中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

13 records (took 0.011 seconds)

    MEMS PIEZOELECTRIC ACCELEROMETER WITH BUILT-IN SELF TEST
    3.
    发明授权
    MEMS PIEZOELECTRIC ACCELEROMETER WITH BUILT-IN SELF TEST 有权

    公开(公告)号：EP3196660B1

    公开(公告)日：2018-09-05

    申请号：EP17151733.7

    申请日：2017-01-17

    Applicant: Rosemount Aerospace Inc.

    Inventor： ZHANG, Weibin ,  HUYNH, Cuong Tho ,  McTighe, James Joseph

    IPC: G01P15/09 ,  G01P21/00

    CPC classification number: G01P15/09 ,  G01P15/0922 ,  G01P21/00

    Abstract: Apparatus and associated methods relate to an accelerometer (10, 40, 70) having first and second piezoelectric transducers (28a, 28b, 30a, 30b) that are electrically isolated but mechanically coupled one to another via a coupling member (14a, 14b, 44). The first piezoelectric transducer (28a, 28b) is configured to induce a mechanical deformation of the coupling member in response to an electrical excitation signal received by the first piezoelectric transducer. The second piezoelectric transducer (30a, 30b) is configured to generate an electrical response signal in response to mechanical deformation of the coupling member. The accelerometer has a self-test module (104) configured to generate the electrical excitation signal and to receive the electrical response signal. The self-test module (104) is further configured to generate a sensor test result based upon a comparison between the received electrical response signal and a reference signal. The self-test module (104) may advantageously detect changes in an excitation/response relation due to time and/or environmental conditions, for example.

    SYMMETRIC MEMS PIEZOELECTRIC ACCELEROMETER FOR LATERAL NOISE REDUCTION
    4.
    发明公开
    SYMMETRIC MEMS PIEZOELECTRIC ACCELEROMETER FOR LATERAL NOISE REDUCTION 审中-公开
    用于横向降噪的对称MEMS压电加速度计

    公开(公告)号：EP3220153A1

    公开(公告)日：2017-09-20

    申请号：EP17156924.7

    申请日：2017-02-20

    Applicant: Rosemount Aerospace Inc.

    Inventor： ZHANG, Weibin

    IPC: G01P15/09

    CPC classification number: G01P15/0922

    Abstract: Apparatus and associated methods relate to maximizing a signal to noise ratio of an accelerometer by inhibiting signals arising from movements of a proofmass (12) in directions perpendicular to a direction of intended sensitivity. The direction of intended sensitivity of the accelerometer is along an axis of the proofmass (12). The accelerometer is rendered substantially insensitive to lateral accelerations of the proofmass by making the accelerometer axially symmetric. Two axially-asymmetric acceleration sensing devices (10) are axially engaged in such a manner as to render the coupled sensing devices substantially axially-symmetric. In some embodiments, each acceleration sensor (10) has an axially-thin membrane portion (14a, 14b, 14c) extending from a proofmass portion (12). The two acceleration sensors (10) can be engaged in an antiparallel fashion at projecting ends of the proofinass portions. An engagement surface will be located about halfway between the axially-thin membrane portions of the two acceleration sensors, thereby causing mechanical symmetry about the engagement surface.

    Abstract translation: 装置和相关方法涉及通过在垂直于预期灵敏度方向的方向上抑制由检验质量（12）的运动引起的信号来最大化加速度计的信噪比。 加速度计的预期灵敏度的方向沿着验证体（12）的轴线。 通过使加速度计轴向对称，使加速度计对检测质量的横向加速度基本上不敏感。 两个轴向不对称的加速度感测装置（10）以这样的方式轴向接合，使得耦合的感测装置基本轴向对称。 在一些实施例中，每个加速度传感器（10）具有从质量块部分（12）延伸的轴向薄膜部分（14a，14b，14c）。 两个加速度传感器（10）可以在防护部分的突出端处以反平行方式接合。 接合表面将位于两个加速度传感器的轴向薄膜部分之间的大约一半处，由此引起关于接合表面的机械对称性。

    HIGH TEMPERATURE PIEZO-RESISTIVE PRESSURE SENSOR AND PACKAGING ASSEMBLY THEREFOR
    5.
    发明公开
    HIGH TEMPERATURE PIEZO-RESISTIVE PRESSURE SENSOR AND PACKAGING ASSEMBLY THEREFOR 审中-公开

    公开(公告)号：EP4428091A3

    公开(公告)日：2024-12-18

    申请号：EP24161954.3

    申请日：2024-03-07

    Applicant: ROSEMOUNT AEROSPACE INC.

    Inventor： ZHENG, Jun ,  ZHANG, Weibin

    IPC: B81B3/00

    Abstract: A packaged pressure sensor assembly is disclosed that includes a pressure sensor (100, 200) including an upper substrate and a lower substrate bonded to one another by way of a first glass frit having a first bonding temperature, so as to define a hermetically sealed pressure sensing chamber therebetween, and a housing defining an internal cavity having a base with a support surface for supporting the pressure sensor (100, 200), wherein the pressure sensor (100, 200) is bonded to the support surface of the base by a second glass frit having a second bonding temperature that is lower than the first bonding temperature.

    HIGH TEMPERATURE CAPACITIVE PRESSURE SENSOR FABRICATED WITH VIA-FILLED SAPPHIRE WAFERS
    6.
    发明公开
    HIGH TEMPERATURE CAPACITIVE PRESSURE SENSOR FABRICATED WITH VIA-FILLED SAPPHIRE WAFERS 审中-公开

    公开(公告)号：EP3627128A1

    公开(公告)日：2020-03-25

    申请号：EP19197857.6

    申请日：2019-09-17

    Applicant: ROSEMOUNT AEROSPACE INC.

    Inventor： ZHANG, Weibin

    IPC: G01L9/00

    Abstract: A high temperature capacitive pressure sensor (10; 10A; 10B) includes a first sapphire wafer (12; 12A; 12B) having a first exterior wafer surface (26; 26A; 26B) and a first interior wafer surface (28; 28A; 28B), a recess (32; 32A; 32B) extending into the first sapphire wafer (12; 12A; 12B), a second sapphire wafer (18; 18A; 18B) having a second exterior wafer surface (40; 40A; 40B) and a second interior wafer surface (42; 42A; 42B), a first hole (30; 30A; 30B) extending through the first sapphire wafer (12; 12A; 12B), a second hole (44; 44A; 44B) extending through the first sapphire wafer (12; 12A; 12B) or the second sapphire wafer (18; 18A; 18B), a first via (14; 14A; 14B) that solidly fills the first hole (30; 30A; 30B), the first via (14; 14A; 14B) including a first interior via surface (36; 36A; 36B) aligned with the first interior wafer surface (28; 28A; 28B), a second via (20; 20A; 20B) that solidly fills the second hole (44; 44A; 44B), the second via (20; 20A; 20B) including a second interior via surface (48; 48A; 48B) aligned with the interior wafer surface of the sapphire wafer within which the second via (20; 20A; 20B) extends, a first electrode (16; 16A; 16B) deposited on the first interior wafer surface (28; 28A; 28B) covering and contacting the first interior via surface (36; 36A; 36B).

    OPEN DIAPHRAGM HARSH ENVIRONMENT PRESSURE SENSOR
    8.
    发明公开
    OPEN DIAPHRAGM HARSH ENVIRONMENT PRESSURE SENSOR 审中-公开
    开放式隔膜环境压力传感器

    公开(公告)号：EP3205998A1

    公开(公告)日：2017-08-16

    申请号：EP17155350.6

    申请日：2017-02-09

    Applicant: Rosemount Aerospace Inc.

    Inventor： POTASEK, David P. ,  LITTLE, Charles ,  ZHANG, Weibin

    IPC: G01L19/14 ,  G01L19/06

    CPC classification number: G01L19/0645 ,  G01L9/0052 ,  G01L9/0072 ,  G01L19/0618 ,  G01L19/146 ,  G01L19/147

    Abstract: A pressure sensor comprising a housing (62, 64), a diaphragm wafer (68), and an isolator (66) configured to absorb lateral stress. The diaphragm wafer (68) includes a fully exposed diaphragm (69), a fluid contact surface, a sensing element (74), and a support portion, where the support portion and the contact surface define a cavity. The isolator (66) extends laterally from the support portion to the housing (62, 64). The pressure sensor is easily drainable, eliminating the buildup of particulates, and the diaphragm (69) can be directly wire-bonded to printed circuit boards, eliminating the need for extensive electrical feedthrough.

    Abstract translation: 一种压力传感器，包括壳体（62,64），隔膜晶片（68）和构造成吸收侧向应力的隔离器（66）。 隔膜晶片（68）包括完全暴露的隔膜（69），流体接触表面，感测元件（74）和支撑部分，其中支撑部分和接触表面限定了空腔。 隔离器（66）从支撑部分横向延伸到壳体（62,64）。 压力传感器很容易排空，消除了微粒的积聚，膜片（69）可以直接引线键合到印刷电路板上，从而不需要大量的电气馈通。

    PSEUDO DIFFERENTIAL PRESSURE SENSING BRIDGE CONFIGURATION
    9.
    发明公开
    PSEUDO DIFFERENTIAL PRESSURE SENSING BRIDGE CONFIGURATION 审中-公开
    伪微分压力感应桥配置

    公开(公告)号：EP3196618A2

    公开(公告)日：2017-07-26

    申请号：EP17152332.7

    申请日：2017-01-20

    Applicant: Rosemount Aerospace Inc.

    Inventor： ZHANG, Weibin

    IPC: G01L9/00 ,  G01L9/06 ,  G01L13/02 ,  G01L15/00

    CPC classification number: G01L9/0052 ,  G01L9/0055 ,  G01L9/06 ,  G01L13/00 ,  G01L13/025 ,  G01L15/00

    Abstract: Apparatus and associated methods relate to generating a signal indicative of a differential pressure using a first absolute pressure sensor (10') and a second absolute pressure sensor (10"), each having a positive relation transducer configured to generate an electrical signal that increases in response to increasing pressure and a negative relation transducer configured to generate an electrical signal that decreases in response to increasing pressure. The first and second positive relation transducers of the first and second absolute pressure sensors, respectively, are electrically connected as a first leg of a Wheatstone bridge (40) at a first output node. The first and second negative relation transducers of the first and second absolute pressure sensors, respectively, are electrically connected as a second leg of a Wheatstone bridge at a second output node. Both positive and both negative relation transducers are connected to a first and a second bias node of the Wheatstone bridge, respectively.

    Abstract translation: 装置和相关方法涉及使用第一绝对压力传感器（10'）和第二绝对压力传感器（10“）来产生指示差压的信号，每个第一绝对压力传感器（10'）和第二绝对压力传感器（10”）均具有构造成产生电信号的正相关换能器， 响应于增加的压力和负相关传感器，所述传感器被配置成产生响应于增加的压力而减小的电信号。第一和第二绝对压力传感器的第一和第二正关系传感器分别电连接作为 在第一输出节点处的惠斯登电桥（40），第一和第二绝对压力传感器的第一和第二负关系传感器分别在第二输出节点处作为惠斯登电桥的第二支路电连接， 负关系传感器连接到惠斯通电桥的第一和第二偏置节点 ， 分别。

    SYMMETRIC MEMS PIEZOELECTRIC ACCELEROMETER FOR CROSS-AXIS NOISE REDUCTION
    10.
    发明授权
    SYMMETRIC MEMS PIEZOELECTRIC ACCELEROMETER FOR CROSS-AXIS NOISE REDUCTION 有权

    公开(公告)号：EP3220153B1

    公开(公告)日：2018-10-24

    申请号：EP17156924.7

    申请日：2017-02-20

    Applicant: Rosemount Aerospace Inc.

    Inventor： ZHANG, Weibin

    IPC: G01P15/09

    CPC classification number: G01P15/0922

    Abstract: Apparatus and associated methods relate to maximizing a signal to noise ratio of an accelerometer by inhibiting signals arising from movements of a proofmass (12) in directions perpendicular to a direction of intended sensitivity. The direction of intended sensitivity of the accelerometer is along an axis of the proofmass (12). The accelerometer is rendered substantially insensitive to lateral accelerations of the proofmass by making the accelerometer axially symmetric. Two axially-asymmetric acceleration sensing devices (10) are axially engaged in such a manner as to render the coupled sensing devices substantially axially-symmetric. In some embodiments, each acceleration sensor (10) has an axially-thin membrane portion (14a, 14b, 14c) extending from a proofmass portion (12). The two acceleration sensors (10) can be engaged in an antiparallel fashion at projecting ends of the proofinass portions. An engagement surface will be located about halfway between the axially-thin membrane portions of the two acceleration sensors, thereby causing mechanical symmetry about the engagement surface.

Patent Agency Ranking