公开(公告)号：EP0217678B1

公开(公告)日：1992-09-09

申请号：EP86307686.5

申请日：1986-10-06

申请人： RAYCHEM CORPORATION (a Delaware corporation)

发明人： Grassauer, Willie K.

IPC分类号： H01L21/00

CPC分类号： H05K7/1076 ,  H05K3/303 ,  H05K3/3442 ,  H05K3/3478 ,  H05K7/1053 ,  H05K2201/09181 ,  H05K2201/10424 ,  H05K2201/10727 ,  H05K2201/10984 ,  H05K2203/0195 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/53261

公开(公告)号：EP0217678A3

公开(公告)日：1989-08-16

申请号：EP86307686.5

申请日：1986-10-06

申请人： RAYCHEM CORPORATION (a Delaware corporation)

发明人： Grassauer, Willie K.

IPC分类号： H01L21/00

CPC分类号： H05K7/1076 ,  H05K3/303 ,  H05K3/3442 ,  H05K3/3478 ,  H05K7/1053 ,  H05K2201/09181 ,  H05K2201/10424 ,  H05K2201/10727 ,  H05K2201/10984 ,  H05K2203/0195 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/53261

摘要： A device and method for aligning and assembling castellated chip carriers with other electrical components such as printed circuit boards or other chip carriers is disclosed. The device provides means for compressively engaging the castellations in the chip carrier thereby providing precise alignment and positioning of the chip carriers relative to other components with which it is assembled. A method utilizing the device and a solder column placement device to produce a pre-leaded castellated ship carrier is also disclosed.

公开(公告)号：EP0217678A2

公开(公告)日：1987-04-08

申请号：EP86307686.5

申请日：1986-10-06

申请人： RAYCHEM CORPORATION (a Delaware corporation)

发明人： Grassauer, Willie K.

IPC分类号： H01L21/00

CPC分类号： H05K7/1076 ,  H05K3/303 ,  H05K3/3442 ,  H05K3/3478 ,  H05K7/1053 ,  H05K2201/09181 ,  H05K2201/10424 ,  H05K2201/10727 ,  H05K2201/10984 ,  H05K2203/0195 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/53261

摘要： A device and method for aligning and assembling castellated chip carriers with other electrical components such as printed circuit boards or other chip carriers is disclosed. The device provides means for compressively engaging the castellations in the chip carrier thereby providing precise alignment and positioning of the chip carriers relative to other components with which it is assembled. A method utilizing the device and a solder column placement device to produce a pre-leaded castellated ship carrier is also disclosed.