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    Laser diode module
    2.
    发明公开
    Laser diode module 失效
    Laserdiodenmodul。

    公开(公告)号：EP0403011A1

    公开(公告)日：1990-12-19

    申请号：EP90201496.8

    申请日：1990-06-11

    申请人： Philips Electronics N.V.

    发明人： Kluitmans, Johannes Theresia Marinus ,  Tjassens, Hindrik ,  Kock, Hendrikus Gerardus

    IPC分类号： H01S3/025

    CPC分类号： H01S5/02284 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01S5/02216 ,  H01S5/02248 ,  H01S5/02423 ,  H01S5/02438 ,  H01S5/0427 ,  H01S5/06226 ,  H01S5/0683 ,  Y10S257/93 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A laser diode module comprises a rectangular box-shaped metal casing having a bottom (B), an even number of guide pins (1-14) being led through the bottom (B) in a standardised DIL order. In addition to the laser diode itself (LD) the laser diode module further includes a metal base carrier (BC) on which the laser diode (LD), a photo diode (PD) and a support (S) for the glass fibre (F) are installed.
    The laser diode module comprises a guide pin (9) which is inserted in the bottom (B) by means of a feedthrough insulator for electrically connecting the laser diode module to an external transmission line (MT). In order to achieve a proper matching of the laser diode module and the charcteristic impedance of the external transmission line (MT), so that reflection phenomena are avoided and the laser diode module is made suitable for use in systems with considerably higher bit rates than 1 Gbit/s, the aforesaid guide pin (9) forms the inner guide of a coaxial transmission line situated inside the casing, of which transmission line the outer guide (CBL) is electrically conductively connected to the casing, whereas in the connecting line between the inner guide (9) and the laser diode (LD) a resistor (CS) is inserted having a value such that the sum of the resistances of this resistor (CS) and the laser diode (LD) is substantially equal to the characteristic impedance of the coaxial transmission line (9, CBL).

    摘要翻译： 激光二极管模块包括具有底部（B）的矩形盒状金属外壳，偶数个导向销（1-14）以标准化的DIL顺序被引导通过底部（B）。 除了激光二极管本身（LD）之外，激光二极管模块还包括金属基底载体（BC），激光二极管（LD），光电二极管（PD）和用于玻璃纤维的支架（S） ）已安装。 激光二极管模块包括通过用于将激光二极管模块电连接到外部传输线（MT）的馈通绝缘体插入在底部（B）中的引导销（9）。 为了实现激光二极管模块的适当匹配和外部传输线（MT）的特征阻抗，从而避免了反射现象，激光二极管模块适用于比1比特率高的系统 Gbit / s，上述引导销（9）形成位于壳体内部的同轴传输线的内引导件，其中传导线将外引导件（CBL）导电连接到壳体，而在连接线 内部引导件（9）和激光二极管（LD）中插入电阻器（CS），其具有使得该电阻器（CS）和激光二极管（LD）的电阻之和基本上等于 同轴传输线（9，CBL）。

    Laser diode module
    4.
    发明公开
    Laser diode module 失效
    Laserdiodenmodul。

    公开(公告)号：EP0326207A1

    公开(公告)日：1989-08-02

    申请号：EP89200097.7

    申请日：1989-01-17

    申请人： Philips Electronics N.V.

    发明人： Kluitmans, Johannes Theresia Marinus ,  Tjassens, Hindrik

    IPC分类号： H01S3/025 ,  H04B10/04 ,  H01L31/0203 ,  G02B6/42

    CPC分类号： H01S5/02208 ,  G02B6/4202 ,  H01L2224/48091 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01S5/02276 ,  H01S5/02284 ,  H01S5/02415 ,  H01S5/0428 ,  H01S5/0683 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A laser diode module comprises a rectangular, box-like metal casing having a bottom (B), whereas an even number of guide pins (1-14) are passed through the bottom (B) in a standardized DIL order and no less than one guide pin (5) is electroconductively connected to the bottom (B).
    In addition to the laser diode (LD) itself the module further includes a Peltier cooler (TEC) and a thermal metal base carrier (BC) coupled thereto, which base carrier accommodates the laser diode (LD), a photodiode (PD), a support (S) for the glass fibre (F) and a thermistor (TH).
    In order to render this laser diode module suitable for use in communication systems with bit rates that exceed by far 1 Gbit/s, the said guide pin (5) has inside the casing a portion in the form of a rod with a constant cross-section and with no less than one flat side face which over its entire surface has an electroconductive coupling with the relevant long sidewall (SW₁) of the casing, an electroconductive interconnecting strip being provided between the head face of the rod and the base carrier (BC)

    摘要翻译： 激光二极管模块包括具有底部（B）的矩形盒状金属壳体，而偶数个导向销（1-14）以标准化的DIL顺序通过底部（B），并且不小于一个 引导销（5）与底部（B）导电连接。 除了激光二极管（LD）本身之外，该模块还包括珀尔贴冷却器（TEC）和耦合到其上的热金属基底载体（BC），该基底载体容纳激光二极管（LD），光电二极管（PD）， 用于玻璃纤维（F）和热敏电阻（TH）的载体（S）。 为了使该激光二极管模块适用于比特率超过1Gbit / s的通信系统，所述引导销（5）在壳体的内部具有呈杆状的部分， 并且在其整个表面上具有不小于一个平坦的侧面具有与壳体的相关长侧壁（S​​W1）的导电耦合，导电互连条设置在杆的头部面与基座（BC ）