LASER PROCESSING METHOD
    2.
    发明公开

    公开(公告)号:EP4183514A1

    公开(公告)日:2023-05-24

    申请号:EP20953276.1

    申请日:2020-09-10

    IPC分类号: B23K26/067 B23K26/21

    摘要: A laser processing method includes a step of processing a workpiece by relatively moving the workpiece with respect to a plurality of laser spots including a first spot, a second spot, and a third spot which are linearly arranged so that the first spot, the second spot, and the third spot pass through a processing target portion of the workpiece in this order. To a total amount of energy of laser beam in the first spot, the second spot, and the third spot, a ratio of energy in the first spot is not less than 20% and not more than 30%, a ratio of energy in the second spot is not less than 20% and not more than 30%, and a ratio of energy in the third spot is not less than 45% and not more than 55%.