BODENBELAG
    1.
    发明公开
    BODENBELAG 审中-公开

    公开(公告)号:EP1913215A1

    公开(公告)日:2008-04-23

    申请号:EP06776351.6

    申请日:2006-07-22

    发明人: PERMESANG, Claus

    IPC分类号: E04F15/02

    摘要: The invention relates to a floor covering having a carrier and retaining layer (1) and a decorative layer which is arranged above the carrier and retaining layer (1) and is connected in a releasable manner to the carrier and retaining layer. According to the invention, the carrier and retaining layer (1) is formed by panels or webs and has protrusions (3) and/or depressions in a grid arrangement, these protrusions and/or depressions forming a force-fitting and/or form-fitting connection with counterparts (6, 7) on the underside of the decorative layer.

    摘要翻译: 本发明涉及一种具有载体和保持层(1)和装饰层的地板覆盖物,该装饰层布置在载体和保持层(1)的上方,并以可释放的方式连接到载体和保持层。 根据本发明,载体和保持层(1)由板或腹板形成并且具有格栅布置的突起(3)和/或凹陷,这些突起和/或凹陷形成力配合和/ 与装饰层下侧的对应物(6,7)配合连接。

    VORRICHTUNG ZUR BILDUNG EINES BODENBELAGS
    2.
    发明公开
    VORRICHTUNG ZUR BILDUNG EINES BODENBELAGS 审中-公开
    DEVICE FOR形成地板

    公开(公告)号:EP1915493A1

    公开(公告)日:2008-04-30

    申请号:EP06776350.8

    申请日:2006-07-22

    发明人: PERMESANG, Claus

    IPC分类号: E04F21/24 E04F15/00

    CPC分类号: E04F15/00 E04F21/24

    摘要: The invention relates to an arrangement for forming a floor covering (19) which comprises a layer (19) which compensates for unevennesses (6) in the floor. The invention provides a device (1) which can be moved parallel to the floor (5) and forms a formwork surface (9) directed towards the floor (5), also a material-supply device (12 to 15) material which forms the compensating layer (19) is introduced into a space (16) between the formwork surface (9) and the floor (5), and additionally a device for marking a reference plane (17), a measuring device (8) for determining deflections of the formwork surface (9) from the reference plane (17), and a device (8) for positioning the formwork surface (9) in relation to the reference plane (17).

    BAUELEMENT ZUR HERSTELLUNG VON BODEN- ODER WANDVERKLEIDUNGEN
    3.
    发明公开
    BAUELEMENT ZUR HERSTELLUNG VON BODEN- ODER WANDVERKLEIDUNGEN 有权
    组件可以查看土壤和墙面砖的制备

    公开(公告)号:EP1682733A2

    公开(公告)日:2006-07-26

    申请号:EP04790655.7

    申请日:2004-10-20

    发明人: PERMESANG, Claus

    IPC分类号: E04F13/08

    摘要: The invention relates to a building component for forming floor and/or wall coverings, for example tile or parquet floorings. According to said invention, the inventive building component comprises a support layer (1) and a layer (2) which is connected thereto and consists of at least one coating element (3) forming a floor or wall surface. Said building component also comprises a device (7, 8) for connecting similar building components applied to a floor or a wall. Said support layer (1) is preferably connected to the coating element (3) by means of an intermediate layer (4) which is foamed or sprayed on the support layer (1) and on the building component.