公开(公告)号：EP0178864A3

公开(公告)日：1987-09-30

申请号：EP85307304

申请日：1985-10-11

申请人： SHIKOKU CHEMICALS CORPORATION

发明人： Tsukagoshi, Minoru ,  Nakayama, Takuo ,  Minagawa, Masahiko ,  Yoshida, Shuji

IPC分类号： H05K03/42 ,  C23F01/02 ,  C23F11/14

CPC分类号： C23F11/149 ,  C23C22/52 ,  C23F1/02 ,  H05K3/0094 ,  H05K3/061 ,  H05K3/427 ,  H05K2201/09581 ,  H05K2203/0582 ,  H05K2203/0591 ,  H05K2203/0769 ,  H05K2203/0786 ,  H05K2203/124

摘要： Disclosed is a process for producing a copper through-hole printed circuit board, which comprises forming a required pattern on a copper-clad laminated plate using a resist ink soluble in an alkaline aqueous solution, immersing the copper-clad laminated plate in an aqueous solution of a salt or an alkylimidazole compound represented by the following general formula
wherein R 2 represents an alkyl group having 5 to 21 carbon atoms, R 4 represents a hydrogen atom or a methyl group, and HA represents an organic or inorganic acid,
to form on the copper surface of the copper-clad laminated plate an etching resist film composed of the alkylimidazole compound, drying the resulting copper-clad laminated plate, and then treating it with an alkaline etching solution.

公开(公告)号：EP0178864B1

公开(公告)日：1991-04-03

申请号：EP85307304.7

申请日：1985-10-11

申请人： SHIKOKU CHEMICALS CORPORATION

发明人： Tsukagoshi, Minoru ,  Nakayama, Takuo ,  Minagawa, Masahiko ,  Yoshida, Shuji

IPC分类号： H05K3/42 ,  C23F1/02 ,  C23F11/14

CPC分类号： C23F11/149 ,  C23C22/52 ,  C23F1/02 ,  H05K3/0094 ,  H05K3/061 ,  H05K3/427 ,  H05K2201/09581 ,  H05K2203/0582 ,  H05K2203/0591 ,  H05K2203/0769 ,  H05K2203/0786 ,  H05K2203/124

公开(公告)号：EP0364132A1

公开(公告)日：1990-04-18

申请号：EP89309866.5

申请日：1989-09-28

申请人： SHIKOKU CHEMICALS CORPORATION

发明人： Matsubara, Susumu ,  Yoshida, Shuji ,  Minagawa, Masahiko ,  Tachibana, Daikichi ,  Kodama, Hiroki

IPC分类号： C23F11/14 ,  C23C22/52

CPC分类号： H05K3/282 ,  C23C22/52 ,  C23F11/08 ,  C23F11/149

摘要： A process for the formation of a chemical conversion coating on the surface of copper or a copper alloy comprises contacting the metal surface with an aqueous solution containing an imidazole compound having an alkyl group having 5 to 21 carbon atoms at the 2-position, wherein a substance capable of generating a copper ion or zinc ion is dissolved and contained in the aqueous solution containing the alkylimidazole compound.

摘要翻译： 一种用于化学转化涂层的铜的表面或铜合金上形成方法包括在wässrige溶液含有咪唑化合物的具有在2位上具有5〜21个碳原子的烷基，worin接触的金属表面的 能够产生铜离子或锌离子的物质溶解和包含在溶液中含wässrige的烷基咪唑化合物。

公开(公告)号：EP0178864A2

公开(公告)日：1986-04-23

申请号：EP85307304.7

申请日：1985-10-11

申请人： SHIKOKU CHEMICALS CORPORATION

发明人： Tsukagoshi, Minoru ,  Nakayama, Takuo ,  Minagawa, Masahiko ,  Yoshida, Shuji

IPC分类号： H05K3/42 ,  C23F1/02 ,  C23F11/14

CPC分类号： C23F11/149 ,  C23C22/52 ,  C23F1/02 ,  H05K3/0094 ,  H05K3/061 ,  H05K3/427 ,  H05K2201/09581 ,  H05K2203/0582 ,  H05K2203/0591 ,  H05K2203/0769 ,  H05K2203/0786 ,  H05K2203/124

摘要： Disclosed is a process for producing a copper through-hole printed circuit board, which comprises forming a required pattern on a copper-clad laminated plate using a resist ink soluble in an alkaline aqueous solution, immersing the copper-clad laminated plate in an aqueous solution of a salt or an alkylimidazole compound represented by the following general formula
wherein R 2 represents an alkyl group having 5 to 21 carbon atoms, R 4 represents a hydrogen atom or a methyl group, and HA represents an organic or inorganic acid,
to form on the copper surface of the copper-clad laminated plate an etching resist film composed of the alkylimidazole compound, drying the resulting copper-clad laminated plate, and then treating it with an alkaline etching solution.