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    ELECTRONIC CIRCUITS INCLUDING PLANAR ELECTRONIC DEVICES
    1.
    发明公开
    ELECTRONIC CIRCUITS INCLUDING PLANAR ELECTRONIC DEVICES 有权
    与平面电子部件的集成电路的生产互连的方法

    公开(公告)号：EP2504856A1

    公开(公告)日：2012-10-03

    申请号：EP10803126.1

    申请日：2010-11-23

    申请人： Pragmatic Printing Ltd

    发明人： PRICE, Richard ,  BARTON, Ian ,  WHITE, Scott

    IPC分类号： H01L21/768

    CPC分类号： H01L21/768 ,  H01L21/76838 ,  H01L27/124 ,  H01L51/0021

    摘要： A method comprises: forming a structure comprising a layer of active material (1), a first conductive track (2) separated from the layer of active material by a layer of insulative material ( 3 ), the layer of active material having a plurality of insulative features (110) formed therein, the insulative features defining at least a first substantially planar electronic device comprising at least a respective first terminal (11) and a respective second terminal (12), and at least a portion of said first conductive track overlapping one of the first and second terminals; forming a first hole (4) extending through the layer of insulative material and connecting an overlapping portion of the first conductive track to one of the first and second terminals; and filling said first hole at least partly with electrically conductive material.

    STRUCTURES COMPRISING PLANAR ELECTRONIC DEVICES
    3.
    发明公开
    STRUCTURES COMPRISING PLANAR ELECTRONIC DEVICES 审中-公开
    STRUKTUREN MIT PLANAREN ELEKTRONISCHEN ELEMENTEN

    公开(公告)号：EP2474029A1

    公开(公告)日：2012-07-11

    申请号：EP10763001.4

    申请日：2010-09-02

    申请人： Pragmatic Printing Ltd

    发明人： PRICE, Richard David ,  BARTON, Ian

    IPC分类号： H01L21/768 ,  H01L21/762

    CPC分类号： H01L21/76817 ,  H01L21/288 ,  H01L21/76877 ,  H01L21/7688

    摘要： A method of manufacturing a structure comprising at least one substantially planar electronic device is provided. The method comprises: providing a layer of active material (10) having a plurality of insulative features (12) formed therein, each insulative feature at least partly inhibiting electrical current flow in said layer, and the plurality of insulative features defining at least a first substantially planar electronic device in said layer having at least a respective first terminal (31) and a respective second terminal (32), each terminal comprising a respective area of the layer of active material; forming a patterned layer of dielectric material (2) over the layer of active material, the patterned layer of dielectric material having an exposed surface patterned with at least a first depression (221) arranged over said first terminal; removing dielectric material at least from a base of said first depression to expose a surface of the first terminal and form a first hole (201) through the dielectric material to the first terminal; and filling, at least partly, said first hole with electrically conductive material (4) to form an electrical connection to the first terminal. Corresponding structures and electrical circuits are also described and claimed.

    摘要翻译： 制造包括基本上平面的电子器件的结构的方法包括提供其中形成有多个绝缘特征的活性材料层。 这些特征至少部分地抑制电流流动并且限定该层中的至少第一基本上平面的电子器件，其具有包括活性材料层的区域的至少第一和第二端子。 在活性材料层上形成具有图案化的具有图案化的至少第一凹陷的第一凹陷的图案化介电层。 电介质材料从第一凹陷的至少一个基底去除以暴露出第一端子表面，并通过电介质材料形成到第一端子的孔。 孔至少部分地填充有导电材料以形成与第一端子的电连接。 还描述和要求保护相应的结构和电路。