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公开(公告)号：EP0915939B1
公开(公告)日：2001-07-11
申请号：EP97935305.9
申请日：1997-08-05
申请人： SENCO PRODUCTS, INC
发明人： REMEROWSKI, David, L. , SHOMIER, Duane, C. , RACCA, Anthony, T. , LOCOCO, David, J. , PILIC, Vladimir
IPC分类号： C09J5/06
CPC分类号： C09J5/06 , B29C65/3636 , B29C65/364 , B29C65/3644 , B29C65/3676 , B29C65/3684 , Y10S428/913 , Y10T428/14 , Y10T428/1443 , Y10T428/1486 , Y10T428/2804 , Y10T428/2809 , Y10T428/2817
摘要： An adhesive device, featuring a target element, absorptive of electromagnetic waves, contiguous with a heat-activatable adhesive material, shaped into an article having a mathematically smooth perimeter, will facilitate a quick, neat, easy and secure assembly of associated component pieces or manufactured articles. Exposing the device to electromagnetic waves will produce heat energy which will activate the adhesive material and result in the bonding of the associated component pieces. This adhesive device is particularly beneficial when used within or between pieces to be assembled that are substantially transparent to electromagnetic waves.
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公开(公告)号：EP0915938A1
公开(公告)日：1999-05-19
申请号：EP97935304.0
申请日：1997-08-04
申请人： SENCO PRODUCTS, INC
CPC分类号： C09J5/06 , B29C65/3644 , B29C65/3676 , B29C65/3684 , B29K2709/02 , B29K2711/14
摘要： A clean, neat and effective method for adhering millwork to a work surface entails placing adjacent to the surfaces to be joined a device which comprises: a target element contiguous with a heat activatable adhesive material, said target element being absorbent of electromagnetic waves which are convertible to heat energy to activate said adhesive material, holding said surfaces together, and exposing said device to electromagnetic waves to produce heat sufficient to activate the adhesive material to effect a bonded relationship between the millwork and the work surface.
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公开(公告)号：EP0915938B1
公开(公告)日：2001-05-16
申请号：EP97935304.2
申请日：1997-08-04
申请人： SENCO PRODUCTS, INC
IPC分类号： C09J5/06
CPC分类号： C09J5/06 , B29C65/3644 , B29C65/3676 , B29C65/3684 , B29K2709/02 , B29K2711/14
摘要： A clean, neat and effective method for adhering millwork to a work surface entails placing adjacent to the surfaces to be joined a device which comprises: a target element contiguous with a heat activatable adhesive material, said target element being absorbent of electromagnetic waves which are convertible to heat energy to activate said adhesive material, holding said surfaces together, and exposing said device to electromagnetic waves to produce heat sufficient to activate the adhesive material to effect a bonded relationship between the millwork and the work surface.
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公开(公告)号：EP0915940A1
公开(公告)日：1999-05-19
申请号：EP97935312.0
申请日：1997-08-05
申请人： SENCO PRODUCTS, INC
CPC分类号： B29C65/364 , B29C65/3616 , B29C65/3644 , B29C65/3676 , B29C65/3684 , B29K2711/14 , C09J5/02 , C09J5/06
摘要： A clean, neat and effective method for adhesively assembling milled wood products entails placing adjacent to the surfaces to be joined a device which comprises: a target element contiguous with a heat activatable adhesive material, said target element being absorbent of electromagnetic waves which are convertible to heat energy to activate said adhesive material, holding said surfaces together, and exposing said device to electromagnetic waves to produce heat sufficient to activate the adhesive material to effect a bonded relationship between the assembled milled wood pieces.
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公开(公告)号：EP0915940B1
公开(公告)日：2001-03-28
申请号：EP97935312.5
申请日：1997-08-05
申请人： SENCO PRODUCTS, INC
CPC分类号： B29C65/364 , B29C65/3616 , B29C65/3644 , B29C65/3676 , B29C65/3684 , B29K2711/14 , C09J5/02 , C09J5/06
摘要： A clean, neat and effective method for adhesively assembling milled wood products entails placing adjacent to the surfaces to be joined a device which comprises: a target element contiguous with a heat activatable adhesive material, said target element being absorbent of electromagnetic waves which are convertible to heat energy to activate said adhesive material, holding said surfaces together, and exposing said device to electromagnetic waves to produce heat sufficient to activate the adhesive material to effect a bonded relationship between the assembled milled wood pieces.
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公开(公告)号：EP0915939A1
公开(公告)日：1999-05-19
申请号：EP97935305.0
申请日：1997-08-05
申请人： SENCO PRODUCTS, INC
发明人： REMEROWSKI, David, L. , SHOMIER, Duane, C. , RACCA, Anthony, T. , LOCOCO, David, J. , PILIC, Vladimir
CPC分类号： C09J5/06 , B29C65/3636 , B29C65/364 , B29C65/3644 , B29C65/3676 , B29C65/3684 , Y10S428/913 , Y10T428/14 , Y10T428/1443 , Y10T428/1486 , Y10T428/2804 , Y10T428/2809 , Y10T428/2817
摘要： An adhesive device, featuring a target element, absorptive of electromagnetic waves, contiguous with a heat-activatable adhesive material, shaped into an article having a mathematically smooth perimeter, will facilitate a quick, neat, easy and secure assembly of associated component pieces or manufactured articles. Exposing the device to electromagnetic waves will produce heat energy which will activate the adhesive material and result in the bonding of the associated component pieces. This adhesive device is particularly beneficial when used within or between pieces to be assembled that are substantially transparent to electromagnetic waves.
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