摘要:
A plurality of bit lines (6) are isolated from one another by a layered dielectric structure to provide a planar architecture onto which an optional conductive layer may be deposited. The dielectric structure deposited with the method proposed in the instant Patent Application uses a highly planarizing dielectric layer (18) of the SOG type spun over a first insulating dielectric layer (17) and then solidified by means of a thermal polymerization process. The dielectric layers (17,18) are subjected to a etch-back treatment and to a subsequent thermal annealing treatment.
摘要:
Self-aligned etching process for providing a plurality of mutually parallel word lines in a first conducting layer (11,12) deposited over a planarized architecture (9) obtained starting from a semiconductor substrate (1) on which is provided a plurality of active elements extending along separate parallel lines e.g. memory cell bit lines (13) and comprising gate regions made up of a first conducting layer (4), an intermediate dielectric layer (5) and a second conducting layer (6) with said regions being insulated from each other by insulation regions (7,8) to form said architecture (9) with said word lines being defined photolithographically by protective strips implemented by means of:
a vertical profile etching for complete removal from the unprotected areas of the first conducting layer (11,12), of the second conducting layer (6) and of the intermediate dielectric layer (5) respectively, and a following isotropic etching of the first conducting layer (4).
摘要:
The process proposed allows provision of a matrix topography for electronic memory devices using self-alignment etchings capable of removing those spurious electrical contacts between adjacent memory cells. The self-aligned etching process proposed for providing a plurality of mutually parallel word lines in a first conducting layer (11,12) deposited over a planarized architecture (9) obtained starting from a semiconductor substrate (1) on which is provided a plurality of active elements extending along separate parallel lines e.g. memory cell bit lines (13) and comprising gate regions formed by a first conducting layer (4), a dielectric interpoly layer (5) and a second conducting layer (6) with said regions being insulated from each other by dielectric insulation films(7,8) to form said architecture (9) with said word lines being defined photolithographically by protective strips is implemented by means of:
a vertical profile etching for complete removal from the unprotected areas respectively of the first conducting layer (11,12), of the second conducting layer (6) of the gate region, a successive etching of the dielectric interpoly layer (5) accompanied by a considerable erosion of the dielectric film (8) of the insulation region so as to totally uncover the first conducting layer (4), and a concluding etching of the first conducting layer (4).
摘要:
An electronic memory device organized into sections which are in turn divided into blocks (1) formed of cells (3) and their associated decoding and addressing circuits (2), the cells being connected in a predetermined circuit configuration and each block being included between two opposite contact regions (4) which are interconnected by parallel continuous conduction lines referred to as the bit lines (7) . In the present invention, at least one interruption is provided in each bit line (7) near a contact region (4) by inserting a controlled switch (9) which functions as a block selector (8). Advantageously, the proposed solution allows each block to be isolated individually by enabling or disabling as appropriate the switches (9) of the cascade connected blocks (1). Also provided is a method of implementing the memory block (1), as organized into a matrix-like configuration, individually selectable from a plurality of blocks embedded in a memory device, wherein each memory cell (3) is identified by a continuous bit line (7) enabled by at least one block selector (8), by a broken bit line or 'segment' (13) connected to the continuous one (7) through an address device (2), and by a word line orthogonal to the direction of the bit lines, and formed on a substrate having a first type fo conductivity.
摘要:
A method of depositing a dielectric ply structure to optimize the planarity of electronic devices which include a plurality of active elements having gate regions laid across the substrate as discrete parallel lines, such as the bit lines of memory cells. The proposed solution in accordance with the principles of this invention allows the plurality of bit lines to be isolated from one another by a suitable dielectric ply structure to provide a planar architecture onto which an optional conductive layer may be deposited. A plurality of word lines can be formed from the conductive layer by conventional photolithographic and dry-wet etching processes. These lines intersect the plurality of bit lines to define a plurality of EPROM cells organized into a matrix-like topography. The resulting planarization is adequate to avoid the typical shortcomings of the prior art, such as the lack of electrical continuity in the word lines or their excessively high electrical resistance from slenderized portions in the conductive sections due to poor planarity of the surfaces whereon the conductive layer is deposited.
摘要:
An electronic memory device organized into sections which are in turn divided into blocks (1) formed of cells (3) and their associated decoding and addressing circuits (2), the cells being connected in a predetermined circuit configuration and each block being included between two opposite contact regions (4) which are interconnected by parallel continuous conduction lines referred to as the bit lines (7) . In the present invention, at least one interruption is provided in each bit line (7) near a contact region (4) by inserting a controlled switch (9) which functions as a block selector (8). Advantageously, the proposed solution allows each block to be isolated individually by enabling or disabling as appropriate the switches (9) of the cascade connected blocks (1). Also provided is a method of implementing the memory block (1), as organized into a matrix-like configuration, individually selectable from a plurality of blocks embedded in a memory device, wherein each memory cell (3) is identified by a continuous bit line (7) enabled by at least one block selector (8), by a broken bit line or 'segment' (13) connected to the continuous one (7) through an address device (2), and by a word line orthogonal to the direction of the bit lines, and formed on a substrate having a first type fo conductivity.