公开(公告)号：EP2220919A1

公开(公告)日：2010-08-25

申请号：EP08805254.3

申请日：2008-10-13

申请人： Robert Bosch GmbH

发明人： TAUBER, Peter ,  SENTUERK, Tuncay ,  SPEH, Ulrich

IPC分类号： H05K3/40

CPC分类号： H05K3/1225 ,  H01L21/486 ,  H01L21/4867 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/4061 ,  H05K2203/0191 ,  H05K2203/107 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The invention relates to a method for the production of a circuit board layer for a particularly multi-layer circuit board, wherein a ceramic foil is used that has a carrier foil disposed thereon, the carrier foil is perforated by lasing in order to form at least one conductor path, and/or the carrier foil and the ceramic foil are mutually perforated by lasing in order to form at least one feedthrough, the circuit board and/or the feedthrough are subsequently created by printing, wherein the carrier foil forms a screen print, and the carrier foil is subsequently removed from the ceramic foil.

公开(公告)号：EP1973740B1

公开(公告)日：2010-04-07

申请号：EP07703586.3

申请日：2007-01-02

申请人： Robert Bosch GmbH

发明人： MAIHOEFER, Bernd ,  MEIER, Andreas ,  LEVERKOEHNE, Mark ,  SPEH, Ulrich ,  LIEB, Gunther ,  LEONHARD, Alexandra ,  SCHAEFER, Joerg

IPC分类号： B41F15/34 ,  B41F15/36 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/34 ,  H05K3/40

CPC分类号： B41F15/34 ,  B41C1/14 ,  B41F15/36 ,  B41P2215/12 ,  H05K1/0306 ,  H05K3/005 ,  H05K3/1225 ,  H05K3/4053 ,  H05K3/4061

公开(公告)号：EP2227928A1

公开(公告)日：2010-09-15

申请号：EP08866243.2

申请日：2008-12-19

申请人： Robert Bosch GmbH

发明人： HORNIG, Peter ,  LEVERKOEHNE, Mark ,  JANOVSKY, Philipp ,  MAIHOEFER, Bernd ,  EGERTER, Juergen ,  ROETHLINGSHOEFER, Walter ,  KEIL, Stefan ,  NEUMANN, Harald ,  SCHLUCKWERDER, Heike ,  WERNER, Markus ,  SPEH, Ulrich ,  WESTPHAL, Frank ,  WEBER, Josef

IPC分类号： H05K1/16 ,  H05K3/12 ,  H05K1/09

CPC分类号： H05K1/167 ,  H01C17/06506 ,  H05K3/1241 ,  H05K2203/0126 ,  H05K2203/0545

摘要： Method for producing an electrical conductor (10) by applying at least one paste (13), in particular thick-film paste, to a substrate (16) by means of a dispensing process, characterized in that the paste (13) is applied in at least one strand (19, 19.1, 19.2, 19.3, 19.4, 19.5).

公开(公告)号：EP2220919B1

公开(公告)日：2011-12-28

申请号：EP08805254.3

申请日：2008-10-13

申请人： Robert Bosch GmbH

发明人： TAUBER, Peter ,  SENTUERK, Tuncay ,  SPEH, Ulrich

IPC分类号： H05K3/40

CPC分类号： H05K3/1225 ,  H01L21/486 ,  H01L21/4867 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/4061 ,  H05K2203/0191 ,  H05K2203/107 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： The invention relates to a method for the production of a circuit board layer for a particularly multi-layer circuit board, wherein a ceramic foil is used that has a carrier foil disposed thereon, the carrier foil is perforated by lasing in order to form at least one conductor path, and/or the carrier foil and the ceramic foil are mutually perforated by lasing in order to form at least one feedthrough, the circuit board and/or the feedthrough are subsequently created by printing, wherein the carrier foil forms a screen print, and the carrier foil is subsequently removed from the ceramic foil.

公开(公告)号：EP1973740A1

公开(公告)日：2008-10-01

申请号：EP07703586.3

申请日：2007-01-02

申请人： Robert Bosch GmbH

发明人： MAIHOEFER, Bernd ,  MEIER, Andreas ,  LEVERKOEHNE, Mark ,  SPEH, Ulrich ,  LIEB, Gunther ,  LEONHARD, Alexandra ,  SCHAEFER, Joerg

IPC分类号： B41F15/34 ,  B41F15/36 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H05K3/34 ,  H05K3/40

CPC分类号： B41F15/34 ,  B41C1/14 ,  B41F15/36 ,  B41P2215/12 ,  H05K1/0306 ,  H05K3/005 ,  H05K3/1225 ,  H05K3/4053 ,  H05K3/4061

摘要： The invention relates to a method for producing printing masks (10), in particular for squeegee printing methods and especially those used during the filling of at least one via (12) that is configured in a printed circuit board (11), in which method a template pattern that corresponds to an arrangement of vias (12) on the circuit board is reproduced on the mask (10). According to the invention, the template pattern that is reproduced on the mask (10) is produced during the same working process as the via or vias (12) on the printed circuit board (11), in particular in a punch operation that uses a cluster punch. The invention also relates to a mask.