CONDUCTIVE MULTILAYER SHEET FOR THERMAL FORMING APPLICATIONS
    10.
    发明公开
    CONDUCTIVE MULTILAYER SHEET FOR THERMAL FORMING APPLICATIONS 审中-公开
    用于热成型应用的导电多层片材

    公开(公告)号:EP3177677A1

    公开(公告)日:2017-06-14

    申请号:EP15728156.9

    申请日:2015-04-20

    摘要: A method of making a multilayer sheet includes: forming a substrate including a substrate first surface and a substrate second surface; applying a conductive layer including a base and a conductive coating to the substrate first surface; and applying an ultraviolet cured coating layer to a surface of the conductive layer opposite that in contact with the substrate second surface, wherein the ultraviolet cured coating layer comprises a multifunctional acrylate oligomer and an acrylate monomer; pressing the substrate, conductive layer, and ultraviolet cured coating layer together to form a stack; heating the stack; activating the ultraviolet cured coating layer with an ultraviolet radiation source; and removing the base from the stack leaving a conductive multilayer sheet; wherein the ultraviolet cured coating layer remains adhered to the conductive layer.

    摘要翻译: 一种制造多层片材的方法包括:形成包括基材第一表面和基材第二表面的基材; 将包括基底和导电涂层的导电层施加到基底第一表面; 以及将紫外线固化涂层施加到与所述基板第二表面相对的表面上的所述导电层的表面,其中所述紫外线固化涂层包含多官能丙烯酸酯低聚物和丙烯酸酯单体; 将基板,导电层和紫外线固化涂层压合在一起以形成叠层; 加热烟囱; 用紫外线辐射源活化紫外线固化涂层; 以及从堆叠中移除基底,留下导电多层片材; 其中所述紫外线固化涂层保持粘附于所述导电层。