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公开(公告)号：EP3000555A1
公开(公告)日：2016-03-30
申请号：EP14783264.6
申请日：2014-03-28
发明人： KOROKI, Motoki , YOSHIKAWA, Shunsaku , OKADA, Sakie , ITOYAMA, Taro , KOMURO, Hideyuki , HIRAI, Naoko , SHIMIZU, Keitaro
摘要： A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. Said solder paste exhibits high joint strength at room temperature and at high temperatures, excels in terms of temporal stability, exhibits minimal void formation, and can form highly cohesive joints. Said solder paste comprises a powdered metal component and a flux component, said powdered metal component comprising the following: a powdered intermetallic compound that comprises copper and tin and has metal barrier layers covering the surfaces thereof; and a solder powder consisting primarily of tin. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux.
摘要翻译： 在第二次或随后的回流加热阶段，金属不会从接点流出。 所述焊膏在室温和高温下表现出高接合强度，在时间稳定性方面优异，空隙形成最少，并且可形成高度内聚的接合部。 所述焊膏包括粉末状金属组分和助焊剂组分，所述粉末状金属组分包括以下组分：粉末状金属间化合物，其包含铜和锡，并具有覆盖其表面的金属阻挡层; 和主要由锡组成的焊料粉末。 粉末状金属间化合物和焊料粉末都不含有纯铜相，抑制了铜离子向焊剂中的溶出。
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公开(公告)号：EP3000555B1
公开(公告)日：2020-04-22
申请号：EP14783264.6
申请日：2014-03-28
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公开(公告)号：EP3000554B1
公开(公告)日：2020-01-22
申请号：EP14782314.0
申请日：2014-03-28
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公开(公告)号：EP3000554A1
公开(公告)日：2016-03-30
申请号：EP14782314.0
申请日：2014-03-28
发明人： KOROKI, Motoki , YOSHIKAWA, Shunsaku , OKADA, Sakie , ITOYAMA, Taro , KOMURO, Hideyuki , HIRAI, Naoko , SHIMIZU, Keitaro
CPC分类号： B23K35/262 , B22F1/0003 , B22F1/0059 , B22F7/062 , B22F7/08 , B22F2301/10 , B22F2301/30 , B22F2302/45 , B22F2304/10 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/22 , B23K35/26 , B23K35/302 , B23K35/362 , C22C1/0483 , C22C1/0491 , C22C9/02 , C22C12/00 , C22C13/00 , C22C13/02 , C23C18/16 , C23C18/1637 , C25D7/00 , H05K1/0298 , H05K1/09
摘要： A solder paste whereby metal does not flow out of a joint during a second or subsequent reflow heating stage. Said solder paste excels in terms of temporal stability and exhibits high joint strength at room temperature and at high temperatures. Said solder paste comprises a powdered metal component and a flux component, said powdered metal component comprising the following: 10-70 mass% of a powdered intermetallic compound comprising copper and tin; and 30-90 mass% of a solder powder consisting primarily of tin. Neither the powdered intermetallic compound nor the solder powder contains a copper-only phase, inhibiting the elution of copper ions into the flux.
摘要翻译： 在第二次或随后的回流加热阶段，金属不会从接点流出。 所述焊膏在时间稳定性方面优异并且在室温和高温下表现出高接合强度。 所述焊膏包含粉末金属组分和助焊剂组分，所述粉末金属组分包含以下组分：10-70质量％的包含铜和锡的粉末金属间化合物; 和30-90质量％的主要由锡组成的焊料粉末。 粉末状金属间化合物和焊料粉末都不含有纯铜相，抑制了铜离子向焊剂中的溶出。
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