公开(公告)号：EP2050171B1

公开(公告)日：2012-03-28

申请号：EP07787701.7

申请日：2007-07-18

申请人： Robert Bosch GmbH

发明人： KERSTING, Hermann ,  KAISER, Thomas ,  SCHOLZ, Dirk

IPC分类号： H01T13/36 ,  H01T13/34 ,  H01T13/20

CPC分类号： H01T13/36 ,  H01T13/20 ,  H01T13/34

摘要： The present invention relates to a spark plug for an internal combustion engine, comprising an electrical connecting means (8) at a connection-side end (11), an end (10) on the combustion-chamber side and pointing towards a combustion chamber, an insulator (2) and a housing (3) with a thread (4) for attaching the spark plug to an engine component, with a first sealing area (20) and a second sealing area (21) being formed between the insulator (2) and the housing (3), with the first sealing area (20) being arranged closer to the connection-side end (11), and with the second sealing area (21) being arranged closer to the end (10) on the combustion-chamber side, with a tool engagement area (6) being arranged adjacent to an area (L1) of the spark plug which is located between the connection-side end (11) and the first sealing area (20) in order to transmit a torque to the spark plug in order to fit or to move the spark plug.

公开(公告)号：EP2050171A1

公开(公告)日：2009-04-22

申请号：EP07787701.7

申请日：2007-07-18

申请人： Robert Bosch GmbH

发明人： KERSTING, Hermann ,  KAISER, Thomas ,  SCHOLZ, Dirk

IPC分类号： H01T13/36 ,  H01T13/34 ,  H01T13/20

CPC分类号： H01T13/36 ,  H01T13/20 ,  H01T13/34

摘要： The present invention relates to a spark plug for an internal combustion engine, comprising an electrical connecting means (8) at a connection-side end (11), an end (10) on the combustion-chamber side and pointing towards a combustion chamber, an insulator (2) and a housing (3) with a thread (4) for attaching the spark plug to an engine component, with a first sealing area (20) and a second sealing area (21) being formed between the insulator (2) and the housing (3), with the first sealing area (20) being arranged closer to the connection-side end (11), and with the second sealing area (21) being arranged closer to the end (10) on the combustion-chamber side, with a tool engagement area (6) being arranged adjacent to an area (L1) of the spark plug which is located between the connection-side end (11) and the first sealing area (20) in order to transmit a torque to the spark plug in order to fit or to move the spark plug.

公开(公告)号：EP1145316A3

公开(公告)日：2002-02-13

申请号：EP00982969.8

申请日：2000-10-07

申请人： ROBERT BOSCH GMBH

发明人： WOLF, Kuno ,  KOELLE, Gerhard ,  ZAREMBA, Juergen ,  JACOB, Wolfgang ,  WALLRAUCH, Alexander ,  RUF, Christoph ,  SCHMID, Ralf ,  URBACH, Peter ,  BIRECKOVEN, Bernd ,  KRAUSS, Hans-Reiner ,  SCHOLZ, Dirk

IPC分类号： H01L25/07

CPC分类号： H01L25/071 ,  H01L23/5385 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1145316A2

公开(公告)日：2001-10-17

申请号：EP00982969.8

申请日：2000-10-07

申请人： ROBERT BOSCH GMBH

发明人： WOLF, Kuno ,  KOELLE, Gerhard ,  ZAREMBA, Juergen ,  JACOB, Wolfgang ,  WALLRAUCH, Alexander ,  RUF, Christoph ,  SCHMID, Ralf ,  URBACH, Peter ,  BIRECKOVEN, Bernd ,  KRAUSS, Hans-Reiner ,  SCHOLZ, Dirk

IPC分类号： H01L25/07

CPC分类号： H01L25/071 ,  H01L23/5385 ,  H01L2924/0002 ,  H01L2924/00

摘要： The invention relates to a power semiconductor module which comprises a stack of carrier substrates that are arranged in layers and one on top of the other and that are provided with at least one strip conductor on at least one main surface. At least one electronic semiconductor component is arranged between two adjacent carrier substrates of the stack. The semiconductor component is electrically contacted to at least one strip conductor of a carrier substrate that is arranged in the stack over the semiconductor component and to at least one additional strip conductor of a carrier substrate that is arranged in the stack under the semiconductor component and in such a way that heat is conducted. The aim of the invention is to provide improved heat emission and a construction that is as compact as possible at the same time. To this end, the two outer carrier substrates of the stack are configured as an upper and a lower wall of a closed housing component which surrounds the at least one semiconductor component. The gaps between the stacked carrier substrates are sealingly closed by means of a circulating wall that is fixed to the carrier substrates.