公开(公告)号：EP4432429A1

公开(公告)日：2024-09-18

申请号：EP22892590.5

申请日：2022-10-26

申请人： Resonac Packaging Corporation

发明人： KODA Naoya ,  YOSHINO Kenji ,  NAKAJIMA Daisuke

IPC分类号： H01M50/105 ,  H01G11/78 ,  H01G11/80 ,  H01M50/117 ,  H01M50/121 ,  H01M50/122 ,  H01M50/129 ,  H01M50/133

CPC分类号： H01M50/105 ,  H01G11/78 ,  H01M50/117 ,  H01M50/121 ,  H01M50/133 ,  H01M50/122 ,  H01G11/80 ,  H01M50/129 ,  Y02E60/10

摘要： A packaging material for a power storage device with excellent moldability is provided. The present invention is directed to a packaging material for a power storage device. The packaging material includes a metal foil layer 4, a substrate layer 2 made of a resin and provided on the outer side of the metal foil layer 4, an adhesive layer 5 provided on the inner side of the metal foil layer 4, and a heat-fusible layer 3 made of heat-fusible resin and provided on the inner side of the adhesive layer 5. The heat-fusible layer 3 includes a metal foil side layer portion 33 bonded to the adhesive layer 5 and a seal layer portion 31 located on the innermost surface. Particles with an average particle diameter of 0.05 µm or more but less than 5 µm are defined as "micro particles," and particles with an average particle size of 5 µm or more but less than 20 µm are defined as "coarse particles." The seal layer portion 31 is composed of a layer containing the micro particles and the coarse particles, and the metal foil side layer portion 31 is composed of a constituent layer that contains the micro particles but does not contain particles with an actual particle size of 5 µm or larger.