Selective treatment of the surface of a microelectronic workpiece
    1.
    发明公开
    Selective treatment of the surface of a microelectronic workpiece 审中-公开
    Selektive Behandlung derOberflächeeines mikroelektronischenWerkstücks

    公开(公告)号:EP1589568A2

    公开(公告)日:2005-10-26

    申请号:EP05015153.9

    申请日:1999-03-15

    申请人: SEMITOOL, INC.

    摘要: This invention provides a process for treating a workpiece (10) having a front side (12), a back side (14), and an outer perimeter (16). In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front (12) or back (14) sides of the workpiece (10). Exclusion and / or application of the processing fluids occurs by applying one or more processing fluids to the workpiece (10) as the workpiece (10) and corresponding reactor (1100) are spinning about an axis of rotation (A) that is generally parallel (or antiparallel) to the vector defining the face of the workpiece (10) being processed. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

    摘要翻译: 本发明提供了一种用于处理具有前侧(12),后侧(14)和外周(16)的工件(10)的方法。 根据该过程,从工件(10)的前(12)或后(14)侧中的至少一个的外周缘选择性地施加或排除处理流体。 当工件(10)和对应的反应器(1100)围绕大致平行的旋转轴线(A)旋转时,通过将一种或多种加工流体施加到工件(10)而发生加工流体的排除和/或应用 或反平行)到限定被处理的工件(10)的面的向量。 使用一种或多种加工流体的流量,流体压力和/或旋转速率来控制从外周边缘选择性地施加或排除处理流体的程度。

    Selective treatment of the surface of a microelectronic workpiece
    2.
    发明公开
    Selective treatment of the surface of a microelectronic workpiece 审中-公开
    微电子工件的表面的选择性治疗

    公开(公告)号:EP1589568A3

    公开(公告)日:2009-02-25

    申请号:EP05015153.9

    申请日:1999-03-15

    申请人: SEMITOOL, INC.

    摘要: This invention provides a process for treating a workpiece (10) having a front side (12), a back side (14), and an outer perimeter (16). In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front (12) or back (14) sides of the workpiece (10). Exclusion and / or application of the processing fluids occurs by applying one or more processing fluids to the workpiece (10) as the workpiece (10) and corresponding reactor (1100) are spinning about an axis of rotation (A) that is generally parallel (or antiparallel) to the vector defining the face of the workpiece (10) being processed. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.