wing , Lee, Chi Chung , Huang, Pin Chun , Lee, Fang Hao , Marsh, Marlin Vance , Colangelo, Carl John
CPC分类号： B01F5/0068 , B01F15/0272 , C25D5/08 , C25D17/00 , C25D17/12 , C25D17/28 , C25D21/14 , H05K3/241
摘要： An electroplating machine is disclosed as including an electrode positioning apparatus, an electrolyte delivery apparatus, an apparatus for covering a roller, an apparatus for dissolving copper oxide powder in an electrolyte passing through the apparatus, and an apparatus allowing the variation of the distance between two rollers. The electrode positioning apparatus has a first open end and a second end joined by two sets of connecting members, in which the connecting members in each set are parallel to one another and equally spaced from the adjacent member. The electrolyte delivery apparatus includes a pipe connected to a source of electrolyte and a nozzle through which the electrolyte is deliverable to an electrode mounted on the electrode positioning apparatus. The nozzle includes an elongate gap and the electrolyte exits the nozzle continuously along the entire length of the elongate gap. The electrode positioning and the electrolyte delivery apparatus are slidably engageable with each other. The covering apparatus is elongate in shape and includes a cavity for accommodating a majority part of the outside surface of a roller. The apparatus for dissolving copper oxide powder in an electrolyte includes an upper chamber and a lower chamber, in which electrolyte low in copper ion concentration enters the upper chamber through its lower part, and exits the upper chamber through its upper part. A vortex is formed in a porous pot in the upper chamber to facilitate dissolution of copper oxide powder in the electrolyte. As to the apparatus allowing the variation of the distance between an upper roller and a lower roller, such includes a primary part attachable to a wall of the electroplating machine, and a second part movable relative to the primary part. In response to entry of a PCB into the area between the two rollers, the upper roller is caused to move vertically upward, which also causes the secondary part to move vertically upward.
摘要翻译： 公开了一种电镀机，其包括电极定位装置，电解质输送装置，用于覆盖辊的装置，用于将氧化铜粉末溶解在通过该装置的电解质中的装置，以及允许两者之间的距离变化的装置 辊。 电极定位装置具有通过两组连接构件连接的第一开口端和第二端，其中每组中的连接构件彼此平行并与相邻构件间隔开。 电解质输送装置包括连接到电解质源和喷嘴的管道，电解质可通过该喷嘴输送到安装在电极定位装置上的电极。 喷嘴包括细长的间隙，并且电解质沿着细长间隙的整个长度连续地离开喷嘴。 电极定位和电解质输送装置可滑动地彼此接合。 覆盖装置的形状是细长的并且包括用于容纳辊的外表面的大部分的空腔。 用于将氧化铜粉末溶解在电解质中的装置包括上室和下室，其中铜离子浓度低的电解质通过其下部进入上室，并通过其上部离开上室。 在上部室中的多孔罐中形成涡流，以便于将氧化铜粉末溶解在电解质中。 对于允许上辊和下辊之间的距离变化的装置，包括可附接到电镀机的壁的主要部件和可相对于主要部件移动的第二部件。 响应于PCB进入两个辊之间的区域，上辊被垂直向上移动，这也使得二次部件垂直向上移动。
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公开(公告)号：EP1541720A2
公开(公告)日：2005-06-15
申请号：EP05075546.1
申请日：1998-05-20
发明人： Henington, Paul , Li, Kwok Wah , Ng, Kwok Wing , Lee, Chi Chung , Huang, Pin Chun , Lee, Fang Hao , Marsh, Marlin Vance , Colangelo, Carl John
CPC分类号： B01F5/0068 , B01F15/0272 , C25D5/08 , C25D17/00 , C25D17/12 , C25D17/28 , C25D21/14 , H05K3/241
摘要： An electroplating machine is disclosed as including an electrode positioning apparatus, an electrolyte delivery apparatus, an apparatus for covering a roller, an apparatus for dissolving copper oxide powder in an electrolyte passing through the apparatus, and an apparatus allowing the variation of the distance between two rollers. The electrode positioning apparatus has a first open end and a second end joined by two sets of connecting members, in which the connecting members in each set are parallel to one another and equally spaced from the adjacent member. The electrolyte delivery apparatus includes a pipe connected to a source of electrolyte and a nozzle through which the electrolyte is deliverable to an electrode mounted on the electrode positioning apparatus. The nozzle includes an elongate gap and the electrolyte exits the nozzle continuously along the entire length of the elongate gap. The electrode positioning and the electrolyte delivery apparatus are slidably engageable with each other. The covering apparatus is elongate in shape and includes a cavity for accommodating a majority part of the outside surface of a roller. The apparatus for dissolving copper oxide powder in an electrolyte includes an upper chamber and a lower chamber, in which electrolyte low in copper ion concentration enters the upper chamber through its lower part, and exits the upper chamber through its upper part. A vortex is formed in a porous pot in the upper chamber to facilitate dissolution of copper oxide powder in the electrolyte. As to the apparatus allowing the variation of the distance between an upper roller and a lower roller, such includes a primary part attachable to a wall of the electroplating machine, and a second part movable relative to the primary part. In response to entry of a PCB into the area between the two rollers, the upper roller is caused to move vertically upward, which also causes the secondary part to move vertically upward.
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公开(公告)号：EP0959153A2
公开(公告)日：1999-11-24
申请号：EP98303984.3
申请日：1998-05-20
发明人： Henington, Paul , Li, Kwok Wah , NG, Kwok Wing , Lee, Chi Chung , Huang, Pin Chun , Lee, Fang Hao , Marsh, Marlin Vance , Colangelo, Carl John
CPC分类号： B01F5/0068 , B01F15/0272 , C25D5/08 , C25D17/00 , C25D17/12 , C25D17/28 , C25D21/14 , H05K3/241
摘要： An electroplating machine is disclosed as including an electrode positioning apparatus, an electrolyte delivery apparatus, an apparatus for covering a roller, an apparatus for dissolving copper oxide powder in an electrolyte passing through the apparatus, and an apparatus allowing the variation of the distance between two rollers. The electrode positioning apparatus has a first open end and a second end joined by two sets of connecting members, in which the connecting members in each set are parallel to one another and equally spaced from the adjacent member. The electrolyte delivery apparatus includes a pipe connected to a source of electrolyte and a nozzle through which the electrolyte is deliverable to an electrode mounted on the electrode positioning apparatus. The nozzle includes an elongate gap and the electrolyte exits the nozzle continuously along the entire length of the elongate gap. The electrode positioning and the electrolyte delivery apparatus are slidably engageable with each other. The covering apparatus is elongate in shape and includes a cavity for accommodating a majority part of the outside surface of a roller. The apparatus for dissolving copper oxide powder in an electrolyte includes an upper chamber and a lower chamber, in which electrolyte low in copper ion concentration enters the upper chamber though its lower part, and exits the upper chamber through its upper part. A vortex is formed in a porous pot in the upper chamber to facilitate dissolution of copper oxide powder in the electrolyte. As to the apparatus allowing the variation of the distance between an upper roller and a lower roller, such includes a primary part attachable to a wall of the electroplating machine, and a second part movable relative to the primary part. In response to entry of a PCB into the area between the two rollers, the upper roller is caused to move vertically upward, which also causes the secondary part to move vertically upward.
摘要翻译： 公开了一种电镀机，其包括电极定位装置，电解质输送装置，用于覆盖辊的装置，用于将氧化铜粉末溶解在通过该装置的电解质中的装置，以及允许两者之间的距离变化的装置 辊。 电极定位装置具有通过两组连接构件连接的第一开口端和第二端，其中每组中的连接构件彼此平行并与相邻构件间隔开。 电解质输送装置包括连接到电解质源和喷嘴的管道，电解质可通过该喷嘴输送到安装在电极定位装置上的电极。 喷嘴包括细长的间隙，并且电解质沿着细长间隙的整个长度连续地离开喷嘴。 电极定位和电解质输送装置可滑动地彼此接合。 覆盖装置的形状是细长的并且包括用于容纳辊的外表面的大部分的空腔。 用于将氧化铜粉末溶解在电解质中的装置包括上室和下室，其中铜离子浓度低的电解质通过其下部进入上室，并通过其上部离开上室。 在上部室中的多孔罐中形成涡流，以便于将氧化铜粉末溶解在电解质中。 对于允许上辊和下辊之间的距离变化的装置，包括可附接到电镀机的壁的主要部件和可相对于主要部件移动的第二部件。 响应于PCB进入两个辊之间的区域，上辊被垂直向上移动，这也使得二次部件垂直向上移动。
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公开(公告)号：EP0959153A3
公开(公告)日：2000-09-13
申请号：EP98303984.3
申请日：1998-05-20
发明人： Henington, Paul , Li, Kwok Wah , NG, Kwok Wing , Lee, Chi Chung , Huang, Pin Chun , Lee, Fang Hao , Marsh, Marlin Vance , Colangelo, Carl John
CPC分类号： B01F5/0068 , B01F15/0272 , C25D5/08 , C25D17/00 , C25D17/12 , C25D17/28 , C25D21/14 , H05K3/241
摘要： An electroplating machine is disclosed as including an electrode positioning apparatus, an electrolyte delivery apparatus, an apparatus for covering a roller, an apparatus for dissolving copper oxide powder in an electrolyte passing through the apparatus, and an apparatus allowing the variation of the distance between two rollers. The electrode positioning apparatus has a first open end and a second end joined by two sets of connecting members, in which the connecting members in each set are parallel to one another and equally spaced from the adjacent member. The electrolyte delivery apparatus includes a pipe connected to a source of electrolyte and a nozzle through which the electrolyte is deliverable to an electrode mounted on the electrode positioning apparatus. The nozzle includes an elongate gap and the electrolyte exits the nozzle continuously along the entire length of the elongate gap. The electrode positioning and the electrolyte delivery apparatus are slidably engageable with each other. The covering apparatus is elongate in shape and includes a cavity for accommodating a majority part of the outside surface of a roller. The apparatus for dissolving copper oxide powder in an electrolyte includes an upper chamber and a lower chamber, in which electrolyte low in copper ion concentration enters the upper chamber though its lower part, and exits the upper chamber through its upper part. A vortex is formed in a porous pot in the upper chamber to facilitate dissolution of copper oxide powder in the electrolyte. As to the apparatus allowing the variation of the distance between an upper roller and a lower roller, such includes a primary part attachable to a wall of the electroplating machine, and a second part movable relative to the primary part. In response to entry of a PCB into the area between the two rollers, the upper roller is caused to move vertically upward, which also causes the secondary part to move vertically upward.
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公开(公告)号：EP1541720A3
公开(公告)日：2006-05-31
申请号：EP05075546.1
申请日：1998-05-20
发明人： Henington, Paul , Li, Kwok Wah , Ng, Kwok Wing , Lee, Chi Chung , Huang, Pin Chun , Lee, Fang Hao , Marsh, Marlin Vance , Colangelo, Carl John
CPC分类号： B01F5/0068 , B01F15/0272 , C25D5/08 , C25D17/00 , C25D17/12 , C25D17/28 , C25D21/14 , H05K3/241
摘要： An electroplating machine is disclosed as including an electrode positioning apparatus, an electrolyte delivery apparatus, an apparatus for covering a roller, an apparatus for dissolving copper oxide powder in an electrolyte passing through the apparatus, and an apparatus allowing the variation of the distance between two rollers. The electrode positioning apparatus has a first open end and a second end joined by two sets of connecting members, in which the connecting members in each set are parallel to one another and equally spaced from the adjacent member. The electrolyte delivery apparatus includes a pipe connected to a source of electrolyte and a nozzle through which the electrolyte is deliverable to an electrode mounted on the electrode positioning apparatus. The nozzle includes an elongate gap and the electrolyte exits the nozzle continuously along the entire length of the elongate gap. The electrode positioning and the electrolyte delivery apparatus are slidably engageable with each other. The covering apparatus is elongate in shape and includes a cavity for accommodating a majority part of the outside surface of a roller. The apparatus for dissolving copper oxide powder in an electrolyte includes an upper chamber and a lower chamber, in which electrolyte low in copper ion concentration enters the upper chamber through its lower part, and exits the upper chamber through its upper part. A vortex is formed in a porous pot in the upper chamber to facilitate dissolution of copper oxide powder in the electrolyte. As to the apparatus allowing the variation of the distance between an upper roller and a lower roller, such includes a primary part attachable to a wall of the electroplating machine, and a second part movable relative to the primary part. In response to entry of a PCB into the area between the two rollers, the upper roller is caused to move vertically upward, which also causes the secondary part to move vertically upward.
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公开(公告)号：EP1541719A3
公开(公告)日：2006-05-31
申请号：EP05075545.3
申请日：1998-05-20
发明人： Henington, Paul , Li, Kwok Wah , Ng, Kwok Wing , Lee, Chi Chung , Huang, Pin Chun , Lee, Fang Hao , Marsh, Marlin Vance , Colangelo, Carl John
CPC分类号： B01F5/0068 , B01F15/0272 , C25D5/08 , C25D17/00 , C25D17/12 , C25D17/28 , C25D21/14 , H05K3/241
摘要： An electroplating machine is disclosed as including an electrode positioning apparatus, an electrolyte delivery apparatus, an apparatus for covering a roller, an apparatus for dissolving copper oxide powder in an electrolyte passing through the apparatus, and an apparatus allowing the variation of the distance between two rollers. The electrode positioning apparatus has a first open end and a second end joined by two sets of connecting members, in which the connecting members in each set are parallel to one another and equally spaced from the adjacent member. The electrolyte delivery apparatus includes a pipe connected to a source of electrolyte and a nozzle through which the electrolyte is deliverable to an electrode mounted on the electrode positioning apparatus. The nozzle includes an elongate gap and the electrolyte exits the nozzle continuously along the entire length of the elongate gap. The electrode positioning and the electrolyte delivery apparatus are slidably engageable with each other. The covering apparatus is elongate in shape and includes a cavity for accommodating a majority part of the outside surface of a roller. The apparatus for dissolving copper oxide powder in an electrolyte includes an upper chamber and a lower chamber, in which electrolyte low in copper ion concentration enters the upper chamber through its lower part, and exits the upper chamber through its upper part. A vortex is formed in a porous pot in the upper chamber to facilitate dissolution of copper oxide powder in the electrolyte. As to the apparatus allowing the variation of the distance between an upper roller and a lower roller, such includes a primary part attachable to a wall of the electroplating machine, and a second part movable relative to the primary part. In response to entry of a PCB into the area between the two rollers, the upper roller is caused to move vertically upward, which also causes the secondary part to move vertically upward.
摘要翻译： 公开了一种电镀机，其包括电极定位设备，电解质输送设备，用于覆盖辊子的设备，用于将氧化铜粉末溶解在穿过该设备的电解液中的设备以及允许两个之间的距离变化的设备 辊。 电极定位装置具有第一开口端和通过两组连接件连接的第二端，其中每组中的连接件彼此平行且与相邻件等距。 电解质输送设备包括连接到电解质源和管道的管道，电解质可通过该管道输送到安装在电极定位设备上的电极。 喷嘴包括细长间隙，并且电解质沿着细长间隙的整个长度连续地离开喷嘴。 电极定位和电解质输送装置可滑动地彼此接合。 覆盖装置的形状是细长的并且包括用于容纳滚筒的外表面的大部分的空腔。 用于将氧化铜粉末溶解在电解质中的装置包括上部室和下部室，铜离子浓度低的电解液通过其下部进入上部室，并通过其上部离开上部室。 在上室中的多孔罐中形成涡流以促进氧化铜粉末在电解质中的溶解。 关于允许上辊和下辊之间的距离变化的装置，包括可连接到电镀机的壁的主要部分和可相对于主要部分移动的第二部分。 响应于PCB进入两个辊之间的区域，使得上辊垂直向上移动，这也导致次要部分垂直向上移动。
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