公开(公告)号：EP4183514A1

公开(公告)日：2023-05-24

申请号：EP20953276.1

申请日：2020-09-10

申请人： Primetals Technologies Japan, Ltd.

发明人： YAGI, Takahiro ,  KAGA, Shinichi ,  WATANABE, Yujiro ,  OKUDA, Takehisa

IPC分类号： B23K26/067 ,  B23K26/21

摘要： A laser processing method includes a step of processing a workpiece by relatively moving the workpiece with respect to a plurality of laser spots including a first spot, a second spot, and a third spot which are linearly arranged so that the first spot, the second spot, and the third spot pass through a processing target portion of the workpiece in this order. To a total amount of energy of laser beam in the first spot, the second spot, and the third spot, a ratio of energy in the first spot is not less than 20% and not more than 30%, a ratio of energy in the second spot is not less than 20% and not more than 30%, and a ratio of energy in the third spot is not less than 45% and not more than 55%.