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公开(公告)号：EP0574092B1
公开(公告)日：1997-12-17
申请号：EP93202205.6
申请日：1988-09-30
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公开(公告)号：EP0310412A3
公开(公告)日：1990-08-01
申请号：EP88309089.6
申请日：1988-09-30
发明人： Ohta, Kenji , Hirokane, Junji , Shibata, Akira , Van, Kazuo , Inui, Tetsuya , Nagahara, Yoshiyuki , Mieda, Michinobu
摘要： The invention relates to photo-masks which comprise a light-permeable substrate (1) and a plurality of light-shielding films (2) that are disposed on the substrate (1), the light-shielding films (2) forming a mask pattern. In one embodiment, a light-permeable protective film (3) is disposed over the surface of the substrate (1) including the light-shielding films (2) so as to protect the light-shielding films (2). In another embodiment the light-shielding films (2) are buried in the substrate (1) so that the outer surface of each of the light-shielding films (2) is either above or below the surface of the substrate (1). The light-shielding films (2) may be made of an electrically conductive material or of a dielectric substance.
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公开(公告)号：EP0310412B1
公开(公告)日：1994-04-13
申请号：EP88309089.6
申请日：1988-09-30
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公开(公告)号：EP0319350A3
公开(公告)日：1990-08-16
申请号：EP88311517.2
申请日：1988-12-05
IPC分类号： G11B7/26
CPC分类号： G11B7/261 , Y10S428/913
摘要： A method of and a photomask (15) for manufacturing an optical memory element. The manufacturing method includes the steps of: subjecting a positive type photoresist (20) coated on a glass substrate (19) to exposure by using the photomask (15) capable of irradiating light onto a portion of the photoresist (20) other than the remaining portion for forming pits (21) of the glass substrate (19) such that the portion of the photoresist (20) is solubilized against developing solution; developing the photoresist (20) by using the developing solution so as to remove the portion of the photoresist (20); and etching the glass substrate (19) so as to directly form, as convex portions, the pits (21) on a surface of the glass substrate (19).
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公开(公告)号：EP0574092A1
公开(公告)日：1993-12-15
申请号：EP93202205.6
申请日：1988-09-30
发明人： Ohta, Kenji , Hirokane, Junji , Shibata, Akira , Van, Kazuo , Inui, Tetsuya , Nagahara, Yoshiyuki , Mieda, Michinobu
摘要： The invention relates to photo-masks which comprise a light-permeable substrate (1) and a plurality of light-shielding films (2) that are disposed on the substrate (1), the light-shielding films (2) forming a mask pattern, characterized in that the photo-mask further comprises a light-permeable protective film (3) which covers the surfaces of the substrate (1) and the light-shielding films (2), the light-permeable films (3) being made of a conductive substance.
摘要翻译： 本发明涉及一种光掩模，其包括设置在基板（1）上的透光基板（1）和多个遮光膜（2），遮光膜（2）形成掩模图案 其特征在于，所述光掩模还包括覆盖所述基板（1）和所述遮光膜（2）的表面的透光保护膜（3），所述透光膜（3）由 导电物质。
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公开(公告)号：EP0319350B1
公开(公告)日：1993-07-14
申请号：EP88311517.2
申请日：1988-12-05
IPC分类号： G11B7/26
CPC分类号： G11B7/261 , Y10S428/913
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7.发明公开Method of and photomask for manufacturing optical memory element 失效Verfahren und Photomaske zur Herstellung eines optischen Speicherelementes。
公开(公告)号：EP0319350A2
公开(公告)日：1989-06-07
申请号：EP88311517.2
申请日：1988-12-05
IPC分类号： G11B7/26
CPC分类号： G11B7/261 , Y10S428/913
摘要： A method of and a photomask (15) for manufacturing an optical memory element. The manufacturing method includes the steps of: subjecting a positive type photoresist (20) coated on a glass substrate (19) to exposure by using the photomask (15) capable of irradiating light onto a portion of the photoresist (20) other than the remaining portion for forming pits (21) of the glass substrate (19) such that the portion of the photoresist (20) is solubilized against developing solution; developing the photoresist (20) by using the developing solution so as to remove the portion of the photoresist (20); and etching the glass substrate (19) so as to directly form, as convex portions, the pits (21) on a surface of the glass substrate (19).
摘要翻译： 一种用于制造光学存储元件的光掩模（15）的方法和光掩模。 该制造方法包括以下步骤：通过使用能够将光照射到除了剩余的光致抗蚀剂（20）的一部分上的光的光掩模（15），使涂覆在玻璃基板（19）上的正型光致抗蚀剂（20）曝光 用于形成所述玻璃基板（19）的凹坑（21）的部分，使得所述光致抗蚀剂（20）的所述部分与显影液溶解; 通过使用显影溶液来显影光致抗蚀剂（20），以去除光致抗蚀剂（20）的部分; 并且在所述玻璃基板（19）的表面上刻蚀所述玻璃基板（19）以便直接形成所述凹坑（21）作为凸部。
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公开(公告)号：EP0310412A2
公开(公告)日：1989-04-05
申请号：EP88309089.6
申请日：1988-09-30
发明人： Ohta, Kenji , Hirokane, Junji , Shibata, Akira , Van, Kazuo , Inui, Tetsuya , Nagahara, Yoshiyuki , Mieda, Michinobu
摘要： The invention relates to photo-masks which comprise a light-permeable substrate (1) and a plurality of light-shielding films (2) that are disposed on the substrate (1), the light-shielding films (2) forming a mask pattern. In one embodiment, a light-permeable protective film (3) is disposed over the surface of the substrate (1) including the light-shielding films (2) so as to protect the light-shielding films (2). In another embodiment the light-shielding films (2) are buried in the substrate (1) so that the outer surface of each of the light-shielding films (2) is either above or below the surface of the substrate (1). The light-shielding films (2) may be made of an electrically conductive material or of a dielectric substance.
摘要翻译： 本发明涉及一种光掩模，其包括设置在基板（1）上的透光基板（1）和多个遮光膜（2），遮光膜（2）形成掩模图案 。 在一个实施例中，透光保护膜（3）设置在包括遮光膜（2）的基板（1）的表面上，以保护遮光膜（2）。 在另一个实施例中，遮光膜（2）被埋在基板（1）中，使得每个遮光膜（2）的外表面在基板（1）的表面上方或下方。 遮光膜（2）可以由导电材料或电介质材料制成。
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