利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

61 条记录 (耗时 0.017 秒)

    TRANSPARENT LIGHT EMITTING DEVICE WITH CONTROLLED EMISSION
    5.
    发明公开
    TRANSPARENT LIGHT EMITTING DEVICE WITH CONTROLLED EMISSION 有权
    透明胶原蛋白排泄物发酵

    公开(公告)号：EP2583328A1

    公开(公告)日：2013-04-24

    申请号：EP11729756.4

    申请日：2011-06-15

    申请人： Koninklijke Philips Electronics N.V. ,  Philips Intellectual Property & Standards GmbH

    发明人： LIFKA, Herbert ,  HARTMANN, Sören ,  BOERNER, Herbert Friedrich ,  RICKERS, Christoph

    IPC分类号： H01L51/52 ,  H01L51/00

    CPC分类号： H01L51/102 ,  H01L27/3209 ,  H01L27/3239 ,  H01L33/42 ,  H01L51/0021 ,  H01L51/5206 ,  H01L51/5209 ,  H01L51/5212 ,  H01L2251/5307 ,  H01L2251/5323 ,  H01L2251/5338 ,  H01L2251/5361

    摘要： The present invention relates to a light emitting device comprising: a transparent substrate (11); partially transparent an anode layer (12) or layer assembly arranged on said substrate (11); a light emitting layer (13) arranged on said anode layer (12); and a transparent cathode layer (14) arranged on said light emitting layer; (13) wherein said anode layer (12) or layer assembly comprises a first surface (15) facing said substrate (11) and a second surface (16) facing said light emitting layer (13) and is positioned opposite to said first surface (15); said first surface (15) comprises a transparent conductive material; said second surface (16) comprises first(17)and second domains (18); said first domains (17) are conductive and non - transparent; said second domains (18) are transparent and electrically isolating; and said first domains (17) are in direct contact with said light emitting layer (13) and are arranged to allow electrical contact between said first surface (15) and said light emitting layer (13). The light emitting device can be applied in transparent OLED devices to allow for the possibility of controlled emission.

    摘要翻译： 公开了一种发光器件和用于制造发光器件的方法。 在一个示例中，发光器件包括透明衬底，部分透明的布置在所述衬底上的阳极层或层组件，布置在所述阳极层上的发光层和布置在所述发光层上的透明阴极层，其中所述 阳极层或层组件包括面对所述透明衬底的第一表面和面对所述发光层的第二表面并且与所述第一表面相对定位，所述第一表面包括透明导电材料，所述第二表面包括第一和第二畴，所述 第一域是导电和不透明的，所述第二域是透明和电隔离的，并且所述第一域与所述发光层直接接触并被布置成允许所述第一表面和所述发光层之间的电接触。

    SELF-ALIGNED COVERAGE OF OPAQUE CONDUCTIVE AREAS
    6.
    发明公开
    SELF-ALIGNED COVERAGE OF OPAQUE CONDUCTIVE AREAS 有权
    SELBSTAUSRICHTENDE ABDECKUNGFÜROPAKELEITFÄHIGEBEREICHE

    公开(公告)号：EP2609641A1

    公开(公告)日：2013-07-03

    申请号：EP11749931.9

    申请日：2011-07-29

    申请人： Koninklijke Philips Electronics N.V. ,  Philips Intellectual Property & Standards GmbH

    发明人： HARTMANN, Sören ,  RICKERS, Christoph ,  BOERNER, Herbert, Friedrich ,  LIFKA, Herbert ,  SCHWAB, Holger

    IPC分类号： H01L51/52

    CPC分类号： H01L21/707 ,  H01L51/00 ,  H01L51/5212

    摘要： The invention relates to a method enabling to apply cheap manufacturing techniques for producing reliable and robust organic thin film device (EL) comprising the steps of providing (P) a transparent substrate (1) at least partly covered with a first layer stack comprising at least one transparent layer (2), preferably an electrically conductive layer, and a pattern of first and second opaque conductive areas (31, 32) deposited on top of the transparent layer (2), depositing (D) a photoresist layer (4) made of an electrically insulating photoresist resist material on top of the first layer stack at least fully covering the second opaque conductive areas (32), illuminating (IL) the photoresist layer (4) through the transparent substrate (1) with light (5) of a suitable wavelength to make the photoresist material soluble in the areas (43) of the photoresist layer (4) having no opaque conductive areas (31, 32) underneath, removing (R) the soluble areas (43) of the photoresist layer (4), heating (B) the areas (42) of the photoresist layer (4) remaining on top of at least the second opaque conductive areas (32) to re-flow the photoresist layer (4) to cover the edges (E) of the second opaque conductive areas (32) in contact to the transparent layer (2), and hardening (H) the remaining areas (42) of the photoresist layer (4). The invention further relates to a conductive component (CC) for use in these organic thin film devices (EL) and to the organic thin film devices (EL) itself.

    摘要翻译： 本发明涉及一种能够应用便宜的制造技术来制造可靠和有力的有机薄膜器件（EL）的方法，该方法包括以下步骤：提供（P）至少部分被第一层堆叠覆盖的透明衬底（1） 一个透明层（2），优选导电层，以及沉积在透明层（2）的顶部上的第一和第二不透明导电区域（31,32）的图案，沉积（D）制成的光致抗蚀剂层（4） 至少完全覆盖所述第二不透明导电区域（32）的第一层堆叠顶部上的电绝缘光致抗蚀剂材料，通过所述透明基板（1）照射（IL）所述光致抗蚀剂层（4），所述光（5） 使光致抗蚀剂材料溶解在下面没有不透明导电区域（31,32）的光致抗蚀剂层（4）的区域（43）中的合适波长，去除光致抗蚀剂层（4）的可溶性区域（43） ），他 （B）至少第二不透明导电区域（32）的顶部上的光致抗蚀剂层（4）的区域（42），以重新流过光致抗蚀剂层（4）以覆盖第二不透明导电区域（32）的边缘（E） 与透明层（2）接触的不透明导电区域（32），以及硬化（H）光刻胶层（4）的剩余区域（42）。 本发明还涉及用于这些有机薄膜器件（EL）和有机薄膜器件（EL）本身的导电元件（CC）。

    SUBSTRATE SHEET
    10.
    发明公开
    SUBSTRATE SHEET 有权
    一种用于制造基材膜过程

    公开(公告)号：EP2614544A1

    公开(公告)日：2013-07-17

    申请号：EP11761717.5

    申请日：2011-09-02

    申请人： Koninklijke Philips Electronics N.V. ,  Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO

    发明人： LIFKA, Herbert ,  SANDERS, Renatus, Hendricus, Maria ,  MATHEW, Denny

    IPC分类号： H01L51/52 ,  H01L51/00

    CPC分类号： H01L51/0024 ,  B32B3/02 ,  B32B3/08 ,  B32B15/08 ,  B32B15/20 ,  B32B2457/206 ,  H01L51/0022 ,  H01L51/5212

    摘要： The invention provides a method for producing a flexible barrier sheet (200) comprising a barrier layer (103) and metallic elements (104), said method comprising: a) providing a metallic layer (102) applied on a polymeric support layer (101), the metallic layer having a first surface (105) facing the polymeric support layer and a second surface (106) facing away from said polymeric support layer; b) providing metallic elements on the second surface of the metallic layer; c) providing a barrier layer covering said second surface of the metallic layer and said metallic elements, the barrier layer having a first surface facing the metallic layer and a second surface facing away from the metallic layer; d) releasing the polymeric support layer from the metallic layer; and e) removing the metallic layer from the metallic elements and the barrier layer. The flexible barrier sheet may be used in roll-to-roll fabrication of thin film semiconductor devices requiring a high quality barrier substrate sheet, such as OLEDs.