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    ACTIVE HEAT FLOW CONTROL WITH THERMOELECTRIC LAYERS
    2.
    发明公开
    ACTIVE HEAT FLOW CONTROL WITH THERMOELECTRIC LAYERS 审中-公开
    AKI WESTMETLUTERSTEUERUNG MIT THERMOELEKTRISCHEN SCHICHTEN

    公开(公告)号：EP3111295A1

    公开(公告)日：2017-01-04

    申请号：EP15713037.8

    申请日：2015-02-13

    申请人： Qualcomm Incorporated

    发明人： PARK, Hee Jun ,  CHIRIAC, Victor Adrian ,  ANDERSON, Jon James ,  TU, Alex Kuang-Hsuan

    IPC分类号： G06F1/20

    CPC分类号： F25B21/04 ,  F25B21/02 ,  F25B2321/021 ,  G06F1/203 ,  G06F1/206

    摘要： Methods and apparatuses for controlling heat flow in a mobile system. The method includes determining a temperature value for each of at least one temperature sensors. The method determines a delta value of a current temperature threshold at each of the plurality of locations. The method maps each delta value to a thermal module. The method calculates a heat flow direction signal to minimize positive delta values using at least one of the following: a system level model and an IC level thermal model. The method transmits the heat flow direction signal to at least one thermoelectric module, wherein the thermoelectric module is associated with more than one temperature sensor.

    摘要翻译： 用于控制移动系统中的热流的方法和装置。 该方法包括确定至少一个温度传感器中的每一个的温度值。 该方法确定多个位置中的每一个处的当前温度阈值的增量值。 该方法将每个增量值映射到热模块。 该方法计算热流方向信号以使用以下至少一个来最小化正增量值：系统级模型和IC级热模型。 该方法将热流方向信号发送到至少一个热电模块，其中热电模块与多于一个的温度传感器相关联。

    HIGH DATA RATE INTERFACE
    4.
    发明公开
    HIGH DATA RATE INTERFACE 审中-公开
    霍恩霍恩德

    公开(公告)号：EP1680904A1

    公开(公告)日：2006-07-19

    申请号：EP04795302.1

    申请日：2004-10-15

    申请人： QUALCOMM INCORPORATED

    发明人： ANDERSON, Jon James ,  STEELE, Brian ,  WILEY, George A. ,  SHEKHAR, Shashank

    IPC分类号： H04L29/06 ,  H04L12/28 ,  H04L12/56

    CPC分类号： H04L12/40052 ,  H04L47/283 ,  H04L65/608 ,  H04L69/03 ,  H04L69/10 ,  H04L69/18 ,  H04L69/323 ,  H04L69/324 ,  H04M1/72527 ,  Y02D70/00 ,  Y02D70/122 ,  Y02D70/144 ,  Y02D70/26

    摘要： A method for providing client supported features and capabilities to a host in a mobile display digital interface (MDDI) system, the method comprising the steps of adding at least one field to a client capability packet for the client supported features and capabilities; providing values to each field of the at least one field unique to at least one client in the client capability packet; and transmitting the client capability packet from the at least one client to the host as well as a corresponding apparatus.

    摘要翻译： 一种用于向移动显示数字接口（MDDI）系统中的主机提供客户机支持的特征和能力的方法，所述方法包括以下步骤：将至少一个字段添加到客户机支持的特征和能力的客户端能力分组; 向所述客户端能力分组中的至少一个客户端唯一的所述至少一个字段的每个字段提供值; 以及将所述客户端能力分组从所述至少一个客户端发送到所述主机以及相应的设备。

    SKIN MATERIAL DESIGN TO REDUCE TOUCH TEMPERATURE
    5.
    发明公开
    SKIN MATERIAL DESIGN TO REDUCE TOUCH TEMPERATURE 有权
    HAUTMATERIALKONSTRUKTION ZUR REDUZIERUNG DERBERÜHRUNGSTEMPERATUR

    公开(公告)号：EP3117174A1

    公开(公告)日：2017-01-18

    申请号：EP15718646.1

    申请日：2015-03-13

    申请人： Qualcomm Incorporated

    发明人： VADAKKANMARUVEEDU, Unnikrishnan ,  ANDERSON, Jon James ,  MITTER, Vinay ,  WANG, Peng

    IPC分类号： F28F13/00 ,  G06F1/16 ,  G06F1/18 ,  G06F1/20

    摘要： An electronic device includes a housing with a plurality of sides and electronics components in the housing. A porous and thermally conductive material is associated with the housing. The material has a thermal conductively (k), and a porosity between 10% and 70% that results in a specific heat (ρ) and density (Cp) for the material, such that k*ρ*Cp is between 0 (J*W)/(m4*K2) and 1,000,000 (J*W)/(m4*K2). The material may be: a glass-based material having a thermal conductivity between 0.5-2 W/m-K, a density between 1000-2500 kg/m3, and a specific heat between 500-1000 J/kg-K; a metal-based material having a thermal conductivity between 300-400 W/m-K, a density between 4000-8000 kg/m3, and a specific heat between 200-300 J/kg-K; and a plastic-based material having a thermal conductivity may be between 0.1-0.4 W/m-K, a density between 400-1000 kg/m3, and a specific heat between 1900-2000 J/kg-K.

    摘要翻译： 电子设备包括壳体，壳体具有多个侧面和壳体中的电子部件。 多孔和导热材料与壳体相关联。 该材料具有导热性（k）和10％至70％之间的孔隙率，其导致材料的比热（＆rgr;）和密度（Cp），使得k *＆rgr; * Cp在0（ J * W）/（m4 * K2）和1,000,000（J * W）/（m4 * K2）。 该材料可以是：具有介于0.5-2W / m-K之间的热导率，1000-2500kg / m 3之间的密度和500-1000J / kg-K之间的比热的玻璃基材料; 热导率在300-400W / m-K之间，密度在4000-8000kg / m3之间，比热在200-300J / kg-K之间的金属基材料; 并且具有导热性的塑料基材料可以在0.1-0.4W / m-K之间，密度在400-1000kg / m 3之间，比热在1900-2000J / kg-K之间。

    HIGH DATA RATE INTERFACE APPARATUS AND METHOD
    6.
    发明公开
    HIGH DATA RATE INTERFACE APPARATUS AND METHOD 审中-公开
    霍尼韦尔（VERFAHRENFÜRHOHE DATENRATEN）

    公开(公告)号：EP1735988A1

    公开(公告)日：2006-12-27

    申请号：EP05730213.5

    申请日：2005-03-24

    申请人： Qualcomm, Incorporated

    发明人： ANDERSON, Jon James ,  STEELE, Brian ,  WILEY, George A. ,  SHEKHAR, Shashank

    IPC分类号： H04L29/06 ,  H04L12/28 ,  H04L12/56

    CPC分类号： H04L67/303 ,  H04L29/06027 ,  H04L65/1069 ,  H04L65/4069 ,  H04L65/80 ,  H04L69/18 ,  H04L69/22 ,  H04L69/24 ,  H04M1/72527 ,  Y02D70/122 ,  Y02D70/144 ,  Y02D70/26

    摘要： A data interface for transferring digital data between a host and a client over a communication path using packet structures linked together to form a communication protocol for communicating a pre-selected set of digital control and presentation data. The signal protocol is used by link controllers configured to generate, transmit, and receive packets forming the communications protocol, and to form digital data into one or more types of data packets, with at least one residing in the host device and being coupled to the client through the communications path. The interface provides a cost-effective, low power, bi-directional, high-speed data transfer mechanism over a short-range "serial" type data link, which lends itself to implementation with miniature connectors and thin flexible cables which are especially useful in connecting display elements such as wearable micro-displays to portable computers and wireless communication devices.

    摘要翻译： 一种数据接口，用于通过连接在一起的分组结构通过通信路径在主机和客户端之间传送数字数据，以形成用于传送预先选择的一组数字控制和呈现数据的通信协议。 信号协议被配置为生成，发送和接收形成通信协议的分组的链路控制器使用，并且将数字数据形成为一个或多个类型的数据分组，其中至少一个驻留在主机设备中并耦合到 客户端通过通信路径。 该接口通过短距离“串行”类型的数据链路提供了一种经济高效，低功耗，双向，高速的数据传输机制，可实现微型连接器和薄型柔性电缆，特别适用于 将可穿戴式微型显示器等显示元件连接到便携式计算机和无线通信设备。

    METHOD AND SYSTEM FOR LEAVING A COMMUNICATION CHANNEL IN A WIRELESS COMMUNICATIONS SYSTEM
    7.
    发明公开
    METHOD AND SYSTEM FOR LEAVING A COMMUNICATION CHANNEL IN A WIRELESS COMMUNICATIONS SYSTEM 审中-公开
    方法和系统留下一个通信信道无线通信系统

    公开(公告)号：EP1527532A2

    公开(公告)日：2005-05-04

    申请号：EP03785127.6

    申请日：2003-08-07

    申请人： Qualcomm, Incorporated

    发明人： ANDERSON, Jon James ,  TUYSSERKANI, Bijan

    IPC分类号： H04B7/26

    CPC分类号： H04W56/0035 ,  H04W56/001 ,  H04W92/10

    摘要： A method and system for reliably returning to a traffic channel in a wireless communications system after performing E911 GPS measurements is provided. The method establishes a communications link using a device in a communications system having at least one communication channel. The device also includes a processor and a tuner and is configured to establish communication over the communication channel. The communication is based upon receiving a first radio frequency (RF) signal including data frames. The method includes tuning to receive a second RF signal, wherein the tuning interrupts reception of the first RF signal. The communication over the communication channel is maintained during the interruption. The method also includes processing the data frames during the tuning, updating a signal search space associated with the first RF signal during the processing, and searching for the first RF signal within the updated search space. The first RF signal is then re-acquired in accordance with the searching.

    ENERGY EFFICIENCY AWARE THERMAL MANAGEMENT IN A MULTI-PROCESSOR SYSTEM ON A CHIP
    10.
    发明公开
    ENERGY EFFICIENCY AWARE THERMAL MANAGEMENT IN A MULTI-PROCESSOR SYSTEM ON A CHIP 审中-公开
    ENEGIEEFFIZIENZBEWUSSTEWÄRMEVERWALTUNG在EINEM MEHRPROZESSORSYSTEM AUF EINEM CHIP

    公开(公告)号：EP3129853A1

    公开(公告)日：2017-02-15

    申请号：EP15719923.3

    申请日：2015-04-08

    申请人： Qualcomm Incorporated

    发明人： PARK, Hee Jun ,  KANG, Young Hoon ,  ALTON, Ronald Frank ,  MEDRANO, Christopher Lee ,  ANDERSON, Jon James

    IPC分类号： G06F1/20 ,  G06F1/26

    CPC分类号： G05D23/1917 ,  G05B15/02 ,  G06F1/203 ,  G06F1/206 ,  G06F1/26 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  G06F11/30 ,  G06F11/34 ,  Y02D10/16

    摘要： Various embodiments of methods and systems for energy efficiency aware thermal management in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, energy efficiency aware thermal management techniques that compare performance data of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by adjusting the power supplies to, reallocating workloads away from, or transitioning the power mode of, the least energy efficient processing components. In these ways, embodiments of the solution optimize the average amount of power consumed across the SoC to process a MIPS of workload.

    摘要翻译： 公开了在包含芯片上的异构多处理器系统（“SoC”）的便携式计算设备中的用于能量效率感知热管理的方法和系统的各种实施例。 由于异构多处理器SoC中的单独处理组件可能在给定温度下可能表现出不同的处理效率，因此可以利用能量效率感知热管理技术来比较其测量工作温度下各个处理组件的性能数据，从而优化服务质量 （“QoS”），通过调节电源，重新分配工作负载远离或转换最低能效处理组件的功率模式。 以这些方式，该解决方案的实施例优化了整个SoC消耗的平均功耗量，以处理工作负载的MIPS。