公开(公告)号：EP4441848A1

公开(公告)日：2024-10-09

申请号：EP22902030.0

申请日：2022-11-21

Applicant: Ticona LLC

Inventor： KIM, Young Shin

IPC: H01Q21/06 ,  H05K3/10 ,  H01L33/48 ,  C08G63/06 ,  C08G63/60 ,  C08K13/02 ,  H01B3/02

CPC classification number: C09D1/00 ,  H01Q1/38 ,  C08K3/346 ,  C08K7/10 ,  C08K7/14 ,  H01Q1/526

公开(公告)号：EP4401245A3

公开(公告)日：2024-10-09

申请号：EP24160128.5

申请日：2017-12-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： WANG, Hanyang ,  KHRIPKOV, Alexander ,  TU, Dongxing ,  LUO, Hongting ,  MILOSAVLJEVIC, Zlatoljub ,  LI, Linsheng

IPC: H01Q1/22 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q21/28 ,  H01Q23/00

CPC classification number: H01Q1/2283 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q21/28 ,  H01Q23/00

Abstract: A communication device (102; 202; 302) comprising: a millimetre wave antenna arrangement (104) comprising a distributed millimetre wave antenna radiating element (106, 108, 110) and a corresponding fixed millimetre wave antenna radiating element (112, 114, 116); a Radio Frequency Integrated Circuit; wherein the fixed millimetre wave antenna radiating element is arranged together with the Radio Frequency Integrated Circuit (118) on a first substrate (120); wherein the distributed millimetre wave antenna radiating element is arranged on at least one second substrate (122; 124) spaced apart from the first substrate; and a switching arrangement (126) configured to selectively connect either the fixed millimetre wave antenna radiating element to the Radio Frequency Integrated Circuit or the distributed millimetre wave antenna radiating element to the Radio Frequency Integrated Circuit. An associated method in a communication device, and an associated computer program product.

公开(公告)号：EP3955375B1

公开(公告)日：2024-09-25

申请号：EP20786719.3

申请日：2020-04-07

IPC: H01Q1/22 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q23/00 ,  G06K19/077

CPC classification number: H01Q7/00 ,  H01Q23/00 ,  G06K19/07749 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q1/2283

公开(公告)号：EP4432464A1

公开(公告)日：2024-09-18

申请号：EP21964171.9

申请日：2021-11-11

Applicant: LG Electronics Inc.

Inventor： CHO, Seongmoon ,  YOU, Dongjoo ,  JOUNG, Jeayoul ,  LEE, Junseok

IPC: H01Q1/38 ,  H01Q1/46

CPC classification number: H01Q1/46 ,  H01Q1/38

Abstract: A transparent antenna module according to the present specification comprises: a dielectric substrate; dielectric structures formed on and in contact with the dielectric substrate and formed to be spaced a gap area having a predetermined distance apart from each other in at least one axial direction; a first conductive layer formed in the gap area to be in contact with the dielectric substrate and formed to have a first thickness; and a second conductive layer formed on and in contact with the first conductive layer and formed to have a second thickness.

公开(公告)号：EP4428600A1

公开(公告)日：2024-09-11

申请号：EP22898871.3

申请日：2022-10-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： CHOE, Jaewon ,  KIM, Seunghwan ,  JO, Jaehoon ,  CHOI, Nakchung

IPC: G02B27/01 ,  H01Q1/27 ,  H01Q1/38

CPC classification number: H01Q1/38 ,  H01Q1/27 ,  G02B27/01 ,  G02B27/0172 ,  G02B27/017 ,  G02B2027/017820130101 ,  G02B27/0176

Abstract: Augmented reality (AR) glasses may include a main housing configured to accommodate lenses of the AR glasses, with at least a portion of the main housing formed of a conductive member A sub-housing forms a leg of the AR glasses. A PCB is disposed in the sub-housing. A conductive hinge structure is configured to interconnect the main housing and the sub-housing such that the sub-housing is foldable with respect to the main housing. The conductive hinge structure is electrically connected to the PCB and the conductive member. A wireless communication circuit is disposed in the sub-housing and is configured to transmit and/or receive a signal of a predetermined frequency band based on an electrical path including the conductive hinge structure and the conductive member by directly feeding power to the conductive hinge structure. Various other embodiments identified through the specification are possible.

公开(公告)号：EP4425706A1

公开(公告)日：2024-09-04

申请号：EP22887532.4

申请日：2022-10-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： YUN, Yongsang ,  PARK, Seongjin ,  LIM, Gunbae ,  CHUN, Jaebong

IPC: H01Q1/38 ,  H01Q1/24

CPC classification number: H01Q1/24 ,  H01Q1/38

Abstract: According to various embodiments of the present disclosure, an electronic device may comprise: a housing; a main circuit board which is disposed in the housing; an antenna module which is disposed in the housing and includes a first surface facing the outside of the electronic device and having a plurality of conductive patterns arranged thereat and a second surface facing a different direction from the first surface; a flexible printed circuit board at least a part of which is disposed at the second surface and which electrically connects the main circuit board and the antenna module to each other; and a cable which is connected to a seating surface formed by the flexible printed circuit board and is electrically connected to the antenna module.

公开(公告)号：EP4423899A1

公开(公告)日：2024-09-04

申请号：EP22887897.1

申请日：2022-09-19

Applicant: X Development LLC

Inventor： LAL, Amit ,  KAWAGUCHI, Dean ,  KOPROWSKI, Brion

IPC: H02N2/18 ,  H10N30/50 ,  H02J50/00

CPC classification number: H02S40/38 ,  H02S40/44 ,  H01L31/048 ,  H01Q1/38 ,  H02J7/35 ,  H02S10/10 ,  H01Q1/2225 ,  H10N10/00 ,  H02J50/001 ,  H10N30/304 ,  H02N2/186

公开(公告)号：EP4421984A1

公开(公告)日：2024-08-28

申请号：EP21961490.6

申请日：2021-10-21

Applicant: LG Electronics Inc.

Inventor： KIM, Changil ,  YUN, Changwon ,  YOUN, Yeomin ,  KIM, Yongkon ,  JEON, Cheolsoo

IPC: H01Q1/32 ,  H01Q1/38 ,  H01Q1/46 ,  H04B7/0413

CPC classification number: H01Q1/46 ,  H04B7/0413 ,  H01Q1/38 ,  H01Q1/32

Abstract: The antenna module mounted on a vehicle comprises: a PCB on which electronic components are arranged; a radiator which is electrically connected to the PCB through a side surface region, and which is formed of a metal pattern having a predetermined length and width and transmits and receives a first signal; a lower cover which is arranged under the PCB and which includes a metal plate having slot regions; and an upper cover which is engaged with the lower cover and accommodates the PCB and the radiator therein. The metal plate can comprise: a first slot region formed at one side of the metal plate so as to have a predetermined length and width; and a second slot region formed in parallel to the first slot region so as to have a predetermined length and width.

公开(公告)号：EP3520171B1

公开(公告)日：2024-08-28

申请号：EP17857254.1

申请日：2017-09-25

IPC: G01R29/08

CPC classification number: H01Q21/29 ,  H01Q5/30 ,  G01R29/0814 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q7/00 ,  G01R29/0878 ,  H04L43/50 ,  H04W24/08 ,  H04W24/06

公开(公告)号：EP4418459A2

公开(公告)日：2024-08-21

申请号：EP24186351.3

申请日：2020-12-28

Applicant: Avery Dennison Retail Information Services LLC

Inventor： FORSTER, Ian, J.

IPC: H01Q9/26

CPC classification number: G06K19/07752 ,  G06K19/07754 ,  G06K19/07756 ,  G06K19/07771 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q9/26 ,  H01Q5/378

Abstract: In some embodiments, a method of manufacturing a radio frequency identification (RFID) tag on a target surface of a non-planar object may be provided. The method may include positioning an antenna on the target surface of the non-planar object, positioning a reactive RFID strap on the target surface, and coupling the reactive RFID strap to the antenna to induce an antenna response.