公开(公告)号：EP3252870A1

公开(公告)日：2017-12-06

申请号：EP17171760.6

申请日：2017-05-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： YAMAMOTO, Chie ,  IWAKI, Hideki ,  SHIOZAKI, Ryosuke

IPC: H01Q9/04 ,  H01Q21/00 ,  H01Q1/32 ,  H01Q21/08 ,  H01Q11/04 ,  H01Q21/06 ,  H01P5/02

CPC classification number: H01Q21/22 ,  H01P5/028 ,  H01Q1/3233 ,  H01Q1/38 ,  H01Q3/34 ,  H01Q9/045 ,  H01Q9/0457 ,  H01Q11/04 ,  H01Q21/0075 ,  H01Q21/0093 ,  H01Q21/065 ,  H01Q21/08 ,  H05K1/0222 ,  H05K1/0243 ,  H05K1/0251 ,  H05K1/0373 ,  H05K3/4626

Abstract: An antenna module includes a multilayer board, a phased array antenna that includes antenna elements arranged on an outer face of a second conductor layer included in the multilayer board and adjusts one or more beam directions of the antenna elements, a radio frequency (RF) chip that is arranged on an outer face of first conductor layers included in the multilayer board and outputs the radio frequency signal, a matching circuit that is arranged on the outer face of the first conductor layers and adjusts matching between impedance of the antenna elements and impedance of the RF chip, a through hole that couples the first conductor layers and the second conductor layer, and one or more vias that are on an outer side in a diameter direction of the through hole and couples the first conductor layers.

Abstract translation: 天线模块包括多层板，相控阵天线，该相控阵天线包括设置在多层板中包括的第二导体层的外表面上的天线元件，并且调整天线元件的一个或多个波束方向;射频（RF）芯片 ，其配置在所述多层基板所包含的第一导体层的外表面上并输出射频信号;匹配电路，其配置在所述第一导体层的外表面上，并调整所述天线元件的阻抗与 RF芯片，耦合第一导体层和第二导体层的通孔以及位于通孔径向外侧的一个或多个通孔并且耦合第一导体层。