Thermoelectric device and a method of manufacturing thereof
    2.
    发明公开
    Thermoelectric device and a method of manufacturing thereof 失效
    Thermoelektrische Anordnung und Herstellungsverfahrendafür

    公开(公告)号:EP1154495A3

    公开(公告)日:2002-03-06

    申请号:EP01202364.4

    申请日:1995-05-23

    IPC分类号: H01L35/32 H01L35/34

    CPC分类号: H01L35/32 H01L35/34

    摘要: A method of making a thermoelectric device (11) which is small, thin and capable of increasing a number of thermoelectric material chips (13, 14) per unit area. Respective thermoelectric material wafers (40) of P-type and N-type are bonded to substrates (42) for P-type and N-type provided with electrodes (43) each producing a gap therebetween. The thermoelectric material wafer bonded to the substrate is formed into the substrate bonded with thermoelectric material chips by cutting and eliminating unnecessary portions by utilising the gap. The substrates respectively bonded with P-type thermoelectric material chips and N-type thermoelectric material chips are opposed and distal ends of the chips and the electrodes on the substrate are bonded to thereby form PN junctions. Further, structures (44) are provided at surroundings of bonding portions on the substrate for positioning the bondings and for preventing a bonding material from oozing.

    摘要翻译: 热电装置(11)包括彼此串联布置的至少一对热电材料(153,154)和能够从热电材料接合线外侧的电极(156)。 电极(156)可以不同于用于输入/输出能够从热电装置的外部电连接的装置的一对电极(155)附接到位于外周的电极。 这使得能够检查热电装置的部件。

    Thermoelectric conversion device and method of manufacturing the same
    3.
    发明公开
    Thermoelectric conversion device and method of manufacturing the same 审中-公开
    热电转换器及其制备方法

    公开(公告)号:EP1079445A3

    公开(公告)日:2003-01-02

    申请号:EP00307137.0

    申请日:2000-08-21

    IPC分类号: H01L35/08 H01L35/34

    CPC分类号: H01L35/34 H01L35/16 H01L35/18

    摘要: A thermoelectric conversion device is manufactured by the following steps of forming. A metallic material is formed on a substrate. A photosensitive resin pattern is formed on the metallic material. Patterned n-type or p-type thermoelectric material elements having a predetermined thickness and electrode junction layers is formed by plating. Next, the photosensitive resin pattern is dissolved and the metallic material is removed. And the substrate having the p-type thermoelectric material elements and the substrate having the n-type thermoelectric material elements are joined with the electrode junction layers interposed between the each thermoelectric material elements and the opposed substrate.

    Thermoelectric device and a method of manufacturing thereof
    4.
    发明公开
    Thermoelectric device and a method of manufacturing thereof 失效
    热电组件的制造方法

    公开(公告)号:EP1154495A2

    公开(公告)日:2001-11-14

    申请号:EP01202364.4

    申请日:1995-05-23

    IPC分类号: H01L35/32 H01L35/34

    CPC分类号: H01L35/32 H01L35/34

    摘要: A method of making a thermoelectric device (11) which is small, thin and capable of increasing a number of thermoelectric material chips (13, 14) per unit area.
    Respective thermoelectric material wafers (40) of P-type and N-type are bonded to substrates (42) for P-type and N-type provided with electrodes (43) each producing a gap therebetween. The thermoelectric material wafer bonded to the substrate is formed into the substrate bonded with thermoelectric material chips by cutting and eliminating unnecessary portions by utilising the gap. The substrates respectively bonded with P-type thermoelectric material chips and N-type thermoelectric material chips are opposed and distal ends of the chips and the electrodes on the substrate are bonded to thereby form PN junctions. Further, structures (44) are provided at surroundings of bonding portions on the substrate for positioning the bondings and for preventing a bonding material from oozing.

    Thermoelectric conversion device and method of manufacturing the same
    5.
    发明公开
    Thermoelectric conversion device and method of manufacturing the same 审中-公开
    Thermoelektrik-Wandler和seine Herstellung

    公开(公告)号:EP1079445A2

    公开(公告)日:2001-02-28

    申请号:EP00307137.0

    申请日:2000-08-21

    IPC分类号: H01L35/08

    CPC分类号: H01L35/34 H01L35/16 H01L35/18

    摘要: A thermoelectric conversion device is manufactured by the following steps of forming. A metallic material is formed on a substrate. A photosensitive resin pattern is formed on the metallic material. Patterned n-type or p-type thermoelectric material elements having a predetermined thickness and electrode junction layers is formed by plating. Next, the photosensitive resin pattern is dissolved and the metallic material is removed. And the substrate having the p-type thermoelectric material elements and the substrate having the n-type thermoelectric material elements are joined with the electrode junction layers interposed between the each thermoelectric material elements and the opposed substrate.

    摘要翻译: 通过以下的成型工序制造热电转换元件。 在基板上形成金属材料。 在金属材料上形成感光性树脂图案。 通过电镀形成具有预定厚度的图案化的n型或p型热电材料元件和电极接合层。 接下来,使感光性树脂图案溶解,除去金属材料。 并且具有p型热电材料元件的基板和具有n型热电材料元件的基板与介于每个热电材料元件和相对基板之间的电极接合层接合。